Ceramic or glass substrates

Industry

CPC
H01L23/15

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/15Ceramic or glass substrates

Industries

Patents Grantslast 30 patents

Information Patent Grant
Chip package and method of forming the same
- Patent number 12,322,706
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuo-Lung Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for data recorder for inverter for electric veh...
- Patent number 12,323,080
- Issue date Jun 3, 2025
- BorgWarner US Technologies LLC
- Marc R. Engelhardt
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Substrate integrated with passive devices and manufacturing method...
- Patent number 12,322,669
- Issue date Jun 3, 2025
- BEIJING BOE SENSOR TECHNOLOGY CO., LTD.
- Chuncheng Che
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for an interlocking feature on a power module
- Patent number 12,316,257
- Issue date May 27, 2025
- BorgWarner US Technologies LLC
- Edward Choi
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Visual communications
- Patent number 12,312,274
- Issue date May 27, 2025
- Sococo, Inc.
- Eric Cozzi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power substrate assembly with reduced warpage
- Patent number 12,308,338
- Issue date May 20, 2025
- Littelfuse, Inc.
- Tiburcio A. Maldo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Aluminum nitride multilayer power module interposer and method
- Patent number 12,300,578
- Issue date May 13, 2025
- TriPent Power LLC
- Stephen P. Nootens
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Facilitating formation of a via in a substrate
- Patent number 12,293,926
- Issue date May 6, 2025
- MOSAIC MICROSYSTEMS LLC
- Shelby Forrester Nelson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging substrate and semiconductor apparatus comprising same
- Patent number 12,288,742
- Issue date Apr 29, 2025
- ABSOLICS INC.
- Sungjin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for cooling system and power module for inverte...
- Patent number 12,284,791
- Issue date Apr 22, 2025
- BorgWarner US Technologies LLC
- Bryan Rohl
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Systems and methods for parameter drift correction for inverter for...
- Patent number 12,279,402
- Issue date Apr 15, 2025
- BorgWarner US Technologies LLC
- Seyed R. Zarabadi
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Semiconductor device having an integrated device positioned within...
- Patent number 12,272,629
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Monsen Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pure copper material, insulating substrate, and electronic device
- Patent number 12,264,390
- Issue date Apr 1, 2025
- Mitsubishi Materials Corporation
- Yuki Ito
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Systems and methods for cooling system and power module for inverte...
- Patent number 12,261,558
- Issue date Mar 25, 2025
- BorgWarner US Technologies LLC
- Bryan Rohl
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Selective metallization of integrated circuit packages
- Patent number 12,261,123
- Issue date Mar 25, 2025
- Advanced Technical Ceramics Company
- Aaron Fitzsimmons
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded substrate and bonded substrate manufacturing method
- Patent number 12,249,547
- Issue date Mar 11, 2025
- NGK Insulators, Ltd.
- Takashi Ebigase
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming micro interconnect struc...
- Patent number 12,230,559
- Issue date Feb 18, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Francis J. Carney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device and semiconductor device
- Patent number 12,230,623
- Issue date Feb 18, 2025
- Kioxia Corporation
- Masaki Sekine
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for low inductance phase switch for inverter fo...
- Patent number 12,225,696
- Issue date Feb 11, 2025
- BorgWarner US Technologies LLC
- Mark Wendell Gose
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Systems and methods for adaptive gate driver for inverter for elect...
