Bonding two components

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B81C2203/03

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BPERFORMING OPERATIONS TRANSPORTING B81Micro-structural technology B81CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICRO-STRUCTURAL DEVICES OR SYSTEMS B81C2203/00Forming micro-structural systems

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B81C2203/03Bonding two components

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Methods and apparatus for electronic device packaging
- Patent number 12,365,584
- Issue date Jul 22, 2025
- Texas Instruments Incorporated
- Jane Liu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Methods for ultrasonic fabrication and sealing of microfluidics
- Patent number 12,358,786
- Issue date Jul 15, 2025
- NATIONAL CENTRE FOR SCIENTIFIC RESEARCH “DEMOKRITOS”
- Evangelos Gogolides
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Fabrication of MEMS structures from fused silica for inertial sensors
- Patent number 12,351,451
- Issue date Jul 8, 2025
- Atlantic Inertial Systems Limited
- Christopher Paul Fell
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Capacitive micromachined ultrasonic transducer and method of manufa...
- Patent number 12,350,710
- Issue date Jul 8, 2025
- Vermon S.A.
- Dominique Gross
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Device and method of manufacturing the device
- Patent number 12,343,979
- Issue date Jul 1, 2025
- Canon Kabushiki Kaisha
- Noriyuki Nakai
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Seal for microelectronic assembly
- Patent number 12,322,667
- Issue date Jun 3, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Rajesh Katkar
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device comprising different types of microelectromech...
- Patent number 12,304,807
- Issue date May 20, 2025
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Hsiang-Fu Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Contact lens, method for detecting a structure-borne sound with the...
- Patent number 12,287,535
- Issue date Apr 29, 2025
- Robert Bosch GmbH
- Johannes Classen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Bottom electrode via structures for micromachined ultrasonic transd...
- Patent number 12,269,061
- Issue date Apr 8, 2025
- BFLY OPERATIONS, INC.
- Lingyun Miao
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device having microelectromechanical systems devices...
- Patent number 12,257,602
- Issue date Mar 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- I-Hsuan Chiu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Bonding process for forming semiconductor device structure
- Patent number 12,258,265
- Issue date Mar 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hang Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method and system for fabricating a MEMS device
- Patent number 12,258,266
- Issue date Mar 25, 2025
- Invensense, Inc.
- Daesung Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Resonance device and resonance device manufacturing method
- Patent number 12,252,393
- Issue date Mar 18, 2025
- Murata Manufacturing Co., Ltd.
- Masakazu Fukumitsu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
CMUT-on-CMOS ultrasonic transducer by bonding active wafers and man...
- Patent number 12,208,416
- Issue date Jan 28, 2025
- Zhejiang Xiansheng Technology Co., Ltd.
- Feng Yin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for bonding wafers, and a wafer
- Patent number 12,202,725
- Issue date Jan 21, 2025
- Murata Manufacturing Co., Ltd.
- Konsta Hannula
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for producing a plurality of sensor devices, and sensor device
- Patent number 12,195,330
- Issue date Jan 14, 2025
- Robert Bosch GmbH
- Daniel Haug
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Sensor package and method of producing the sensor package
- Patent number 12,180,066
- Issue date Dec 31, 2024
- Sciosense B.V.
- Willem Frederik Adrianus Besling
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method and system for fabricating a MEMS device
- Patent number 12,180,069
- Issue date Dec 31, 2024
- Invensense, Inc.
- Daesung Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for producing fine structures in the volume of a substrate c...
- Patent number 12,172,157
- Issue date Dec 24, 2024
- Schott AG
