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H01L2224/80031

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/80031by chemical means

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Manufacturing method of semiconductor structure
- Patent number 12,261,149
- Issue date Mar 25, 2025
- Powerchip Semiconductor Manufacturing Corporation
- Shih-Ping Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated structure with bifunctional routing and assembly compris...
- Patent number 12,249,572
- Issue date Mar 11, 2025
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Candice Thomas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and systems for improving fusion bonding
- Patent number 12,243,848
- Issue date Mar 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hong-Ta Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device and semiconductor device
- Patent number 12,211,819
- Issue date Jan 28, 2025
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Eiichiro Kanda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device and method for forming the same
- Patent number 12,191,269
- Issue date Jan 7, 2025
- Yangtze Memory Technologies Co., Ltd.
- Yuancheng Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assembly from processed substrate
- Patent number 12,051,621
- Issue date Jul 30, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Dimension compensation control for directly bonded structures
- Patent number 12,009,338
- Issue date Jun 11, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Guilian Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic circuit for a hybrid molecular bonding
- Patent number 11,990,436
- Issue date May 21, 2024
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Emilie Bourjot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package structure, electronic substrate and method of ma...
- Patent number 11,978,706
- Issue date May 7, 2024
- Advanced Semiconductor Engineering, Inc.
- Shun-Tsat Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-dielectric bonding method and structure
- Patent number 11,978,719
- Issue date May 7, 2024
- Yangtze Memory Technologies Co., Ltd.
- Siping Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond enhancement structure in microelectronics for trapping contami...
- Patent number 11,967,575
- Issue date Apr 23, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Guilian Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low temperature hybrid bonding
- Patent number 11,911,839
- Issue date Feb 27, 2024
- Advanced Micro Devices, Inc.
- Priyal Shah
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive barrier direct hybrid bonding
- Patent number 11,830,838
- Issue date Nov 28, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-dielectric bonding method and structure
- Patent number 11,798,913
- Issue date Oct 24, 2023
- Yangtze Memory Technologies Co., Ltd.
- Siping Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and structures for improved electrical contact between bond...
- Patent number 11,784,123
- Issue date Oct 10, 2023
- Intel Corporation
- Richard Vreeland
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reliable hybrid bonded apparatus
- Patent number 11,742,314
- Issue date Aug 29, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die processing
- Patent number 11,742,315
- Issue date Aug 29, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device and semiconductor device
- Patent number 11,721,664
- Issue date Aug 8, 2023
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Eiichiro Kanda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded semiconductor die assembly with metal alloy bonding pads and...
- Patent number 11,646,282
- Issue date May 9, 2023
- SanDisk Technologies LLC
- Lin Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor device
- Patent number 11,600,598
- Issue date Mar 7, 2023
- SK hynix Inc.
- Jin Ha Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-dielectric bonding method and structure
- Patent number 11,495,569
- Issue date Nov 8, 2022
- Yangtze Memory Technologies Co., Ltd.
- Siping Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded assembly containing oxidation barriers, hybrid bonding, or a...
- Patent number 11,393,780
- Issue date Jul 19, 2022
- SanDisk Technologies LLC
- Ramy Nashed Bassely Said
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assembly from processed substrate
- Patent number 11,367,652
- Issue date Jun 21, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Cyprian Emeka Uzoh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Bond enhancement structure in microelectronics for trapping contami...
- Patent number 11,296,044
- Issue date Apr 5, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Guilian Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and structures for improved electrical contact between bond...
- Patent number 11,289,421
- Issue date Mar 29, 2022
- Intel Corporation
- Richard Vreeland
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive barrier direct hybrid bonding
- Patent number 11,264,345
- Issue date Mar 1, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device and semiconductor device
- Patent number 11,257,782
- Issue date Feb 22, 2022
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Eiichiro Kanda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding method with electron-stimulated desorption
- Patent number 11,081,463
- Issue date Aug 3, 2021
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Frank Fournel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die processing
- Patent number 10,985,133
- Issue date Apr 20, 2021
- INVENSAS BONDING TECHNOLOGIES, INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-deck three-dimensional memory devices and methods for forming...
- Patent number 10,985,142