- Patent number 12,220,992
- Issue date Feb 11, 2025
- BorgWarner US Technologies LLC
- Seyed R. Zarabadi
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Glass carrier having protection structure and manufacturing method...
- Patent number 12,218,017
- Issue date Feb 4, 2025
- Unimicron Technology Corp.
- Wen Yu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for integrated gate driver for inverter for ele...
- Patent number 12,214,677
- Issue date Feb 4, 2025
- BorgWarner US Technologies LLC
- Mark Wendell Gose
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Embedded packaging structure, preparation method thereof, and termi...
- Patent number 12,205,876
- Issue date Jan 21, 2025
- Huawei Technologies Co., Ltd.
- Zhiqiang Xiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging structure and method for preparing same
- Patent number 12,198,942
- Issue date Jan 14, 2025
- SJ SEMICONDUCTOR(JIANGYIN) CORPORATION
- Jangshen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging substrate and method for manufacturing same
- Patent number 12,198,994
- Issue date Jan 14, 2025
- ABSOLICS INC.
- Sungjin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded body, power module substrate, power module, method for manuf...
- Patent number 12,199,006
- Issue date Jan 14, 2025
- Mitsubishi Materials Corporation
- Nobuyuki Terasaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems and methods for non-overlap enforcement for inverter for el...
- Patent number 12,194,870
- Issue date Jan 14, 2025
- Borg Warner US Technologies LLC
- Jack Lavern Glenn
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Electronic element housing package and electronic apparatus
- Patent number 12,198,992
- Issue date Jan 14, 2025
- Kyocera Corporation
- Masanori Okamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon nitride sintered body, silicon nitride substrate, and silic...
- Patent number 12,187,651
- Issue date Jan 7, 2025
- Kabushiki Kaisha Toshiba
- Katsuyuki Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid interposer of glass and silicon to reduce thermal crosstalk
- Patent number 12,191,220
- Issue date Jan 7, 2025
- Intel Corporation
- Zhimin Wan
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGING SUBSTRATE AND SEMICONDUCTOR PACKAGE COMPRISING THE SAME
- Publication number 20250174537
- Publication date May 29, 2025
- ABSOLICS INC.
- Sungjin KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GLASS INTERPOSER SEMICONDUCTOR PACKAGE WITH INTEGRATED STACK CAPACI...
- Publication number 20250174567
- Publication date May 29, 2025
- Samsung Electronics Co., Ltd.
- Yan LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR METALLIZATION THROUGH-GLASS VIAS AND A GLASS ARTICLE MAN...
- Publication number 20250174470
- Publication date May 29, 2025
- Corning Incorporated
- Mandakini Kanungo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING SUBSTRATE AND MANUFACTURING METHOD OF PACKAGING SUBSTRATE
- Publication number 20250174538
- Publication date May 29, 2025
- ABSOLICS INC.
- Bongyeol LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ceramic Substrate
- Publication number 20250162947
- Publication date May 22, 2025
- CERAMTEC GMBH
- Linda Schicker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250167063
- Publication date May 22, 2025
- Mitsubishi Electric Corporation
- Takeshi TOKOROZUKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CERAMIC SUBSTRATE UNIT AND MANUFACTURING METHOD THEREFOR
- Publication number 20250167071
- Publication date May 22, 2025
- AMOGREENTECH CO., LTD.
- Jihyung LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CORE SUBSTRATE AND INTERPOSER
- Publication number 20250167091
- Publication date May 22, 2025
- NGK Insulators, Ltd.
- Yoshitsugu WAKAZONO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THEREOF
- Publication number 20250167099
- Publication date May 22, 2025
- Fuji Electric Co., Ltd.
- Hayato NAKANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20250157996
- Publication date May 15, 2025
- Samsung Electronics Co., Ltd.
- Hyunsoo Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING MICRO INTERCONNECT STRUC...
