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Tracy V. Reynolds
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Boise, ID, US
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Patents Grants
last 30 patents
Information
Patent Grant
Computer modules with small thicknesses and associated methods of m...
Patent number
10,522,515
Issue date
Dec 31, 2019
Micron Technology, Inc.
Kevin Gibbons
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Computer modules with small thicknesses and associated methods of m...
Patent number
10,256,214
Issue date
Apr 9, 2019
Micron Technology, Inc.
Kevin Gibbons
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Computer modules with small thicknesses and associated methods of m...
Patent number
9,717,157
Issue date
Jul 25, 2017
Micron Technology, Inc.
Kevin Gibbons
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Packaged microdevices and methods for manufacturing packaged microd...
Patent number
8,987,885
Issue date
Mar 24, 2015
Micron Technology, Inc.
Stuart L. Roberts
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for assembling computer modules small in thickness
Patent number
8,959,759
Issue date
Feb 24, 2015
Micron Technology, Inc.
Kevin Gibbons
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Computer modules with small thicknesses and associated methods of m...
Patent number
8,644,030
Issue date
Feb 4, 2014
Micron Technology, Inc.
Kevin Gibbons
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Packaged microdevices and methods for manufacturing packaged microd...
Patent number
8,354,301
Issue date
Jan 15, 2013
Micron Technology, Inc.
Stuart L. Roberts
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bond pad rerouting element, rerouted semiconductor devices includin...
Patent number
7,944,057
Issue date
May 17, 2011
Round Rock Research, LLC
David J. Corisis
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Packaged microdevices and methods for manufacturing packaged microd...
Patent number
7,868,440
Issue date
Jan 11, 2011
Micron Technology, Inc.
Stuart L. Roberts
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bond pad rerouting element, rerouted semiconductor devices includin...
Patent number
7,851,922
Issue date
Dec 14, 2010
Round Rock Research, LLC
David J. Corisis
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bond pad rerouting element, rerouted semiconductor devices includin...
Patent number
7,423,336
Issue date
Sep 9, 2008
Micron Technology, Inc.
David J. Corisis
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Routing element for use in semiconductor device assemblies
Patent number
7,372,131
Issue date
May 13, 2008
Micron Technology, Inc.
David J. Corisis
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Routing element for use in multi-chip modules, multi-chip modules i...
Patent number
7,372,138
Issue date
May 13, 2008
Micron Technology, Inc.
David J. Corisis
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Methods for designing bond pad rerouting elements for use in stacke...
Patent number
7,282,397
Issue date
Oct 16, 2007
Micron Technology, Inc.
David J. Corisis
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bond pad rerouting element and stacked semiconductor device assembl...
Patent number
7,282,805
Issue date
Oct 16, 2007
Micron Technology, Inc.
David J. Corisis
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods for designing bond pad rerouting elements for use in stacke...
Patent number
7,094,631
Issue date
Aug 22, 2006
Micron Technology, Inc.
David J. Corisis
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods for fabricating routing elements for multichip modules
Patent number
6,995,043
Issue date
Feb 7, 2006
Micron Technology, Inc.
David J. Corisis
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method and apparatus for circuit completion through the use of ball...
Patent number
6,991,970
Issue date
Jan 31, 2006
Micron Technology, Inc.
Rich Fogal
G11 - INFORMATION STORAGE
Information
Patent Grant
Bond pad rerouting element and stacked semiconductor device assembl...
Patent number
6,987,325
Issue date
Jan 17, 2006
Micron Technology, Inc.
David J. Corisis
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Routing element for use in multi-chip modules, multi-chip modules i...
Patent number
6,882,034
Issue date
Apr 19, 2005
Micron Technology, Inc.
David J. Corisis
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Integrated circuit package alignment feature
Patent number
6,858,453
Issue date
Feb 22, 2005
Micron Technology, Inc.
David J. Corisis
G01 - MEASURING TESTING
Information
Patent Grant
Integrated circuit package alignment feature
Patent number
6,836,003
Issue date
Dec 28, 2004
Micron Technology, Inc.
David J. Corisis
G01 - MEASURING TESTING
Information
Patent Grant
Apparatus and method for providing mechanically pre-formed conducti...
Patent number
6,509,205
Issue date
Jan 21, 2003
Micron Technology, Inc.
Ronald W. Ellis
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Apparatus and method for providing mechanically pre-formed conducti...
Patent number
6,504,257
Issue date
Jan 7, 2003
Micron Technology, Inc.
Ronald W. Ellis
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Apparatus for forming wire bonds from circuitry on a substrate to a...
Patent number
6,474,532
Issue date
Nov 5, 2002
Micron Technology, Inc.
Michael Bettinger
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Apparatuses for forming wire bonds from circuitry on a substrate to...
Patent number
6,454,153
Issue date
Sep 24, 2002
Micron Technology, Inc.
Michael Bettinger
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Apparatus and method for providing mechanically pre-formed conducti...
Patent number
6,357,275
Issue date
Mar 19, 2002
Micron Technology, Inc.
Ronald W. Ellis
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit package including lead frame with electrically i...
Patent number
6,246,108
Issue date
Jun 12, 2001
Micron Technology, Inc.