- Andreas Ortner
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Enclosed cavity structures
- Patent number 12,162,747
- Issue date Dec 10, 2024
- X-CELEPRINT LIMITED
- Ronald S. Cok
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Anti-stiction process for MEMS device
- Patent number 12,157,667
- Issue date Dec 3, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jui-Chun Weng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Pressure sensor with high stability
- Patent number 12,139,398
- Issue date Nov 12, 2024
- Invensense, Inc.
- Weng Shen Su
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Conductive bond structure to increase membrane sensitivity in MEMS...
- Patent number 12,139,399
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hung-Hua Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microelectronics package with vertically stacked MEMS device and co...
- Patent number 12,129,168
- Issue date Oct 29, 2024
- Qorvo US, Inc.
- Julio C. Costa
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of bonding substrates and separating a portion of the bonded...
- Patent number 12,116,303
- Issue date Oct 15, 2024
- Corning Incorporated
- Thomas Mikio Wynne
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Bonded structures
- Patent number 12,100,684
- Issue date Sep 24, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Liang Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Silicon MEMS gyroscopes with upper and lower sense plates
- Patent number 12,092,460
- Issue date Sep 17, 2024
- The Charles Stark Draper Laboratory, Inc.
- Eugene H. Cook
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microchannel chip and method for manufacturing same
- Patent number 12,091,308
- Issue date Sep 17, 2024
- Zeon Corporation
- Hiroya Nishioka
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Laser-assisted material phase-change and expulsion micro-machining...
- Patent number 12,077,432
- Issue date Sep 3, 2024
- Massachusetts Institute of Technology
- Prashant Patil
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Micro-acoustic wafer-level package and method of manufacture
- Patent number 12,071,339
- Issue date Aug 27, 2024
- RF360 SINGAPORE PTE. LTD.
- Manuel Hofer
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
Inertial Sensor And Electronic Component
- Publication number 20250236511
- Publication date Jul 24, 2025
- SEIKO EPSON CORPORATION
- Tomonaga KOBAYASHI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE HAVING MICROELECTROMECHANICAL SYSTEMS DEVICES...
- Publication number 20250214108
- Publication date Jul 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- I-Hsuan Chiu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
BONDING PROCESS FOR FORMING SEMICONDUCTOR DEVICE STRUCTURE
- Publication number 20250187907
- Publication date Jun 12, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hang Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROELECTROMECHANICAL COMPONENT WITH A METAL STANDOFF
- Publication number 20250178887
- Publication date Jun 5, 2025
- Murata Manufacturing Co., Ltd.
- Marcus RINKIÖ
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR MANUFACTURING A PACKAGING STRUCTURE
- Publication number 20250171299
- Publication date May 29, 2025
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Audrey BERTHELOT
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHODS OF FABRICATING MICRO ELECTRO-MECHANICAL SYSTEMS STRUCTURES
- Publication number 20250162860
- Publication date May 22, 2025
- The University of British Columbia
- Chang Ge
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD AND SYSTEM FOR FABRICATING A MEMS DEVICE
- Publication number 20250145456
- Publication date May 8, 2025
- InvenSense, Inc.
- Daesung Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
WAFER-LEVEL FABRICATION PROCESSES FOR FERRIMAGNETIC RESONATORS AND...
- Publication number 20250136441
- Publication date May 1, 2025
- The Regents of the University of California
- Andrei M. SHKEL
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PRODUCTION METHOD FOR A MICROMECHANICAL SENSOR COMPONENT AND CORRES...
- Publication number 20250109016
- Publication date Apr 3, 2025
- ROBERT BOSCH GmbH
- Richard Fix
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROELECTROMECHANICAL COMPONENT WITH GAP-CONTROL STRUCTURE AND A M...
- Publication number 20250109015
- Publication date Apr 3, 2025
