TREA

by cleaving the carrier wafer

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Industry

  • CPC
  • B81C2201/0192
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Parent Industries

BPERFORMING OPERATIONS TRANSPORTING B81Micro-structural technology B81CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICRO-STRUCTURAL DEVICES OR SYSTEMS B81C2201/00Manufacture or treatment of micro-structural devices or systems

Current Industry

B81C2201/0192by cleaving the carrier wafer
Industries