- Publication number 20250149424
- Publication date May 8, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Francis J. CARNEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIGITAL SIGNAL PROCESSOR TO PHOTONICS INTERFACE
- Publication number 20250149521
- Publication date May 8, 2025
- MaxLinear, Inc.
- Abdelkrim El Amili
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING SUBSTRATE AND MANUFACTURING METHOD OF PACKAGING SUBSTRATE
- Publication number 20250149400
- Publication date May 8, 2025
- ABSOLICS INC.
- Bongyeol LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL-ELECTRICAL SUBSTRATE PROVIDING INTERCONNECTS FOR PHOTONIC I...
- Publication number 20250147251
- Publication date May 8, 2025
- Corning Research & Development Corporation
- Lars Martin Otfried Brusberg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING MICRO INTERCONNECT STRUC...
- Publication number 20250149425
- Publication date May 8, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Francis J. CARNEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES INCLUDING GLASS-CORED SUBSTRATES WITH S...
- Publication number 20250149455
- Publication date May 8, 2025
- Intel Corporation
- Nicholas Haehn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20250149466
- Publication date May 8, 2025
- Samsung Electronics Co., Ltd.
- Jaesic Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING SUBSTRATE AND SEMICONDUCTOR PACKAGE COMPRISING THE SAME
- Publication number 20250149468
- Publication date May 8, 2025
- ABSOLICS INC.
- YONG HA WOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING SUBSTRATE AND MANUFACTURING METHOD OF PACKAGING SUBSTRATE
- Publication number 20250140707
- Publication date May 1, 2025
- ABSOLICS INC.
- Tae Kyoung KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE BONDING STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250140733
- Publication date May 1, 2025
- AG MATERIALS TECHNOLOGY CO., LTD.
- Tung-Han CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING SUBSTRATE AND MANUFACTURING METHOD OF PACKAGING SUBSTRATE
- Publication number 20250140669
- Publication date May 1, 2025
- ABSOLICS INC.
- Bongyeol LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GLASS CORES WITH EMBEDDED POWER DELIVERY COMPONENTS
- Publication number 20250132264
- Publication date Apr 24, 2025
- Intel Corporation
- Huong Thu Do
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR ADAPTIVE GATE DRIVER FOR INVERTER FOR ELECT...
- Publication number 20250133708
- Publication date Apr 24, 2025
- BorgWarner US Technologies LLC
- Seyed R. Zarabadi
- B60 - VEHICLES IN GENERAL
Information Patent Application
CHIP PACKAGE
- Publication number 20250132260
- Publication date Apr 24, 2025
- Ping-Jung Yang
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
SYSTEMS AND METHODS FOR INTEGRATED GATE DRIVER FOR INVERTER FOR ELE...
- Publication number 20250126762
- Publication date Apr 17, 2025
- BorgWarner US Technologies LLC
- Mark Wendell Gose
- B60 - VEHICLES IN GENERAL
Information Patent Application
PACKAGE SUBSTRATES WITH COMPONENTS INCLUDED IN CAVITIES OF GLASS CORES
- Publication number 20250126814
- Publication date Apr 17, 2025
- Intel Corporation
- Brandon Christian Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CANTILEVERED DIES IN CERAMIC PACKAGES
- Publication number 20250125203
- Publication date Apr 17, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Ramlah Binte ABDUL RAZAK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D CHIP PACKAGE BASED ON VERTICAL-THROUGH-VIA CONNECTOR
- Publication number 20250125241
- Publication date Apr 17, 2025
- iCometrue Company Ltd.
- Ping-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF PACKAGING SUBSTRATE AND PACKAGING SUBSTRATE...
- Publication number 20250125270
- Publication date Apr 17, 2025
- ABSOLICS INC.
- Chae Mook LIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATES WITH COMPONENTS INCLUDED IN CAVITIES OF GLASS CORES
- Publication number 20250125201
- Publication date Apr 17, 2025
- Intel Corporation
- Brandon Christian Marin
- H01 - BASIC ELECTRIC ELEMENTS

