Reynaldo Co

Person

Scotts Valley, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Package-on-package assembly with wire bond vias
- Patent number 11,735,563
- Issue date Aug 22, 2023
- Invensas LLC
- Ellis Chau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package assembly with wire bond vias
- Patent number 11,189,595
- Issue date Nov 30, 2021
- Invensas Corporation
- Ellis Chau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pressing of wire bond wire tips to provide bent-over tips
- Patent number 10,806,036
- Issue date Oct 13, 2020
- Invensas Corporation
- Reynaldo Co
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package assembly with wire bond vias
- Patent number 10,756,049
- Issue date Aug 25, 2020
- Invensas Corporation
- Ellis Chau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
BVA interposer
- Patent number 10,297,582
- Issue date May 21, 2019
- Invensas Corporation
- Terrence Caskey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bond support structure and microelectronic package including w...
- Patent number 9,947,641
- Issue date Apr 17, 2018
- Invensas Corporation
- Reynaldo Co
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Off substrate kinking of bond wire
- Patent number 9,893,033
- Issue date Feb 13, 2018
- Invensas Corporation
- Belgacem Haba
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Pressing of wire bond wire tips to provide bent-over tips
- Patent number 9,888,579
- Issue date Feb 6, 2018
- Invensas Corporation
- Reynaldo Co
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Flipped die stack
- Patent number 9,825,002
- Issue date Nov 21, 2017
- Invensas Corporation
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ball bonding metal wire bond wires to metal pads
- Patent number 9,761,554
- Issue date Sep 12, 2017
- Invensas Corporation
- Willmar Subido
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package assembly with wire bond vias
- Patent number 9,761,558
- Issue date Sep 12, 2017
- Invensas Corporation
- Ellis Chau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for package-on-package assembly with wire bonds to encapsula...
- Patent number 9,691,679
- Issue date Jun 27, 2017
- Invensas Corporation
- Reynaldo Co
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assembly for microelectronic packaging with bond el...
- Patent number 9,615,456
- Issue date Apr 4, 2017
- Invensas Corporation
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coupling of side surface contacts to a circuit platform
- Patent number 9,530,749
- Issue date Dec 27, 2016
- Invensas Corporation
- Reynaldo Co
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical connector between die pad and z-interconnect for stacked...
- Patent number 9,508,689
- Issue date Nov 29, 2016
- Invensas Corporation
- Reynaldo Co
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
BVA interposer
- Patent number 9,502,390
- Issue date Nov 22, 2016
- Invensas Corporation
- Terrence Caskey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bond support structure and microelectronic package including w...
- Patent number 9,412,714
- Issue date Aug 9, 2016
- Invensas Corporation
- Reynaldo Co
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for package-on-package assembly with wire bonds to encapsula...
- Patent number 9,349,706
- Issue date May 24, 2016
- Invensas Corporation
- Reynaldo Co
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package-on-package assembly with wire bond vias
- Patent number 9,252,122
- Issue date Feb 2, 2016
- Invensas Corporation
- Ellis Chau
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical connector between die pad and z-interconnect for stacked...
- Patent number 9,153,517
- Issue date Oct 6, 2015
- Invensas Corporation
- Reynaldo Co
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package assembly with wire bond vias
- Patent number 9,105,483
- Issue date Aug 11, 2015
- Invensas Corporation
- Ellis Chau
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Structure for microelectronic packaging with bond elements to encap...
- Patent number 9,095,074
- Issue date Jul 28, 2015
- Invensas Corporation
- Belgacem Haba
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Off substrate kinking of bond wire
- Patent number 9,087,815
- Issue date Jul 21, 2015
- Invensas Corporation
- Belgacem Haba
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Severing bond wire by kinking and twisting
- Patent number 9,082,753
- Issue date Jul 14, 2015
- Invensas Corporation
- Belgacem Haba
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package-on-package assembly with wire bond vias
- Patent number 9,041,227
- Issue date May 26, 2015
- Invensas Corporation
- Ellis Chau
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor die array structure
- Patent number 8,884,403
- Issue date Nov 11, 2014
- Iinvensas Corporation
- Reynaldo Co
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure for microelectronic packaging with bond elements to encap...
- Patent number 8,878,353
- Issue date Nov 4, 2014
- Invensas Corporation
- Belgacem Haba
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package-on-package assembly with wire bond vias
- Patent number 8,836,136
- Issue date Sep 16, 2014
- Invensas Corporation
- Ellis Chau
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for package-on-package assembly with wire bonds to encapsula...
- Patent number 8,772,152
- Issue date Jul 8, 2014
- Invensas Corporation
- Reynaldo Co
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical interconnect for die stacked in zig-zag configuration
- Patent number 8,680,687
