Bonding two components

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CPC
B81C2203/03

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BPERFORMING OPERATIONS TRANSPORTING B81Micro-structural technology B81CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICRO-STRUCTURAL DEVICES OR SYSTEMS B81C2203/00Forming micro-structural systems

Current Industry

B81C2203/03Bonding two components

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Method for producing fine structures in the volume of a substrate c...
- Patent number 12,172,157
- Issue date Dec 24, 2024
- Schott AG
- Andreas Ortner
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Enclosed cavity structures
- Patent number 12,162,747
- Issue date Dec 10, 2024
- X-CELEPRINT LIMITED
- Ronald S. Cok
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Anti-stiction process for MEMS device
- Patent number 12,157,667
- Issue date Dec 3, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jui-Chun Weng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Pressure sensor with high stability
- Patent number 12,139,398
- Issue date Nov 12, 2024
- Invensense, Inc.
- Weng Shen Su
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Conductive bond structure to increase membrane sensitivity in MEMS...
- Patent number 12,139,399
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hung-Hua Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microelectronics package with vertically stacked MEMS device and co...
- Patent number 12,129,168
- Issue date Oct 29, 2024
- Qorvo US, Inc.
- Julio C. Costa
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of bonding substrates and separating a portion of the bonded...
- Patent number 12,116,303
- Issue date Oct 15, 2024
- Corning Incorporated
- Thomas Mikio Wynne
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Bonded structures
- Patent number 12,100,684
- Issue date Sep 24, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Liang Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microchannel chip and method for manufacturing same
- Patent number 12,091,308
- Issue date Sep 17, 2024
- Zeon Corporation
- Hiroya Nishioka
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Silicon MEMS gyroscopes with upper and lower sense plates
- Patent number 12,092,460
- Issue date Sep 17, 2024
- The Charles Stark Draper Laboratory, Inc.
- Eugene H. Cook
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Laser-assisted material phase-change and expulsion micro-machining...
- Patent number 12,077,432
- Issue date Sep 3, 2024
- Massachusetts Institute of Technology
- Prashant Patil
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Micro-acoustic wafer-level package and method of manufacture
- Patent number 12,071,339
- Issue date Aug 27, 2024
- RF360 SINGAPORE PTE. LTD.
- Manuel Hofer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Adaptive cavity thickness control for micromachined ultrasonic tran...
- Patent number 12,070,773
- Issue date Aug 27, 2024
- BFLY OPERATIONS, INC.
- Lingyun Miao
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for producing a wafer connection
- Patent number 12,030,773
- Issue date Jul 9, 2024
- Robert Bosch GmbH
- Friedjof Heuck
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor integrated device with electrical contacts between st...
- Patent number 12,024,422
- Issue date Jul 2, 2024
- STMicroelectronics S.r.l.
- Enri Duqi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Multilayer fluidic devices and methods for their fabrication
- Patent number 12,017,214
- Issue date Jun 25, 2024
- Illumina, Inc.
- Jeffrey S. Fisher
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Dual micro-electro mechanical system and manufacturing method thereof
- Patent number 11,993,512
- Issue date May 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yang-Che Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Enclosed cavity structures
- Patent number 11,981,559
- Issue date May 14, 2024
- X-CELEPRINT LIMITED
- Ronald S. Cok
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor package and method for manufacturing the same
- Patent number 11,973,048
- Issue date Apr 30, 2024
- Advanced Semiconductor Engineering, Inc.
- An-Nong Wen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microfluidic device