Ceramic or glass substrates

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Chip package and method of forming the same

Systems and methods for data recorder for inverter for electric veh...

Substrate integrated with passive devices and manufacturing method...

Systems and methods for an interlocking feature on a power module

Visual communications

Power substrate assembly with reduced warpage

Aluminum nitride multilayer power module interposer and method

Facilitating formation of a via in a substrate

Packaging substrate and semiconductor apparatus comprising same

Systems and methods for cooling system and power module for inverte...

Systems and methods for parameter drift correction for inverter for...

Semiconductor device having an integrated device positioned within...

Pure copper material, insulating substrate, and electronic device

Systems and methods for cooling system and power module for inverte...

Selective metallization of integrated circuit packages

Bonded substrate and bonded substrate manufacturing method

Semiconductor device and method of forming micro interconnect struc...

Method for manufacturing semiconductor device and semiconductor device

Systems and methods for low inductance phase switch for inverter fo...

Systems and methods for adaptive gate driver for inverter for elect...

Glass carrier having protection structure and manufacturing method...

Systems and methods for integrated gate driver for inverter for ele...

Embedded packaging structure, preparation method thereof, and termi...

Packaging structure and method for preparing same

Packaging substrate and method for manufacturing same

Bonded body, power module substrate, power module, method for manuf...

Systems and methods for non-overlap enforcement for inverter for el...

Electronic element housing package and electronic apparatus

Silicon nitride sintered body, silicon nitride substrate, and silic...

Hybrid interposer of glass and silicon to reduce thermal crosstalk

Patents Applicationslast 30 patents

PACKAGING SUBSTRATE AND SEMICONDUCTOR PACKAGE COMPRISING THE SAME

GLASS INTERPOSER SEMICONDUCTOR PACKAGE WITH INTEGRATED STACK CAPACI...

METHOD FOR METALLIZATION THROUGH-GLASS VIAS AND A GLASS ARTICLE MAN...

PACKAGING SUBSTRATE AND MANUFACTURING METHOD OF PACKAGING SUBSTRATE

Ceramic Substrate

SEMICONDUCTOR DEVICE

CERAMIC SUBSTRATE UNIT AND MANUFACTURING METHOD THEREFOR

CORE SUBSTRATE AND INTERPOSER

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THEREOF

SEMICONDUCTOR PACKAGES

SEMICONDUCTOR DEVICE AND METHOD OF FORMING MICRO INTERCONNECT STRUC...

DIGITAL SIGNAL PROCESSOR TO PHOTONICS INTERFACE

PACKAGING SUBSTRATE AND MANUFACTURING METHOD OF PACKAGING SUBSTRATE

OPTICAL-ELECTRICAL SUBSTRATE PROVIDING INTERCONNECTS FOR PHOTONIC I...

SEMICONDUCTOR DEVICE AND METHOD OF FORMING MICRO INTERCONNECT STRUC...

INTEGRATED CIRCUIT PACKAGES INCLUDING GLASS-CORED SUBSTRATES WITH S...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

PACKAGING SUBSTRATE AND SEMICONDUCTOR PACKAGE COMPRISING THE SAME

PACKAGING SUBSTRATE AND MANUFACTURING METHOD OF PACKAGING SUBSTRATE

DIE BONDING STRUCTURE AND METHOD OF MANUFACTURING THE SAME

PACKAGING SUBSTRATE AND MANUFACTURING METHOD OF PACKAGING SUBSTRATE

GLASS CORES WITH EMBEDDED POWER DELIVERY COMPONENTS

SYSTEMS AND METHODS FOR ADAPTIVE GATE DRIVER FOR INVERTER FOR ELECT...

CHIP PACKAGE

SYSTEMS AND METHODS FOR INTEGRATED GATE DRIVER FOR INVERTER FOR ELE...

PACKAGE SUBSTRATES WITH COMPONENTS INCLUDED IN CAVITIES OF GLASS CORES

CANTILEVERED DIES IN CERAMIC PACKAGES

3D CHIP PACKAGE BASED ON VERTICAL-THROUGH-VIA CONNECTOR

MANUFACTURING METHOD OF PACKAGING SUBSTRATE AND PACKAGING SUBSTRATE...

PACKAGE SUBSTRATES WITH COMPONENTS INCLUDED IN CAVITIES OF GLASS CORES