- Issue date Mar 25, 2014
- Invensas Corporation
- Reynaldo Co
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS
- Publication number 20240055393
- Publication date Feb 15, 2024
- Invensas LLC
- Ellis Chau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS
- Publication number 20220165703
- Publication date May 26, 2022
- Invensas Corporation
- Ellis Chau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package-on-package Assembly With Wire Bond Vias
- Publication number 20210035948
- Publication date Feb 4, 2021
- Invensas Corporation
- Ellis Chau
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
Pressing of Wire Bond Wire Tips to Provide Bent-Over Tips
- Publication number 20180146557
- Publication date May 24, 2018
- Invensas Corporation
- Reynaldo CO
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS
- Publication number 20180026007
- Publication date Jan 25, 2018
- Invensas Corporation
- Ellis Chau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIPPED DIE STACK
- Publication number 20170018529
- Publication date Jan 19, 2017
- Invensas Corporation
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BALL BONDING METAL WIRE BOND WIRES TO METAL PADS
- Publication number 20160329294
- Publication date Nov 10, 2016
- Invensas Corporation
- Willmar SUBIDO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BOND SUPPORT STRUCTURE AND MICROELECTRONIC PACKAGE INCLUDING W...
- Publication number 20160329308
- Publication date Nov 10, 2016
- Invensas Corporation
- Reynaldo Co
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COUPLING OF SIDE SURFACE CONTACTS TO A CIRCUIT PLATFORM
- Publication number 20160322325
- Publication date Nov 3, 2016
- Invensas Corporation
- Reynaldo CO
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BONDS TO ENCAPSULA...
- Publication number 20160260647
- Publication date Sep 8, 2016
- Invensas Corporation
- Reynaldo Co
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRESSING OF WIRE BOND WIRE TIPS TO PROVIDE BENT-OVER TIPS
- Publication number 20160262268
- Publication date Sep 8, 2016
- Invensas Corporation
- Reynaldo CO
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
OFF SUBSTRATE KINKING OF BOND WIRE
- Publication number 20160225739
- Publication date Aug 4, 2016
- Invensas Corporation
- Belgacem Haba
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BVA INTERPOSER
- Publication number 20160079214
- Publication date Mar 17, 2016
- Invensas Corporation
- Terrence Caskey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL CONNECTOR BETWEEN DIE PAD AND Z-INTERCONNECT FOR STACKED...
- Publication number 20160027761
- Publication date Jan 28, 2016
- Invensas Corporation
- Reynaldo Co
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BOND SUPPORT STRUCTURE AND MICROELECTRONIC PACKAGE INCLUDING W...
- Publication number 20150348928
- Publication date Dec 3, 2015
- Invensas Corporation
- Reynaldo Co
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE FOR MICROELECTRONIC PACKAGING WITH BOND ELEMENTS TO ENCAP...
- Publication number 20150334831
- Publication date Nov 19, 2015
- Invensas Corporation
- Belgacem Haba
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS
- Publication number 20150255424
- Publication date Sep 10, 2015
- Invensas Corporation
- Ellis Chau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEVERING BOND WIRE BY KINKING AND TWISTING
- Publication number 20150129647
- Publication date May 14, 2015
- Invensas Corporation
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OFF SUBSTRATE KINKING OF BOND WIRE
- Publication number 20150129646
- Publication date May 14, 2015
- Invensas Corporation
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE FOR MICROELECTRONIC PACKAGING WITH BOND ELEMENTS TO ENCAP...
- Publication number 20150034371
- Publication date Feb 5, 2015
- Invensas Corporation
- Belgacem Haba
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BONDS TO ENCAPSULA...
- Publication number 20150017765
- Publication date Jan 15, 2015
- Invensas Corporation
- Reynaldo Co
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE FOR MICROELECTRONIC PACKAGING WITH BOND ELEMENTS TO ENCAP...
- Publication number 20140175671
- Publication date Jun 26, 2014
- Invensas Corporation
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BVA INTERPOSER
- Publication number 20140036454
- Publication date Feb 6, 2014
- Invensas Corporation
- Terrence Caskey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS
- Publication number 20130328219
- Publication date Dec 12, 2013
- Invensas Corporation
- Ellis Chau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BONDS TO ENCAPSULA...
- Publication number 20130224914
- Publication date Aug 29, 2013
- Invensas Corporation
- Reynaldo Co
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS
- Publication number 20130200533
- Publication date Aug 8, 2013
- Invensas Corporation
- Ellis Chau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS
- Publication number 20130095610
- Publication date Apr 18, 2013
- Invensas Corporation
- Ellis Chau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS
- Publication number 20130093087
- Publication date Apr 18, 2013
- Invensas Corporation
- Ellis Chau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS
- Publication number 20130093088
- Publication date Apr 18, 2013
- Invensas Corporation
- Ellis Chau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electrical Connector Between Die Pad and Z-Interconnect for Stacked...
- Publication number 20120119385
- Publication date May 17, 2012
- Vertical Circuits, Inc.
- Reynaldo Co
- H01 - BASIC ELECTRIC ELEMENTS

