Ceramic or glass substrates

Industry

CPC
H01L23/15

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/15Ceramic or glass substrates

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method of forming ultra high density embed...
- Patent number 12,148,677
- Issue date Nov 19, 2024
- JCET Semiconductor (Shaoxing) Co., Ltd.
- See Chian Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hermetic metallized via with improved reliability
- Patent number 12,131,985
- Issue date Oct 29, 2024
- Corning Incorporated
- Mandakini Kanungo
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for forming semiconductor package and semiconductor package
- Patent number 12,125,776
- Issue date Oct 22, 2024
- Yibu Semiconductor Co., Ltd.
- Weiping Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for bidirectional message architecture for inve...
- Patent number 12,122,251
- Issue date Oct 22, 2024
- BorgWarner US Technologies LLC
- Jack Lavern Glenn
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Copper/ceramic joined body and insulating circuit substrate
- Patent number 12,125,765
- Issue date Oct 22, 2024
- Mitsubishi Materials Corporation
- Nobuyuki Terasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded body, ceramic copper circuit substrate, and semiconductor de...
- Patent number 12,115,603
- Issue date Oct 15, 2024
- Kabushiki Kaisha Toshiba
- Maki Yonetsu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
DBC substrate for power semiconductor devices, method for fabricati...
- Patent number 12,119,284
- Issue date Oct 15, 2024
- Infineon Technologies Austria AG
- Alexander Roth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a supporting glass substrate
- Patent number 12,119,278
- Issue date Oct 15, 2024
- Nippon Electric Glass Co., Ltd.
- Hiroki Katayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-substrate via structure and method of manufacture
- Patent number 12,119,294
- Issue date Oct 15, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through electrode substrate and mounting substrate
- Patent number 12,119,293
- Issue date Oct 15, 2024
- Dai Nippon Printing Co., Ltd.
- Shinji Maekawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor structure
- Patent number 12,119,229
- Issue date Oct 15, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Yu-Hsiang Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for integrated gate driver for inverter for ele...
- Patent number 12,103,406
- Issue date Oct 1, 2024
- DELPHI TECHNOLOGIES IP LIMITED
- Mark Wendell Gose
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Power module
- Patent number 12,107,023
- Issue date Oct 1, 2024
- Kabushiki Kaisha Toshiba
- Keiichiro Matsuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Glass core substrate and manufacturing method thereof
- Patent number 12,100,632
- Issue date Sep 24, 2024
- Dyi-Chung Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrically conductive vias and methods for producing same
- Patent number 12,100,647
- Issue date Sep 24, 2024
- Samtec, Inc.
- Alan D. Nolet
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wrap-around source/drain method of making contacts for backside metals
- Patent number 12,100,761
- Issue date Sep 24, 2024
- Intel Corporation
- Patrick Morrow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wrap-around source/drain method of making contacts for backside metals
- Patent number 12,100,762
- Issue date Sep 24, 2024
- Intel Corporation
- Patrick Morrow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dielectric liners on through glass vias
- Patent number 12,087,623
- Issue date Sep 10, 2024
- YIELD ENGINEERING SYSTEMS, INC.
- Ramakanth Alapati
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-hole electrode substrate
- Patent number 12,080,637
- Issue date Sep 3, 2024
- Dai Nippon Printing Co., Ltd.
- Satoru Kuramochi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method of wafer bonding
- Patent number 12,080,622
- Issue date Sep 3, 2024
- United Microelectronics Corp.
- Chia-Liang Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,074,185
- Issue date Aug 27, 2024
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Naoki Kakoiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method for glass substrate and glass substrate
- Patent number 12,068,181
- Issue date Aug 20, 2024
- AGC Inc.
- Yuha Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrate and method of manufacturing the same
- Patent number 12,068,210
- Issue date Aug 20, 2024
- Toppan Printing Co., Ltd.
- Yuki Umemura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module
- Patent number 12,068,289
- Issue date Aug 20, 2024
- Rohm Co., Ltd.
- Kenichi Onodera
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package
- Patent number 12,062,618
- Issue date Aug 13, 2024
- Ping-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices and methods related to metallization of ceramic substrates...
- Patent number 12,058,806
- Issue date Aug 6, 2024
- Skyworks Solutions, Inc.
- Shaul Branchevsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component and semiconductor device
- Patent number 12,051,662
- Issue date Jul 30, 2024
- Rohm Co., Ltd.