- Issue date Apr 20, 2021
- Yangtze Memory Technologies Co., Ltd.
- Li Hong Xiao
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DIMENSION COMPENSATION CONTROL FOR DIRECTLY BONDED STRUCTURES
- Publication number 20240312953
- Publication date Sep 19, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Guilian Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE BARRIER DIRECT HYBRID BONDING
- Publication number 20240243085
- Publication date Jul 18, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BONDING OF A THIN SEMICONDUCTOR DIE
- Publication number 20240170442
- Publication date May 23, 2024
- ASMPT Singapore Pte. Ltd.
- Yiu Ming CHEUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD, SEMICONDUCTOR DEVICE, IN...
- Publication number 20240170447
- Publication date May 23, 2024
- Tomoaki SHIBATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED STRUCTURE AND METHOD OF FORMING SAME
- Publication number 20240105674
- Publication date Mar 28, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RELIABLE HYBRID BONDED APPARATUS
- Publication number 20240021573
- Publication date Jan 18, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE PROCESSING
- Publication number 20240021572
- Publication date Jan 18, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE TRENCH FOR IMPROVED HYBRID BONDING
- Publication number 20240006358
- Publication date Jan 4, 2024
- Intel Corporation
- Zhihua Zou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR STRUCTURE
- Publication number 20230402426
- Publication date Dec 14, 2023
- Powerchip Semiconductor Manufacturing Corporation
- Shih-Ping Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20230317654
- Publication date Oct 5, 2023
- Samsung Electronics Co., Ltd.
- Jihoon KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20230207529
- Publication date Jun 29, 2023
- SK HYNIX INC.
- Jin Ha KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND ENHANCEMENT FOR DIRECT-BONDING PROCESSES
- Publication number 20230187398
- Publication date Jun 15, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Guilian GAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT BONDING METHODS AND STRUCTURES
- Publication number 20230140107
- Publication date May 4, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Etching of Metal
- Publication number 20230108117
- Publication date Apr 6, 2023
- TOKYO ELECTRON LIMITED
- Sergey Voronin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
BONDING METHOD
- Publication number 20230100455
- Publication date Mar 30, 2023
- SEMES CO., LTD.
- Hang Lim LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS, SYSTEMS, APPARATUS, AND ARTICLES OF MANUFACTURE TO PRODUCE...
- Publication number 20230090449
- Publication date Mar 23, 2023
- Intel Corporation
- Suddhasattwa Nad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE STRUCTURE, ELECTRONIC SUBSTRATE AND METHOD OF MA...
- Publication number 20230061684
- Publication date Mar 2, 2023
- Advanced Semiconductor Engineering, Inc.
- Shun-Tsat TU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE AND METHOD FOR FORMING THE SAME
- Publication number 20230005864
- Publication date Jan 5, 2023
- YANGTZE MEMORY TECHNOLOGIES CO., LTD.
- Yuancheng Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-DIELECTRIC BONDING METHOD AND STRUCTURE
- Publication number 20230005876
- Publication date Jan 5, 2023
- Yangtze Memory Technologies Co., Ltd.
- Siping HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND SYSTEMS FOR IMPROVING FUSION BONDING
- Publication number 20220367405
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hong-Ta Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT BONDING METHODS AND STRUCTURES
- Publication number 20220320035
- Publication date Oct 6, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLY FROM PROCESSED SUBSTRATE
- Publication number 20220285213
- Publication date Sep 8, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Cyprian Emeka UZOH
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CONDUCTIVE BARRIER DIRECT HYBRID BONDING
- Publication number 20220254746
- Publication date Aug 11, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Paul M. ENQUIST
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED SEMICONDUCTOR DIE ASSEMBLY WITH METAL ALLOY BONDING PADS AND...
- Publication number 20220246562
- Publication date Aug 4, 2022
- SANDISK TECHNOLOGIES LLC
- Lin HOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND ENHANCEMENT STRUCTURE IN MICROELECTRONICS FOR TRAPPING CONTAMI...
- Publication number 20220246564
- Publication date Aug 4, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Guilian GAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-DIELECTRIC BONDING METHOD AND STRUCTURE
- Publication number 20220238479
- Publication date Jul 28, 2022
- Yangtze Memory Technologies Co., Ltd.
- Siping HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC CIRCUIT FOR A HYBRID MOLECULAR BONDING
- Publication number 20220157752
- Publication date May 19, 2022
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Emilie Bourjot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GRAPHITE THIN FILM/SILICON SUBSTRATE LAMINATED ASSEMBLY, PROCESS FO...
- Publication number 20210407883
- Publication date Dec 30, 2021
- NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY
- Masataka HASEGAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RELIABLE HYBRID BONDED APPARATUS
- Publication number 20210305202
- Publication date Sep 30, 2021
- INVENSAS BONDING TECHNOLOGIES, INC.
- Cyprian Emeka UZOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIMENSION COMPENSATION CONTROL FOR DIRECTLY BONDED STRUCTURES
- Publication number 20210296282
- Publication date Sep 23, 2021
- INVENSAS BONDING TECHNOLOGIES, INC.
- Guilian GAO
- H01 - BASIC ELECTRIC ELEMENTS