- Murata Manufacturing Co., Ltd.
- Jeanette LINDROOS
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD AND SYSTEM FOR FABRICATING A MEMS DEVICE
- Publication number 20250074766
- Publication date Mar 6, 2025
- InvenSense, Inc.
- Daesung Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SENSING ELEMENT AND RELATED METHODS
- Publication number 20250076135
- Publication date Mar 6, 2025
- GENERAL ELECTRIC COMPANY
- Robert James MacDonald
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
BONDED STRUCTURES
- Publication number 20250079385
- Publication date Mar 6, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Liang Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR PRODUCING FINE STRUCTURES IN THE VOLUME OF A SUBSTRATE C...
- Publication number 20250050329
- Publication date Feb 13, 2025
- SCHOTT AG
- Andreas Ortner
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
FOUNDRY-COMPATIBLE PROCESS FOR INTEGRATED MICRO-SPEAKER AND MICROPHONE
- Publication number 20250030998
- Publication date Jan 23, 2025
- Vibrant Microsystems Inc.
- Joseph Doll
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROELECTRONICS PACKAGE WITH VERTICALLY STACKED MEMS DEVICE AND CO...
- Publication number 20250002330
- Publication date Jan 2, 2025
- Qorvo US, Inc.
- Julio C. Costa
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
WAFER LEVEL PROXIMITY SENSOR AND METHOD OF MAKING SAME
- Publication number 20250002333
- Publication date Jan 2, 2025
- STMicroelectronics International N.V.
- Eric SAUGIER
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DIE STACKING WITH CONTROLLED TILT AND ANGULAR ALIGNMENT
- Publication number 20240425364
- Publication date Dec 26, 2024
- NXP USA, Inc.
- Chayathorn Saklang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ADAPTIVE CAVITY THICKNESS CONTROL FOR MICROMACHINED ULTRASONIC TRAN...
- Publication number 20240416385
- Publication date Dec 19, 2024
- BFLY OPERATIONS, INC.
- Lingyun Miao
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INERTIAL SENSOR AND METHOD FOR FORMING THE SAME
- Publication number 20240418510
- Publication date Dec 19, 2024
- AAC TECHNOLOGIES PTE. LTD
- Houming Chong
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS DEVICE WITH A CAP LAYER HAVING GAPS AND METHOD OF MANUFACTURIN...
- Publication number 20240409398
- Publication date Dec 12, 2024
- Murata Manufacturing Co., Ltd.
- Konsta HANNULA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME
- Publication number 20240383005
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kang-Yi Lien
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MULTILAYER FLUIDIC DEVICES AND METHODS FOR THEIR FABRICATION
- Publication number 20240375099
- Publication date Nov 14, 2024
- Illumina, Inc.
- Jeffrey S. FISHER
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CONDUCTIVE BOND STRUCTURE TO INCREASE MEMBRANE SENSITIVTY IN MEMS D...
- Publication number 20240367965
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Hua Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DOUBLE LAYER MEMS DEVICES AND METHOD OF MANUFACTURE
- Publication number 20240343558
- Publication date Oct 17, 2024
- Murata Manufacturing Co., Ltd.
- Petteri KILPINEN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS SENSOR, AND METHOD FOR MANUFACTURING MEMS SENSOR
- Publication number 20240317579
- Publication date Sep 26, 2024
- Rohm Co., Ltd.
- Daisuke KAMINISHI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INTERPOSER FOR DAMPING MEMS MICROPHONES
- Publication number 20240279049
- Publication date Aug 22, 2024
- HAHN-SCHICKARD-GESELLSCHAFT FUR ANGEWANDTE FORSCHUNG E.V.
- Achim Bittner
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ACOUSTIC DEVICE AND MODULE INCLUDING THE SAME
- Publication number 20240270567
- Publication date Aug 15, 2024
- Murata Manufacturing Co., Ltd.
- Hiroshi MATSUBARA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DUAL MICRO-ELECTRO MECHANICAL SYSTEM AND MANUFACTURING METHOD THEREOF
- Publication number 20240262681
- Publication date Aug 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yang-Che CHEN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DECOUPLING METHOD FOR SEMICONDUCTOR DEVICE
- Publication number 20240228264
- Publication date Jul 11, 2024
- STMicroelectronics International N.V.
- Roseanne DUCA
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Bonding two components

