Teck-Gyu Kang

Person

San Jose, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Package-on-package assembly with wire bonds to encapsulation surface
- Patent number 11,830,845
- Issue date Nov 28, 2023
- TESSERA LLC
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package assembly with wire bonds to encapsulation surface
- Patent number 11,424,211
- Issue date Aug 23, 2022
- TESSERA LLC
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package assembly with wire bonds to encapsulation surface
- Patent number 10,833,044
- Issue date Nov 10, 2020
- Tessera, Inc.
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package assembly with wire bonds to encapsulation surface
- Patent number 10,593,643
- Issue date Mar 17, 2020
- Tessera, Inc.
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package assembly with wire bonds to encapsulation surface
- Patent number 10,062,661
- Issue date Aug 28, 2018
- Tessera, Inc.
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for making a microelectronic assembly having conductive elem...
- Patent number 9,984,901
- Issue date May 29, 2018
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip assembly and method for making same
- Patent number 9,716,075
- Issue date Jul 25, 2017
- Tessera, Inc.
- Teck-Gyu Kang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package-on-package assembly with wire bonds to encapsulation surface
- Patent number 9,691,731
- Issue date Jun 27, 2017
- Tessera, Inc.
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package assembly with wire bonds to encapsulation surface
- Patent number 9,224,717
- Issue date Dec 29, 2015
- Tessera, Inc.
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic packages and methods therefor
- Patent number 9,218,988
- Issue date Dec 22, 2015
- Tessera, Inc.
- Belgacem Haba
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor chip assembly and method for making same
- Patent number 9,137,903
- Issue date Sep 15, 2015
- Tessera, Inc.
- Teck-Gyu Kang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package-on-package assembly with wire bonds to encapsulation surface
- Patent number 9,093,435
- Issue date Jul 28, 2015
- Tessera, Inc.
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip overmold package
- Patent number 9,054,023
- Issue date Jun 9, 2015
- Altera Corporation
- Teck-Gyu Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package assembly with wire bonds to encapsulation surface
- Patent number 8,969,133
- Issue date Mar 3, 2015
- Tessera, Inc.
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic packages and methods therefor
- Patent number 8,728,865
- Issue date May 20, 2014
- Tessera, Inc.
- Belgacem Haba
- G01 - MEASURING TESTING
Information Patent Grant
Electronic package with fluid flow barriers
- Patent number 8,710,643
- Issue date Apr 29, 2014
- Altera Corporation
- Teck-Gyu Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fine pitch microcontacts and method for forming thereof
- Patent number 8,641,913
- Issue date Feb 4, 2014
- Tessera, Inc.
- Belgacem Haba
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package-on-package assembly with wire bonds to encapsulation surface
- Patent number 8,618,659
- Issue date Dec 31, 2013
- Tessera, Inc.
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a connection component with posts and pads
- Patent number 8,604,348
- Issue date Dec 10, 2013
- Tessera, Inc.
- Yoichi Kubota
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Micro pin grid array with pin motion isolation
- Patent number 8,531,039
- Issue date Sep 10, 2013
- Tessera, Inc.
- Philip Damberg
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flip chip overmold package
- Patent number 8,415,809
- Issue date Apr 9, 2013
- Altera Corporation
- Teck-Gyu Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level chip package and a method of fabricating thereof
- Patent number 8,378,487
- Issue date Feb 19, 2013
- Tessera, Inc.
- Teck-Gyu Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic packages and methods therefor
- Patent number 8,329,581
- Issue date Dec 11, 2012
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level chip package and a method of fabricating thereof
- Patent number 8,133,808
- Issue date Mar 13, 2012
- Tessera, Inc.
- Teck-Gyu Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package on package configurations with embedded solder balls and in...
- Patent number 8,125,066
- Issue date Feb 28, 2012
- Altera Corporation
- Teck-Gyu Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic packages and methods therefor
- Patent number 8,093,697
- Issue date Jan 10, 2012
- Tessera, Inc.
- Belgacem Haba
- G01 - MEASURING TESTING
Information Patent Grant
Microelectronic packages and methods therefor
- Patent number 8,058,101
- Issue date Nov 15, 2011
- Tessera, Inc.
- Belgacem Haba
- G01 - MEASURING TESTING
Information Patent Grant
Method of making a connection component with posts and pads
- Patent number 8,046,912
- Issue date Nov 1, 2011
- Tessera, Inc.
- Yoichi Kubota
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Microelectronic packages and methods therefor
- Patent number 7,999,397
- Issue date Aug 16, 2011
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and method of forming the same
- Patent number 7,883,937
- Issue date Feb 8, 2011
- Altera Corporation
- Teck-Gyu Kang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BONDS TO ENCAPSULATION SURFACE
