by cleaving the carrier wafer

Industry

CPC
B81C2201/0192

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Parent Industries

BPERFORMING OPERATIONS TRANSPORTING B81Micro-structural technology B81CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICRO-STRUCTURAL DEVICES OR SYSTEMS B81C2201/00Manufacture or treatment of micro-structural devices or systems

Current Industry

B81C2201/0192by cleaving the carrier wafer

Industries

Patents Grantslast 30 patents

Information Patent Grant
Method for preparing the remainder of a donor substrate, substrate...
- Patent number 11,542,155
- Issue date Jan 3, 2023
- Soitec
- Charlotte Drazek
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of treating a solid layer bonded to a carrier substrate
- Patent number 11,518,066
- Issue date Dec 6, 2022
- Siltectra GmbH
- Franz Schilling
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for processing a monocrystalline substrate and micromechanic...
- Patent number 11,046,577
- Issue date Jun 29, 2021
- Infineon Technologies AG
- Andre Brockmeier
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for the material-saving production of wafers and processing...
- Patent number 10,843,380
- Issue date Nov 24, 2020
- Siltectra GmbH
- Franz Schilling
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of fabricating semiconductor structures including cavities...
- Patent number 10,703,627
- Issue date Jul 7, 2020
- SOITEC
- Mariam Sadaka
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for processing a monocrystalline substrate and micromechanic...
- Patent number 10,611,630
- Issue date Apr 7, 2020
- Infineon Technologies AG
- Andre Brockmeier
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Systems and methods for laser splitting and device layer transfer
- Patent number 9,929,054
- Issue date Mar 27, 2018
- Takao Yonehara
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and structure of monolithically integrated pressure sensor u...
- Patent number 8,796,746
- Issue date Aug 5, 2014
- MCube Inc.
- Xiao (Charles) Yang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for manufacturing capped MEMS components
- Patent number 8,470,631
- Issue date Jun 25, 2013
- Robert Bosch GmbH
- Torsten Kramer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of forming MEMS device with weakened substrate
- Patent number 8,241,931
- Issue date Aug 14, 2012
- Analog Devices, Inc.
- Christophe Antoine
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Controlled process and resulting device
- Patent number 8,012,852
- Issue date Sep 6, 2011
- Silicon Genesis Corporation
- Francois J. Henley
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Controlled process and resulting device
- Patent number 7,846,818
- Issue date Dec 7, 2010
- Silicon Genesis Corporation
- Francois J. Henley
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Controlled cleaving process
- Patent number 7,781,305
- Issue date Aug 24, 2010
- Silicon Genesis Corporation
- Francois J. Henley
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Controlled process and resulting device
- Patent number 7,759,217
- Issue date Jul 20, 2010
- Silicon Genesis Corporation
- Francois J. Henley
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method and device for controlled cleaving process
- Patent number 7,470,600
- Issue date Dec 30, 2008
- Silicon Genesis Corporation
- Francois J. Henley
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Controlled process and resulting device
- Patent number 7,410,887
- Issue date Aug 12, 2008
- Silicon Genesis Corporation
- Francois J. Henley
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Controlled cleaving process
- Patent number 7,371,660
- Issue date May 13, 2008
- Silicon Genesis Corporation
- Francois J. Henley
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method and device for controlled cleaving process
- Patent number 7,348,258
- Issue date Mar 25, 2008
- Silicon Genesis Corporation
- Francois J. Henley
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Fabrication of close-spaced MEMS devices by method of precise adhes...
- Patent number 7,208,021
- Issue date Apr 24, 2007
- Borealis Technical Limited
- Lasha Vardosanidze
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Controlled cleaving process
- Patent number 7,160,790
- Issue date Jan 9, 2007
- Silicon Genesis Corporation
- Francois J. Henley
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for cutting a block of material and forming a thin film
- Patent number 7,029,548
- Issue date Apr 18, 2006
- Commissariat a l'Energie Atomique
- Bernard Aspar
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method and device for controlled cleaving process
- Patent number 6,790,747
- Issue date Sep 14, 2004
- Silicon Genesis Corporation
- Francois J. Henley
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Controlled cleaving process
- Patent number 6,632,724
- Issue date Oct 14, 2003
- Silicon Genesis Corporation
- Francois J. Henley
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Controlled cleavage process using pressurized fluid
- Patent number 6,582,999
- Issue date Jun 24, 2003
- Silicon Genesis Corporation
- Francois J. Henley
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Silicon-on-silicon hybrid wafer assembly
- Patent number 6,558,802
- Issue date May 6, 2003
- Silicon Genesis Corporation
- Francois J. Henley
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Controlled cleavage process and device for patterned films
- Patent number 6,528,391
- Issue date Mar 4, 2003
- Silicon Genesis, Corporation
- Francois J. Henley
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Controlled cleavage process using pressurized fluid
- Patent number 6,511,899
- Issue date Jan 28, 2003
- Silicon Genesis Corporation
- Francois J. Henley
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method and device for controlled cleaving process
- Patent number 6,486,041
- Issue date Nov 26, 2002
- Silicon Genesis Corporation
- Francois J. Henley
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Controlled cleavage process and resulting device using beta annealing
- Patent number 6,458,672
- Issue date Oct 1, 2002
- Silicon Genesis Corporation
- Francois J. Henley
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Generic layer transfer methodology by controlled cleavage process