by chemical means

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Manufacturing method of semiconductor structure

Integrated structure with bifunctional routing and assembly compris...

Methods and systems for improving fusion bonding

Method of manufacturing semiconductor device and semiconductor device

Three-dimensional memory device and method for forming the same

Microelectronic assembly from processed substrate

Dimension compensation control for directly bonded structures

Electronic circuit for a hybrid molecular bonding

Electronic package structure, electronic substrate and method of ma...

Metal-dielectric bonding method and structure

Bond enhancement structure in microelectronics for trapping contami...

Low temperature hybrid bonding

Conductive barrier direct hybrid bonding

Metal-dielectric bonding method and structure

Methods and structures for improved electrical contact between bond...

Reliable hybrid bonded apparatus

Die processing

Method of manufacturing semiconductor device and semiconductor device

Bonded semiconductor die assembly with metal alloy bonding pads and...

Manufacturing method of semiconductor device

Metal-dielectric bonding method and structure

Bonded assembly containing oxidation barriers, hybrid bonding, or a...

Microelectronic assembly from processed substrate

Bond enhancement structure in microelectronics for trapping contami...

Methods and structures for improved electrical contact between bond...

Conductive barrier direct hybrid bonding

Method of manufacturing semiconductor device and semiconductor device

Bonding method with electron-stimulated desorption

Die processing

Multi-deck three-dimensional memory devices and methods for forming...

Patents Applicationslast 30 patents

DIMENSION COMPENSATION CONTROL FOR DIRECTLY BONDED STRUCTURES

CONDUCTIVE BARRIER DIRECT HYBRID BONDING

HYBRID BONDING OF A THIN SEMICONDUCTOR DIE

SEMICONDUCTOR DEVICE MANUFACTURING METHOD, SEMICONDUCTOR DEVICE, IN...

BONDED STRUCTURE AND METHOD OF FORMING SAME

RELIABLE HYBRID BONDED APPARATUS

DIE PROCESSING

SUBSTRATE TRENCH FOR IMPROVED HYBRID BONDING

MANUFACTURING METHOD OF SEMICONDUCTOR STRUCTURE

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

BOND ENHANCEMENT FOR DIRECT-BONDING PROCESSES

DIRECT BONDING METHODS AND STRUCTURES

Method for Etching of Metal

BONDING METHOD

METHODS, SYSTEMS, APPARATUS, AND ARTICLES OF MANUFACTURE TO PRODUCE...

ELECTRONIC PACKAGE STRUCTURE, ELECTRONIC SUBSTRATE AND METHOD OF MA...

THREE-DIMENSIONAL MEMORY DEVICE AND METHOD FOR FORMING THE SAME

METAL-DIELECTRIC BONDING METHOD AND STRUCTURE

METHODS AND SYSTEMS FOR IMPROVING FUSION BONDING

DIRECT BONDING METHODS AND STRUCTURES

MICROELECTRONIC ASSEMBLY FROM PROCESSED SUBSTRATE

CONDUCTIVE BARRIER DIRECT HYBRID BONDING

BONDED SEMICONDUCTOR DIE ASSEMBLY WITH METAL ALLOY BONDING PADS AND...

BOND ENHANCEMENT STRUCTURE IN MICROELECTRONICS FOR TRAPPING CONTAMI...

METAL-DIELECTRIC BONDING METHOD AND STRUCTURE

ELECTRONIC CIRCUIT FOR A HYBRID MOLECULAR BONDING

GRAPHITE THIN FILM/SILICON SUBSTRATE LAMINATED ASSEMBLY, PROCESS FO...

RELIABLE HYBRID BONDED APPARATUS

DIMENSION COMPENSATION CONTROL FOR DIRECTLY BONDED STRUCTURES