- Publication number 20240203930
- Publication date Jun 20, 2024
- Adeia Semiconductor Solutions LLC
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BONDS TO ENCAPSULATION SURFACE
- Publication number 20220375891
- Publication date Nov 24, 2022
- TESSERA LLC
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package-On-Package Assembly With Wire Bonds To Encapsulation Surface
- Publication number 20210050322
- Publication date Feb 18, 2021
- Tessera, Inc.
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BONDS TO ENCAPSULATION SURFACE
- Publication number 20200168579
- Publication date May 28, 2020
- Tessera, Inc.
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BONDS TO ENCAPSULATION SURFACE
- Publication number 20180350766
- Publication date Dec 6, 2018
- Tessera, Inc.
- Hiroaki SATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor chip assembly and method for making same
- Publication number 20170309593
- Publication date Oct 26, 2017
- Tessera, Inc.
- Teck-Gyu KANG
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BONDS TO ENCAPSULATION SURFACE
- Publication number 20170287733
- Publication date Oct 5, 2017
- Tessera, Inc.
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC PACKAGES AND METHODS THEREFOR
- Publication number 20160056058
- Publication date Feb 25, 2016
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP ASSEMBLY AND METHOD FOR MAKING SAME
- Publication number 20160005711
- Publication date Jan 7, 2016
- Tessera, Inc.
- Teck-Gyu Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BONDS TO ENCAPSULATION SURFACE
- Publication number 20150091118
- Publication date Apr 2, 2015
- Tessera, Inc.
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC PACKAGES AND METHODS THEREFOR
- Publication number 20140213021
- Publication date Jul 31, 2014
- Tessera, Inc.
- Belgacem Haba
- G01 - MEASURING TESTING
Information Patent Application
FINE PITCH MICROCONTACTS AND METHOD FOR FORMING THEREOF
- Publication number 20140145329
- Publication date May 29, 2014
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BONDS TO ENCAPSULATION SURFACE
- Publication number 20130203216
- Publication date Aug 8, 2013
- Tessera, Inc.
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BONDS TO ENCAPSULATION SURFACE
- Publication number 20120280386
- Publication date Nov 8, 2012
- Tessera, Inc.
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REINFORCED FAN-OUT WAFER-LEVEL PACKAGE
- Publication number 20120268899
- Publication date Oct 25, 2012
- Tessera Research LLC
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP ASSEMBLY AND METHOD FOR MAKING SAME
- Publication number 20120155055
- Publication date Jun 21, 2012
- Tessera, Inc.
- Teck-Gyu Kang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WAFER LEVEL CHIP PACKAGE AND A METHOD OF FABRICATING THEREOF
- Publication number 20120126407
- Publication date May 24, 2012
- Tessera, Inc.
- Teck-Gyu Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC PACKAGES AND METHODS THEREFOR
- Publication number 20110269272
- Publication date Nov 3, 2011
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MAKING A CONNECTION COMPONENT WITH POSTS AND PADS
- Publication number 20110260320
- Publication date Oct 27, 2011
- Tessera, Inc.
- Yoichi Kubota
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic Package with Fluid Flow Barriers
- Publication number 20110204476
- Publication date Aug 25, 2011
- Altera Corporation
- Teck-Gyu Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC PACKAGES AND METHODS THEREFOR
- Publication number 20110165733
- Publication date Jul 7, 2011
- Tessera, Inc.
- Belgacem Haba
- G01 - MEASURING TESTING
Information Patent Application
MICROELECTRONIC PACKAGES AND METHODS THEREFOR
- Publication number 20100258956
- Publication date Oct 14, 2010
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC PACKAGES AND METHODS THEREFOR
- Publication number 20100232129
- Publication date Sep 16, 2010
- Tessera, Inc.
- Belgacem Haba
- G01 - MEASURING TESTING
Information Patent Application
MICRO PIN GRID ARRAY WITH PIN MOTION ISOLATION
- Publication number 20100193970
- Publication date Aug 5, 2010
- Tessera, Inc.
- Philip Damberg
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLIP CHIP OVERMOLD PACKAGE
- Publication number 20100001410
- Publication date Jan 7, 2010
- Teck-Gyu Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Components with posts and pads
- Publication number 20090133254
- Publication date May 28, 2009
- Tessera, Inc.
- Yoichi Kubota
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Microelectronic packages and methods therefor
- Publication number 20080185705
- Publication date Aug 7, 2008
- Tessera, Inc.
- Philip R. Osborn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Substrate for a flexible microelectronic assembly and a method of f...
- Publication number 20080128886
- Publication date Jun 5, 2008
- Tessera, Inc.
- Teck-Gyu Kang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Wafer level chip package and a method of fabricating thereof
- Publication number 20080067663
- Publication date Mar 20, 2008
- Tessera, Inc.
- Teck-Gyu Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fine pitch microcontacts and method for forming thereof
- Publication number 20080003402
- Publication date Jan 3, 2008
- Tessera, Inc.
- Belgacem Haba
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Teck-Gyu Kang