David J. Corisis
G01 - MEASURING TESTING
Information
Patent Grant
Apparatus and method for providing mechanically pre-formed conducti...
Patent number
6,221,748
Issue date
Apr 24, 2001
Micron Technology, Inc.
Ronald W. Ellis
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Apparatuses for forming wire bonds from circuitry on a substrate to...
Patent number
6,199,743
Issue date
Mar 13, 2001
Micron Technology, Inc.
Michael Bettinger
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
Information
Patent Application
COMPUTER MODULES WITH SMALL THICKNESSES AND ASSOCIATED METHODS OF M...
Publication number
20190279964
Publication date
Sep 12, 2019
Micron Technology, Inc.
Kevin Gibbons
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
COMPUTER MODULES WITH SMALL THICKNESSES AND ASSOCIATED METHODS OF M...
Publication number
20170294414
Publication date
Oct 12, 2017
Micron Technology, Inc.
Kevin Gibbons
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
COMPUTER MODULES WITH SMALL THICKNESSES AND ASSOCIATED METHODS OF M...
Publication number
20150156908
Publication date
Jun 4, 2015
Micron Technology, Inc.
Kevin Gibbons
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
COMPUTER MODULES WITH SMALL THICKNESSES AND ASSOCIATED METHODS OF M...
Publication number
20140154844
Publication date
Jun 5, 2014
Micron Technology, Inc.
Kevin Gibbons
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGED MICRODEVICES AND METHODS FOR MANUFACTURING PACKAGED MICROD...
Publication number
20130193581
Publication date
Aug 1, 2013
Micron Technology, Inc.
Stuart L. Roberts
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR STACKING DIE IN THIN, SMALL-OUTLINE PACKAGE
Publication number
20110147910
Publication date
Jun 23, 2011
Micron Technology, Inc.
Tracy V. Reynolds
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGED MICRODEVICES AND METHODS FOR MANUFACTURING PACKAGED MICROD...
Publication number
20110104857
Publication date
May 5, 2011
Micron Technology, Inc.
Stuart L. Roberts
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
COMPUTER MODULES WITH SMALL THICKNESSES AND ASSOCIATED METHODS OF M...
Publication number
20100177490
Publication date
Jul 15, 2010
Micron Technology, Inc.
Kevin Gibbons
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
BOND PAD REROUTING ELEMENT, REROUTED SEMICONDUCTOR DEVICES INCLUDIN...
Publication number
20100078792
Publication date
Apr 1, 2010
Micron Technology, Inc.
David J. Corisis
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BOND PAD REROUTING ELEMENT, REROUTED SEMICONDUCTOR DEVICES INCLUDIN...
Publication number
20090008797
Publication date
Jan 8, 2009
Micron Technology, Inc.
David J. Corisis
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Packaged microdevices and methods for manufacturing packaged microd...
Publication number
20080048316
Publication date
Feb 28, 2008
Micron Technology, Inc.
Stuart L. Roberts
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Methods for designing bond pad rerouting elements for use in stacke...
Publication number
20060166404
Publication date
Jul 27, 2006
David J. Corisis
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method and apparatus for circuit completion through the use of ball...
Publication number
20060121650
Publication date
Jun 8, 2006
Rich Fogal
G11 - INFORMATION STORAGE
Information
Patent Application
Bond pad rerouting element and stacked semiconductor device assembl...
Publication number
20060113650
Publication date
Jun 1, 2006
David J. Corisis
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Routing element for use in semiconductor device assemblies
Publication number
20050156295
Publication date
Jul 21, 2005
David J. Corisis
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Routing element for use in multi-chip modules, multi-chip modules i...
Publication number
20050156293
Publication date
Jul 21, 2005
David J. Corisis
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Methods for designing bond pad rerouting elements for use in stacke...
Publication number
20040142506
Publication date
Jul 22, 2004
David J. Corisis
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Bond pad rerouting element and stacked semiconductor device assembl...
Publication number
20040036182
Publication date
Feb 26, 2004
David J. Corisis
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Bond pad rerouting element, rerouted semiconductor devices includin...
Publication number
20030189256
Publication date
Oct 9, 2003
David J. Corisis
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Routing element for use in multichip modules, multichip modules inc...
Publication number
20030067060
Publication date
Apr 10, 2003
David J. Corisis
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Routing element for use in multi-chip modules, multi-chip modules i...
Publication number
20030042585
Publication date
Mar 6, 2003
David J. Corisis
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method and apparatus for circuit completion through the use of ball...
Publication number
20030045026
Publication date
Mar 6, 2003
Rich Fogal
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Apparatuses for forming wire bonds from circuitry on a substrate to...
Publication number
20010035451
Publication date
Nov 1, 2001
Michael Bettinger
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Integrated circuit package alignment feature
Publication number
20010011762
Publication date
Aug 9, 2001
David J. Corisis
G01 - MEASURING TESTING
Information
Patent Application
Apparatus and method for providing mechanically pre-formed conducti...
Publication number
20010010944
Publication date
Aug 2, 2001
Ronald W. Ellis
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Apparatuses for forming wire bonds from circuitry on a substrate to...
Publication number
20010008247
Publication date
Jul 19, 2001
Michael Bettinger
H01 - BASIC ELECTRIC ELEMENTS