- Patent number 11,944,965
- Issue date Apr 2, 2024
- Imec VZW
- Giuseppe Fiorentino
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microfabrication of omni-view peripheral scanning system
- Patent number 11,926,523
- Issue date Mar 12, 2024
- BEIJING VOYAGER TECHNOLOGY CO., LTD.
- Youmin Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Methods including panel bonding acts and electronic devices includi...
- Patent number 11,921,032
- Issue date Mar 5, 2024
- Infineon Technologies AG
- Horst Theuss
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Sensor with dimple features and improved out-of-plane stiction
- Patent number 11,919,769
- Issue date Mar 5, 2024
- Invensense, Inc.
- Ashfaque Uddin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 11,915,924
- Issue date Feb 27, 2024
- Denso Corporation
- Megumi Suzuki
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Enclosed cavity structures
- Patent number 11,897,760
- Issue date Feb 13, 2024
- X-CELEPRINT LIMITED
- Ronald S. Cok
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Capacitive microphone sensor design and fabrication method for achi...
- Patent number 11,902,741
- Issue date Feb 13, 2024
- Kathirgamasundaram Sooriakumar
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Sensing module and manufacturing method thereof
- Patent number 11,894,473
- Issue date Feb 6, 2024
- Ruei Chi Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Process for manufacturing microelectromechanical devices, in partic...
- Patent number 11,891,298
- Issue date Feb 6, 2024
- STMicroelectronics S.r.l.
- Fabio Quaglia
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Enclosed cavity structures
- Patent number 11,884,537
- Issue date Jan 30, 2024
- X-CELEPRINT LIMITED
- Ronald S. Cok
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Methods including panel bonding acts and electronic devices includi...
- Patent number 11,885,736
- Issue date Jan 30, 2024
- Infineon Technologies AG
- Horst Theuss
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
DIE STACKING WITH CONTROLLED TILT AND ANGULAR ALIGNMENT
- Publication number 20240425364
- Publication date Dec 26, 2024
- NXP USA, Inc.
- Chayathorn Saklang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ADAPTIVE CAVITY THICKNESS CONTROL FOR MICROMACHINED ULTRASONIC TRAN...
- Publication number 20240416385
- Publication date Dec 19, 2024
- BFLY OPERATIONS, INC.
- Lingyun Miao
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INERTIAL SENSOR AND METHOD FOR FORMING THE SAME
- Publication number 20240418510
- Publication date Dec 19, 2024
- AAC TECHNOLOGIES PTE. LTD
- Houming Chong
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS DEVICE WITH A CAP LAYER HAVING GAPS AND METHOD OF MANUFACTURIN...
- Publication number 20240409398
- Publication date Dec 12, 2024
- Murata Manufacturing Co., Ltd.
- Konsta HANNULA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME
- Publication number 20240383005
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kang-Yi Lien
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MULTILAYER FLUIDIC DEVICES AND METHODS FOR THEIR FABRICATION
- Publication number 20240375099
- Publication date Nov 14, 2024
- Illumina, Inc.
- Jeffrey S. FISHER
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CONDUCTIVE BOND STRUCTURE TO INCREASE MEMBRANE SENSITIVTY IN MEMS D...
- Publication number 20240367965
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Hua Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DOUBLE LAYER MEMS DEVICES AND METHOD OF MANUFACTURE
- Publication number 20240343558
- Publication date Oct 17, 2024
- Murata Manufacturing Co., Ltd.
- Petteri KILPINEN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS SENSOR, AND METHOD FOR MANUFACTURING MEMS SENSOR
- Publication number 20240317579
- Publication date Sep 26, 2024
- Rohm Co., Ltd.
- Daisuke KAMINISHI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INTERPOSER FOR DAMPING MEMS MICROPHONES
- Publication number 20240279049
- Publication date Aug 22, 2024
- HAHN-SCHICKARD-GESELLSCHAFT FUR ANGEWANDTE FORSCHUNG E.V.
- Achim Bittner
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ACOUSTIC DEVICE AND MODULE INCLUDING THE SAME
- Publication number 20240270567