- Patent number 6,391,740
- Issue date May 21, 2002
- Silicon Genesis Corporation
- Nathan W. Cheung
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
MEMBRANE TRANSFER METHOD
- Publication number 20230406696
- Publication date Dec 21, 2023
- SOITEC
- François-Xavier Darras
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR PREPARING THE REMAINDER OF A DONOR SUBSTRATE, SUBSTRATE...
- Publication number 20230073003
- Publication date Mar 9, 2023
- SOITEC
- Charlotte Drazek
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method of Treating a Solid Layer Bonded to a Carrier Substrate
- Publication number 20210039279
- Publication date Feb 11, 2021
- Franz Schilling
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PREPARING THE REMAINDER OF A DONOR SUBSTRATE,SUBSTRATE P...
- Publication number 20200385265
- Publication date Dec 10, 2020
- SOITEC
- Charlotte Drazek
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHODS OF FABRICATING SEMICONDUCTOR STRUCTURES INCLUDING CAVITIES...
- Publication number 20200331750
- Publication date Oct 22, 2020
- SOITEC
- Mariam Sadaka
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR PROCESSING A MONOCRYSTALLINE SUBSTRATE AND MICROMECHANIC...
- Publication number 20200198963
- Publication date Jun 25, 2020
- INFINEON TECHNOLOGIES AG
- Andre BROCKMEIER
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR PROCESSING SILICON WAFER WITH THROUGH CAVITY STRUCTURE
- Publication number 20190233280
- Publication date Aug 1, 2019
- Shenyang Silicon Technology Co., Ltd.
- Xiang LI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SYSTEMS AND METHODS FOR LASER SPLITTING AND DEVICE LAYER TRANSFER
- Publication number 20140038392
- Publication date Feb 6, 2014
- Takao Yonehara
- B42 - BOOKBINDING ALBUMS FILES SPECIAL PRINTED MATTER
Information Patent Application
CONTROLLED PROCESS AND RESULTING DEVICE
- Publication number 20110294306
- Publication date Dec 1, 2011
- Silicon Genesis Corporation
- Francois J. Henley
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CONTROLLED PROCESS AND RESULTING DEVICE
- Publication number 20100282323
- Publication date Nov 11, 2010
- Silicon Genesis Corporation
- Francois J. Henley
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR MANUFACTURING CAPPED MEMS COMPONENTS
- Publication number 20100267183
- Publication date Oct 21, 2010
- Torsten Kramer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD AND STRUCTURE OF MONOLITHICALLY INTEGRATED PRESSURE SENSOR U...
- Publication number 20100171153
- Publication date Jul 8, 2010
- Xiao (Charles) Yang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method and device for controlled cleaving process
- Publication number 20090093103
- Publication date Apr 9, 2009
- Silicon Genesis Corporation
- Francois J. Henley
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Controlled process and resulting device
- Publication number 20080286945
- Publication date Nov 20, 2008
- Silicon Genesis Corporation
- Francois J. Henley
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Controlled cleaving process
- Publication number 20080182386
- Publication date Jul 31, 2008
- Silicon Genesis Corporation
- Francois J. Henley
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method and Device for Controlled Cleaving Process
- Publication number 20080057675
- Publication date Mar 6, 2008
- Silicon Genesis Corporation
- FRANCOIS J. HENLEY
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CONTROLLED PROCESS AND RESULTING DEVICE
- Publication number 20070123013
- Publication date May 31, 2007
- Silicon Genesis Corporation
- Francois J. Henley
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CONTROLLED PROCESS AND RESULTING DEVICE
- Publication number 20070122995
- Publication date May 31, 2007
- Silicon Genesis Corporation
- Francois J. Henley
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Process for cutting out a block of material and formation of a thin...
- Publication number 20060191627
- Publication date Aug 31, 2006
- Commissariat a I'Energie Atomique (CEA)
- Bernard Aspar
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Controlled cleaving process
- Publication number 20060141747
- Publication date Jun 29, 2006
- Silicon Genesis Corporation
- Francois J. Henley
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Controlled cleaving process
- Publication number 20050186758
- Publication date Aug 25, 2005
- Silicon Genesis Corporation
- Francois J. Henley
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method and device for controlled cleaving process
- Publication number 20050070071
- Publication date Mar 31, 2005
- Silicon Genesis Corporation
- Francois J. Henley
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method for cutting a block of material and forming a thin film
- Publication number 20030234075
- Publication date Dec 25, 2003
- Bernard Aspar
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method and device for controlled cleaving process
- Publication number 20030113983
- Publication date Jun 19, 2003
- Silicon Genesis Corporation
- Francois J. Henley
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CONTROLLED CLEAVAGE PROCESS USING PRESSURIZED FLUID
- Publication number 20020115264
- Publication date Aug 22, 2002
- Francois J. Henley
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CONTROLLED CLEAVING PROCESS
- Publication number 20020106870
- Publication date Aug 8, 2002
- Francois J. Henley
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Generic layer transfer methodology by controlled cleavage process
- Publication number 20020081823
- Publication date Jun 27, 2002
- Silicon Genesis Corporation
- Nathan W. Cheung
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Controlled cleavage using patterning
- Publication number 20020056519
- Publication date May 16, 2002
- Francois J. Henley
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Controlled cleavage process using pressurized fluid
- Publication number 20020055266
- Publication date May 9, 2002
- Silicon Genesis Corporation
- Francois J. Henley
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method and device for controlled cleaving process
- Publication number 20010026997
- Publication date Oct 4, 2001
- Francois J. Henley
- B81 - MICRO-STRUCTURAL TECHNOLOGY