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Methods and apparatus for electronic device packaging

Methods for ultrasonic fabrication and sealing of microfluidics

Fabrication of MEMS structures from fused silica for inertial sensors

Capacitive micromachined ultrasonic transducer and method of manufa...

Device and method of manufacturing the device

Seal for microelectronic assembly

Semiconductor device comprising different types of microelectromech...

Contact lens, method for detecting a structure-borne sound with the...

Bottom electrode via structures for micromachined ultrasonic transd...

Semiconductor device having microelectromechanical systems devices...

Bonding process for forming semiconductor device structure

Method and system for fabricating a MEMS device

Resonance device and resonance device manufacturing method

CMUT-on-CMOS ultrasonic transducer by bonding active wafers and man...

Method for bonding wafers, and a wafer

Method for producing a plurality of sensor devices, and sensor device

Sensor package and method of producing the sensor package

Method and system for fabricating a MEMS device

Method for producing fine structures in the volume of a substrate c...

Enclosed cavity structures

Anti-stiction process for MEMS device

Pressure sensor with high stability

Conductive bond structure to increase membrane sensitivity in MEMS...

Microelectronics package with vertically stacked MEMS device and co...

Method of bonding substrates and separating a portion of the bonded...

Bonded structures

Silicon MEMS gyroscopes with upper and lower sense plates

Microchannel chip and method for manufacturing same

Laser-assisted material phase-change and expulsion micro-machining...

Micro-acoustic wafer-level package and method of manufacture

Patents Applicationslast 30 patents

Inertial Sensor And Electronic Component

SEMICONDUCTOR DEVICE HAVING MICROELECTROMECHANICAL SYSTEMS DEVICES...

BONDING PROCESS FOR FORMING SEMICONDUCTOR DEVICE STRUCTURE

MICROELECTROMECHANICAL COMPONENT WITH A METAL STANDOFF

METHOD FOR MANUFACTURING A PACKAGING STRUCTURE

METHODS OF FABRICATING MICRO ELECTRO-MECHANICAL SYSTEMS STRUCTURES

METHOD AND SYSTEM FOR FABRICATING A MEMS DEVICE

WAFER-LEVEL FABRICATION PROCESSES FOR FERRIMAGNETIC RESONATORS AND...

PRODUCTION METHOD FOR A MICROMECHANICAL SENSOR COMPONENT AND CORRES...

MICROELECTROMECHANICAL COMPONENT WITH GAP-CONTROL STRUCTURE AND A M...

METHOD AND SYSTEM FOR FABRICATING A MEMS DEVICE

SENSING ELEMENT AND RELATED METHODS

BONDED STRUCTURES

METHOD FOR PRODUCING FINE STRUCTURES IN THE VOLUME OF A SUBSTRATE C...

FOUNDRY-COMPATIBLE PROCESS FOR INTEGRATED MICRO-SPEAKER AND MICROPHONE

MICROELECTRONICS PACKAGE WITH VERTICALLY STACKED MEMS DEVICE AND CO...

WAFER LEVEL PROXIMITY SENSOR AND METHOD OF MAKING SAME

DIE STACKING WITH CONTROLLED TILT AND ANGULAR ALIGNMENT

ADAPTIVE CAVITY THICKNESS CONTROL FOR MICROMACHINED ULTRASONIC TRAN...

INERTIAL SENSOR AND METHOD FOR FORMING THE SAME

MEMS DEVICE WITH A CAP LAYER HAVING GAPS AND METHOD OF MANUFACTURIN...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME

MULTILAYER FLUIDIC DEVICES AND METHODS FOR THEIR FABRICATION

CONDUCTIVE BOND STRUCTURE TO INCREASE MEMBRANE SENSITIVTY IN MEMS D...

DOUBLE LAYER MEMS DEVICES AND METHOD OF MANUFACTURE

MEMS SENSOR, AND METHOD FOR MANUFACTURING MEMS SENSOR

INTERPOSER FOR DAMPING MEMS MICROPHONES

ACOUSTIC DEVICE AND MODULE INCLUDING THE SAME

DUAL MICRO-ELECTRO MECHANICAL SYSTEM AND MANUFACTURING METHOD THEREOF

DECOUPLING METHOD FOR SEMICONDUCTOR DEVICE