- Publication date Aug 15, 2024
- Murata Manufacturing Co., Ltd.
- Hiroshi MATSUBARA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DUAL MICRO-ELECTRO MECHANICAL SYSTEM AND MANUFACTURING METHOD THEREOF
- Publication number 20240262681
- Publication date Aug 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yang-Che CHEN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DECOUPLING METHOD FOR SEMICONDUCTOR DEVICE
- Publication number 20240228264
- Publication date Jul 11, 2024
- STMicroelectronics International N.V.
- Roseanne DUCA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD AND SYSTEM FOR FABRICATING A MEMS DEVICE CAP
- Publication number 20240199412
- Publication date Jun 20, 2024
- InvenSense, Inc.
- Camillo Pilla
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR PRODUCING A MICROELECTROMECHANICAL COMPONENT
- Publication number 20240182298
- Publication date Jun 6, 2024
- ROBERT BOSCH GmbH
- Johannes CLASSEN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DECOUPLING METHOD FOR SEMICONDUCTOR DEVICE
- Publication number 20240132340
- Publication date Apr 25, 2024
- STMicroelectronics (Malta) Ltd.
- Roseanne DUCA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CAPACITIVE MICROPHONE SENSOR DESIGN AND FABRICATION METHOD FOR ACHI...
- Publication number 20240137711
- Publication date Apr 25, 2024
- Innogrity Pte Ltd
- KATHIRGAMASUNDARAM SOORIAKUMAR
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD OF FABRICATING MICRO-ELECTROMECHANICAL SYSTEM DEVICE
- Publication number 20240116749
- Publication date Apr 11, 2024
- Vanguard International Semiconductor Corporation
- Jia Jie Xia
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Support Device for One or More MEMS Components
- Publication number 20240101412
- Publication date Mar 28, 2024
- ROBERT BOSCH GmbH
- Joachim Friedl
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS SENSOR AND MANUFACTURING METHOD THEREOF
- Publication number 20240092631
- Publication date Mar 21, 2024
- Rohm Co., Ltd.
- Yoshiyuki INUI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICRO-ELECTRO MECHANICAL SYSTEM AND MANUFACTURING METHOD THEREOF
- Publication number 20240083742
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ting-Li YANG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INTEGRATED DICING DIE BONDING SHEET AND METHOD FOR PRODUCING SEMICO...
- Publication number 20240087941
- Publication date Mar 14, 2024
- Dow Toray Co., Ltd.
- Nohno TODA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS DEVICE WITH AN IMPROVED CAP AND RELATED MANUFACTURING PROCESS
- Publication number 20240043265
- Publication date Feb 8, 2024
- STMicroelectronics S.r.l.
- Giorgio ALLEGATO
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS DEVICE MANUFACTURING
- Publication number 20240043264
- Publication date Feb 8, 2024
- Obsidian Sensors, Inc.
- Tallis CHANG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROFABRICATED ULTRASONIC TRANSDUCERS AND RELATED APPARATUS AND ME...
- Publication number 20240044846
- Publication date Feb 8, 2024
- BFLY OPERATIONS, INC.
- Jonathan M. Rothberg
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROELECTROMECHANICAL MEMBRANE TRANSDUCER WITH ACTIVE DAMPER
- Publication number 20240034618
- Publication date Feb 1, 2024
- STMicroelectronics S.r.l.
- Domenico GIUSTI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD AND APPARATUS FOR THE OPTICAL CONTACT BONDING OF COMPONENTS
- Publication number 20240036345
- Publication date Feb 1, 2024
- Carl Zeiss SMT GMBH
- Stefan SCHUETTER
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
BOTTOM ELECTRODE VIA STRUCTURES FOR MICROMACHINED ULTRASONIC TRANSD...
- Publication number 20240024917
- Publication date Jan 25, 2024
- BFLY OPERATIONS, INC.
- Lingyun Miao
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROMECHANICAL STRUCTURE WITH BONDED COVER
- Publication number 20240002218
- Publication date Jan 4, 2024
- SiTime Corporation
- Aaron Partridge
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEAL FOR MICROELECTRONIC ASSEMBLY
- Publication number 20230420313
- Publication date Dec 28, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Rajesh Katkar
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Bonding two components