by cleaving the carrier wafer

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for preparing the remainder of a donor substrate, substrate...

Method of treating a solid layer bonded to a carrier substrate

Method for processing a monocrystalline substrate and micromechanic...

Method for the material-saving production of wafers and processing...

Methods of fabricating semiconductor structures including cavities...

Method for processing a monocrystalline substrate and micromechanic...

Systems and methods for laser splitting and device layer transfer

Method and structure of monolithically integrated pressure sensor u...

Method for manufacturing capped MEMS components

Method of forming MEMS device with weakened substrate

Controlled process and resulting device

Controlled process and resulting device

Controlled cleaving process

Controlled process and resulting device

Method and device for controlled cleaving process

Controlled process and resulting device

Controlled cleaving process

Method and device for controlled cleaving process

Fabrication of close-spaced MEMS devices by method of precise adhes...

Controlled cleaving process

Method for cutting a block of material and forming a thin film

Method and device for controlled cleaving process

Controlled cleaving process

Controlled cleavage process using pressurized fluid

Silicon-on-silicon hybrid wafer assembly

Controlled cleavage process and device for patterned films

Controlled cleavage process using pressurized fluid

Method and device for controlled cleaving process

Controlled cleavage process and resulting device using beta annealing

Generic layer transfer methodology by controlled cleavage process

Patents Applicationslast 30 patents

MEMBRANE TRANSFER METHOD

METHOD FOR PREPARING THE REMAINDER OF A DONOR SUBSTRATE, SUBSTRATE...

Method of Treating a Solid Layer Bonded to a Carrier Substrate

METHOD FOR PREPARING THE REMAINDER OF A DONOR SUBSTRATE,SUBSTRATE P...

METHODS OF FABRICATING SEMICONDUCTOR STRUCTURES INCLUDING CAVITIES...

METHOD FOR PROCESSING A MONOCRYSTALLINE SUBSTRATE AND MICROMECHANIC...

METHOD FOR PROCESSING SILICON WAFER WITH THROUGH CAVITY STRUCTURE

SYSTEMS AND METHODS FOR LASER SPLITTING AND DEVICE LAYER TRANSFER

CONTROLLED PROCESS AND RESULTING DEVICE

CONTROLLED PROCESS AND RESULTING DEVICE

METHOD FOR MANUFACTURING CAPPED MEMS COMPONENTS

METHOD AND STRUCTURE OF MONOLITHICALLY INTEGRATED PRESSURE SENSOR U...

Method and device for controlled cleaving process

Controlled process and resulting device

Controlled cleaving process

Method and Device for Controlled Cleaving Process

CONTROLLED PROCESS AND RESULTING DEVICE

CONTROLLED PROCESS AND RESULTING DEVICE

Process for cutting out a block of material and formation of a thin...

Controlled cleaving process

Controlled cleaving process

Method and device for controlled cleaving process

Method for cutting a block of material and forming a thin film

Method and device for controlled cleaving process

CONTROLLED CLEAVAGE PROCESS USING PRESSURIZED FLUID

CONTROLLED CLEAVING PROCESS

Generic layer transfer methodology by controlled cleavage process

Controlled cleavage using patterning

Controlled cleavage process using pressurized fluid

Method and device for controlled cleaving process