Tsukui Seiichiro

Person

Komoro, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 8,648,453
- Issue date Feb 11, 2014
- Renesas Electronics Corporation
- Minoru Shinohara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting structure for semiconductor parts and semiconductor device
- Patent number 7,265,446
- Issue date Sep 4, 2007
- Elpida Memory, Inc.
- Kensuke Tsuneda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and process for manufacturing the same
- Patent number 6,788,560
- Issue date Sep 7, 2004
- Hitachi, Ltd.
- Toshio Sugano
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor device, a semiconductor module loaded with said semic...
- Patent number 6,756,661
- Issue date Jun 29, 2004
- Hitachi, Ltd.
- Kensuke Tsuneda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and process for manufacturing the same
- Patent number 6,744,656
- Issue date Jun 1, 2004
- Hitachi, Ltd.
- Toshio Sugano
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor memory module having double-sided stacked memory chip...
- Patent number 6,693,346
- Issue date Feb 17, 2004
- Hitachi, Ltd.
- Watanabe Masayuki
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor memory module having double-sided stacked memory chip...
- Patent number 6,521,993
- Issue date Feb 18, 2003
- Hitachi, Ltd.
- Watanabe Masayuki
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor memory module having double-sided stacked memory chip...
- Patent number 6,424,030
- Issue date Jul 23, 2002
- Hitachi, Ltd.
- Watanabe Masayuki
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor device and process for manufacturing the same
- Patent number 6,288,924
- Issue date Sep 11, 2001
- Hitachi, Ltd.
- Toshio Sugano
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor memory module having double-sided memory chip layout
- Patent number 6,262,488
- Issue date Jul 17, 2001
- Hitachi Ltd.
- Watanabe Masayuki
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor device and process for manufacturing the same
- Patent number 6,215,687
- Issue date Apr 10, 2001
- Hitachi, Ltd.
- Toshio Sugano
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor memory module having double-sided stacked memory chip...
- Patent number 5,910,685
- Issue date Jun 8, 1999
- Hitachi Ltd.
- Masayuki Watanabe
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor integrated circuit device, and process and apparatus...
- Patent number 5,910,010
- Issue date Jun 8, 1999
- Hitachi, Ltd.
- Hirotaka Nishizawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device and memory module using the same
- Patent number 5,818,792
- Issue date Oct 6, 1998
- Hitachi, Ltd.
- Toshio Sasaki
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor memory module having double-sided stacked memory chip...
- Patent number 5,708,298
- Issue date Jan 13, 1998
- Hitachi Ltd.
- Watanabe Masayuki
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor memory device and memory module using the same
- Patent number 5,691,952
- Issue date Nov 25, 1997
- Hitachi, Ltd.
- Toshio Sasaki
- G11 - INFORMATION STORAGE
Information Patent Grant
Process for manufacturing a stacked integrated circuit package
- Patent number 5,587,341
- Issue date Dec 24, 1996
- Hitachi, Ltd.
- Watanabe Masayuki
- G11 - INFORMATION STORAGE
Information Patent Grant
Stacked semiconductor memory device and semiconductor memory module...
- Patent number 5,334,875
- Issue date Aug 2, 1994
- Hitachi, Ltd.
- Toshio Sugano
- G11 - INFORMATION STORAGE
Information Patent Grant
High packing density module board and electronic device having such...
- Patent number 5,220,491
- Issue date Jun 15, 1993
- Hitachi, Ltd.
- Toshio Sugano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor stacked device
- Patent number 5,198,888
- Issue date Mar 30, 1993
- Hitachi, Ltd.
- Toshio Sugano
- G11 - INFORMATION STORAGE
Information Patent Grant
Lead connections means for stacked tab packaged IC chips
- Patent number 5,138,438
- Issue date Aug 11, 1992
- Akita Electronics Co. Ltd.
- Watanabe Masayuki
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor device and semiconductor module with a plurality of s...
- Patent number 5,028,986
- Issue date Jul 2, 1991
- Hitachi, Ltd.
- Toshio Sugano
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor integrated circuit device and method of manufacturing...
- Patent number 4,982,265
- Issue date Jan 1, 1991
- Hitachi, Ltd.
- Masayuki Watanabe
- G11 - INFORMATION STORAGE

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20100148350
- Publication date Jun 17, 2010
- Renesas Technology Corp.
- Minoru SHINOHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Mounting structure for semiconductor parts and semiconductor device
- Publication number 20050104212
- Publication date May 19, 2005
- Elpida Memory, Inc.
- Kensuke Tsuneda
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Semiconductor memory module having double-sided stacked memory chip...
- Publication number 20030098504
- Publication date May 29, 2003
- Watanabe Masayuki
- G11 - INFORMATION STORAGE
Information Patent Application
Semiconductor device and process for manufacturing the same
- Publication number 20020167830
- Publication date Nov 14, 2002
- TOSHIO SUGANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor memory module having double-sided stacked memory chip...
- Publication number 20020121690
- Publication date Sep 5, 2002
- Hitachi, Ltd. (JP)
- Watanabe Masayuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND PROCESS FOR MANUFACTURING THE SAME
- Publication number 20020001216
- Publication date Jan 3, 2002
- TOSHIO SUGANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor devicse, a semicinductor module loaded with said semi...
- Publication number 20010026009
- Publication date Oct 4, 2001
- Kensuke Tsunesa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device, a semiconductor module loaded with said semic...
- Publication number 20010026008
- Publication date Oct 4, 2001
- Kensuke Tsuneda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor memory module having double-sided stacked memory chip...
- Publication number 20010020741
- Publication date Sep 13, 2001
- HITACHI LTD.
- Watanabe Masayuki
- H01 - BASIC ELECTRIC ELEMENTS

Tsukui Seiichiro

Person

Patents Grantslast 30 patents

Semiconductor device and method for manufacturing the same

Mounting structure for semiconductor parts and semiconductor device

Semiconductor device and process for manufacturing the same

Semiconductor device, a semiconductor module loaded with said semic...

Semiconductor device and process for manufacturing the same

Semiconductor memory module having double-sided stacked memory chip...

Semiconductor memory module having double-sided stacked memory chip...

Semiconductor memory module having double-sided stacked memory chip...

Semiconductor device and process for manufacturing the same

Semiconductor memory module having double-sided memory chip layout

Semiconductor device and process for manufacturing the same

Semiconductor memory module having double-sided stacked memory chip...

Semiconductor integrated circuit device, and process and apparatus...

Semiconductor memory device and memory module using the same

Semiconductor memory module having double-sided stacked memory chip...

Semiconductor memory device and memory module using the same

Process for manufacturing a stacked integrated circuit package

Stacked semiconductor memory device and semiconductor memory module...

High packing density module board and electronic device having such...

Semiconductor stacked device

Lead connections means for stacked tab packaged IC chips

Semiconductor device and semiconductor module with a plurality of s...

Semiconductor integrated circuit device and method of manufacturing...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

Mounting structure for semiconductor parts and semiconductor device

Semiconductor memory module having double-sided stacked memory chip...

Semiconductor device and process for manufacturing the same

Semiconductor memory module having double-sided stacked memory chip...

SEMICONDUCTOR DEVICE AND PROCESS FOR MANUFACTURING THE SAME

Semiconductor devicse, a semicinductor module loaded with said semi...

Semiconductor device, a semiconductor module loaded with said semic...

Semiconductor memory module having double-sided stacked memory chip...