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for producing fine structures in the volume of a substrate c...

Enclosed cavity structures

Anti-stiction process for MEMS device

Pressure sensor with high stability

Conductive bond structure to increase membrane sensitivity in MEMS...

Microelectronics package with vertically stacked MEMS device and co...

Method of bonding substrates and separating a portion of the bonded...

Bonded structures

Microchannel chip and method for manufacturing same

Silicon MEMS gyroscopes with upper and lower sense plates

Laser-assisted material phase-change and expulsion micro-machining...

Micro-acoustic wafer-level package and method of manufacture

Adaptive cavity thickness control for micromachined ultrasonic tran...

Method for producing a wafer connection

Semiconductor integrated device with electrical contacts between st...

Multilayer fluidic devices and methods for their fabrication

Dual micro-electro mechanical system and manufacturing method thereof

Enclosed cavity structures

Semiconductor package and method for manufacturing the same

Microfluidic device

Microfabrication of omni-view peripheral scanning system

Methods including panel bonding acts and electronic devices includi...

Sensor with dimple features and improved out-of-plane stiction

Semiconductor device and method for manufacturing the same

Enclosed cavity structures

Capacitive microphone sensor design and fabrication method for achi...

Sensing module and manufacturing method thereof

Process for manufacturing microelectromechanical devices, in partic...

Enclosed cavity structures

Methods including panel bonding acts and electronic devices includi...

Patents Applicationslast 30 patents

DIE STACKING WITH CONTROLLED TILT AND ANGULAR ALIGNMENT

ADAPTIVE CAVITY THICKNESS CONTROL FOR MICROMACHINED ULTRASONIC TRAN...

INERTIAL SENSOR AND METHOD FOR FORMING THE SAME

MEMS DEVICE WITH A CAP LAYER HAVING GAPS AND METHOD OF MANUFACTURIN...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME

MULTILAYER FLUIDIC DEVICES AND METHODS FOR THEIR FABRICATION

CONDUCTIVE BOND STRUCTURE TO INCREASE MEMBRANE SENSITIVTY IN MEMS D...

DOUBLE LAYER MEMS DEVICES AND METHOD OF MANUFACTURE

MEMS SENSOR, AND METHOD FOR MANUFACTURING MEMS SENSOR

INTERPOSER FOR DAMPING MEMS MICROPHONES

ACOUSTIC DEVICE AND MODULE INCLUDING THE SAME

DUAL MICRO-ELECTRO MECHANICAL SYSTEM AND MANUFACTURING METHOD THEREOF

DECOUPLING METHOD FOR SEMICONDUCTOR DEVICE

METHOD AND SYSTEM FOR FABRICATING A MEMS DEVICE CAP

METHOD FOR PRODUCING A MICROELECTROMECHANICAL COMPONENT

DECOUPLING METHOD FOR SEMICONDUCTOR DEVICE

CAPACITIVE MICROPHONE SENSOR DESIGN AND FABRICATION METHOD FOR ACHI...

METHOD OF FABRICATING MICRO-ELECTROMECHANICAL SYSTEM DEVICE

Support Device for One or More MEMS Components

MEMS SENSOR AND MANUFACTURING METHOD THEREOF

MICRO-ELECTRO MECHANICAL SYSTEM AND MANUFACTURING METHOD THEREOF

INTEGRATED DICING DIE BONDING SHEET AND METHOD FOR PRODUCING SEMICO...

MEMS DEVICE WITH AN IMPROVED CAP AND RELATED MANUFACTURING PROCESS

MEMS DEVICE MANUFACTURING

MICROFABRICATED ULTRASONIC TRANSDUCERS AND RELATED APPARATUS AND ME...

MICROELECTROMECHANICAL MEMBRANE TRANSDUCER WITH ACTIVE DAMPER

METHOD AND APPARATUS FOR THE OPTICAL CONTACT BONDING OF COMPONENTS

BOTTOM ELECTRODE VIA STRUCTURES FOR MICROMACHINED ULTRASONIC TRANSD...

MICROMECHANICAL STRUCTURE WITH BONDED COVER

SEAL FOR MICROELECTRONIC ASSEMBLY