Reynaldo Co

Person

Patents Grantslast 30 patents

Package-on-package assembly with wire bond vias

Package-on-package assembly with wire bond vias

Pressing of wire bond wire tips to provide bent-over tips

Package-on-package assembly with wire bond vias

BVA interposer

Wire bond support structure and microelectronic package including w...

Off substrate kinking of bond wire

Pressing of wire bond wire tips to provide bent-over tips

Flipped die stack

Ball bonding metal wire bond wires to metal pads

Package-on-package assembly with wire bond vias

Method for package-on-package assembly with wire bonds to encapsula...

Microelectronic assembly for microelectronic packaging with bond el...

Coupling of side surface contacts to a circuit platform

Electrical connector between die pad and z-interconnect for stacked...

BVA interposer

Wire bond support structure and microelectronic package including w...

Method for package-on-package assembly with wire bonds to encapsula...

Package-on-package assembly with wire bond vias

Electrical connector between die pad and z-interconnect for stacked...

Package-on-package assembly with wire bond vias

Structure for microelectronic packaging with bond elements to encap...

Off substrate kinking of bond wire

Severing bond wire by kinking and twisting

Package-on-package assembly with wire bond vias

Semiconductor die array structure

Structure for microelectronic packaging with bond elements to encap...

Package-on-package assembly with wire bond vias

Method for package-on-package assembly with wire bonds to encapsula...

Electrical interconnect for die stacked in zig-zag configuration

Patents Applicationslast 30 patents

PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS

PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS

Package-on-package Assembly With Wire Bond Vias

Pressing of Wire Bond Wire Tips to Provide Bent-Over Tips

PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS

FLIPPED DIE STACK

BALL BONDING METAL WIRE BOND WIRES TO METAL PADS

WIRE BOND SUPPORT STRUCTURE AND MICROELECTRONIC PACKAGE INCLUDING W...

COUPLING OF SIDE SURFACE CONTACTS TO A CIRCUIT PLATFORM

METHOD FOR PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BONDS TO ENCAPSULA...

PRESSING OF WIRE BOND WIRE TIPS TO PROVIDE BENT-OVER TIPS

OFF SUBSTRATE KINKING OF BOND WIRE

BVA INTERPOSER

ELECTRICAL CONNECTOR BETWEEN DIE PAD AND Z-INTERCONNECT FOR STACKED...

WIRE BOND SUPPORT STRUCTURE AND MICROELECTRONIC PACKAGE INCLUDING W...

STRUCTURE FOR MICROELECTRONIC PACKAGING WITH BOND ELEMENTS TO ENCAP...

PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS

SEVERING BOND WIRE BY KINKING AND TWISTING

OFF SUBSTRATE KINKING OF BOND WIRE

STRUCTURE FOR MICROELECTRONIC PACKAGING WITH BOND ELEMENTS TO ENCAP...

METHOD FOR PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BONDS TO ENCAPSULA...

STRUCTURE FOR MICROELECTRONIC PACKAGING WITH BOND ELEMENTS TO ENCAP...

BVA INTERPOSER

PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS

METHOD FOR PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BONDS TO ENCAPSULA...

PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS

PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS

PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS

PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS

Electrical Connector Between Die Pad and Z-Interconnect for Stacked...