Person

Patents Grantslast 30 patents

Package-on-package assembly with wire bonds to encapsulation surface

Package-on-package assembly with wire bonds to encapsulation surface

Package-on-package assembly with wire bonds to encapsulation surface

Package-on-package assembly with wire bonds to encapsulation surface

Package-on-package assembly with wire bonds to encapsulation surface

Method for making a microelectronic assembly having conductive elem...

Semiconductor chip assembly and method for making same

Package-on-package assembly with wire bonds to encapsulation surface

Package-on-package assembly with wire bonds to encapsulation surface

Microelectronic packages and methods therefor

Semiconductor chip assembly and method for making same

Package-on-package assembly with wire bonds to encapsulation surface

Flip chip overmold package

Package-on-package assembly with wire bonds to encapsulation surface

Microelectronic packages and methods therefor

Electronic package with fluid flow barriers

Fine pitch microcontacts and method for forming thereof

Package-on-package assembly with wire bonds to encapsulation surface

Method of making a connection component with posts and pads

Micro pin grid array with pin motion isolation

Flip chip overmold package

Wafer level chip package and a method of fabricating thereof

Microelectronic packages and methods therefor

Wafer level chip package and a method of fabricating thereof

Package on package configurations with embedded solder balls and in...

Microelectronic packages and methods therefor

Microelectronic packages and methods therefor

Method of making a connection component with posts and pads

Microelectronic packages and methods therefor

Electronic package and method of forming the same

Patents Applicationslast 30 patents

PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BONDS TO ENCAPSULATION SURFACE

PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BONDS TO ENCAPSULATION SURFACE

Package-On-Package Assembly With Wire Bonds To Encapsulation Surface

PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BONDS TO ENCAPSULATION SURFACE

PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BONDS TO ENCAPSULATION SURFACE

Semiconductor chip assembly and method for making same

PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BONDS TO ENCAPSULATION SURFACE

MICROELECTRONIC PACKAGES AND METHODS THEREFOR

SEMICONDUCTOR CHIP ASSEMBLY AND METHOD FOR MAKING SAME

PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BONDS TO ENCAPSULATION SURFACE

MICROELECTRONIC PACKAGES AND METHODS THEREFOR

FINE PITCH MICROCONTACTS AND METHOD FOR FORMING THEREOF

PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BONDS TO ENCAPSULATION SURFACE

PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BONDS TO ENCAPSULATION SURFACE

REINFORCED FAN-OUT WAFER-LEVEL PACKAGE

SEMICONDUCTOR CHIP ASSEMBLY AND METHOD FOR MAKING SAME

WAFER LEVEL CHIP PACKAGE AND A METHOD OF FABRICATING THEREOF

MICROELECTRONIC PACKAGES AND METHODS THEREFOR

METHOD OF MAKING A CONNECTION COMPONENT WITH POSTS AND PADS

Electronic Package with Fluid Flow Barriers

MICROELECTRONIC PACKAGES AND METHODS THEREFOR

MICROELECTRONIC PACKAGES AND METHODS THEREFOR

MICROELECTRONIC PACKAGES AND METHODS THEREFOR

MICRO PIN GRID ARRAY WITH PIN MOTION ISOLATION

FLIP CHIP OVERMOLD PACKAGE

Components with posts and pads

Microelectronic packages and methods therefor

Substrate for a flexible microelectronic assembly and a method of f...

Wafer level chip package and a method of fabricating thereof

Fine pitch microcontacts and method for forming thereof