- Masatoshi Aketa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for reducing via formation impact on electronic...
- Patent number 12,046,481
- Issue date Jul 23, 2024
- Corning Incorporated
- Sean Matthew Garner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with die mounted to an insulating substrate an...
- Patent number 12,040,263
- Issue date Jul 16, 2024
- STMicroelectronics S.r.l.
- Roberto Tiziani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 12,040,255
- Issue date Jul 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jen-Chun Liao
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CIRCUIT BOARD
- Publication number 20240387344
- Publication date Nov 21, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Chi Hyeon JEONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CERAMIC SUBSTRATE FOR POWER MODULE, METHOD FOR MANUFACTURING SAME,...
- Publication number 20240387438
- Publication date Nov 21, 2024
- AMOSENSE CO., LTD.
- Jihyung LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE WITH EMBEDDED ELEMENTS AND MANUFACTURING METHOD OF THE SAME
- Publication number 20240387342
- Publication date Nov 21, 2024
- ABSOLICS INC.
- Tae Kyoung KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL MODULE
- Publication number 20240379643
- Publication date Nov 14, 2024
- InnoLight Technology (Suzhou) Ltd.
- Zhen-Zhong WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Hybrid organic and non-organic interposer with embedded component a...
- Publication number 20240379516
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Monsen Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE
- Publication number 20240379566
- Publication date Nov 14, 2024
- Ping-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD
- Publication number 20240379513
- Publication date Nov 14, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Chi Hyeon JEONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE WITH A GLASS INTERPOSER
- Publication number 20240371714
- Publication date Nov 7, 2024
- ADVANCED MICRO DEVICES, INC.
- Deepak Vasant KULKARNI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE
- Publication number 20240371647
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- YU-HSIANG HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND CORRESPONDING METHOD OF MANUFACTURING SEMI...
- Publication number 20240371738
- Publication date Nov 7, 2024
- STMicroelectronics S.r.l
- Roberto TIZIANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUPPORT GLASS SUBSTRATE, MULTI-LAYER BODY, METHOD FOR PRODUCING MUL...
- Publication number 20240360027
- Publication date Oct 31, 2024
- NIPPON ELECTRIC GLASSS CO., LTD.
- Miyako TAKEDA
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Application
CIRCUIT CHIPS INCORPORATING NEGATIVE POISSON`S RATIO STRUCTURES
- Publication number 20240363458
- Publication date Oct 31, 2024
- Joon Bu Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER/CERAMIC BONDED BODY AND INSULATING CIRCUIT SUBSTRATE
- Publication number 20240363480
- Publication date Oct 31, 2024
- MITSUBISHI MATERIALS CORPORATION
- Nobuyuki Terasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE
- Publication number 20240363595
- Publication date Oct 31, 2024
- ROHM CO., LTD.
- Kenichi ONODERA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER/CERAMIC BONDED BODY AND INSULATING CIRCUIT SUBSTRATE
- Publication number 20240363481
- Publication date Oct 31, 2024
- MITSUBISHI MATERIALS CORPORATION
- Nobuyuki Terasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GLASS PACKAGE SUBSTRATE WITH CHIP DISAGGREGATION INTERFACE
- Publication number 20240355752
- Publication date Oct 24, 2024
- Intel Corporation
- Telesphor Kamgaing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND POWER CONVERSION APPARATUS
- Publication number 20240355724
- Publication date Oct 24, 2024
- Mitsubishi Electric Corporation
- Tatsuya KAWASE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISAGGREGATED PACKAGE SUBSTRATES WITH GLASS CORES
- Publication number 20240355749
- Publication date Oct 24, 2024
- Intel Corporation
- Jeremy Ecton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS TO REDUCE STRESS BETWEEN SOCKETS AND ASSOCIAT...
- Publication number 20240355758
- Publication date Oct 24, 2024
- Intel Corporation
- Steven Adam Klein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS TO REDUCE DELAMINATION IN HYBRID CORES
- Publication number 20240347402
- Publication date Oct 17, 2024
- Intel Corporation
- Jeremy Ecton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT AND SEMICONDUCTOR DEVICE
- Publication number 20240339421
- Publication date Oct 10, 2024
- ROHM CO., LTD.
- Masatoshi AKETA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240332132
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jen-Chun Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DRY SEED REMOVAL BY LASER FOR LINE-SPACE AND VIA FORMATION
- Publication number 20240332153
- Publication date Oct 3, 2024
- Intel Corporation
- Tchefor NDUKUM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATES WITH A GLASS CORE AND GLASS BUILDUP LAYERS
- Publication number 20240332155
- Publication date Oct 3, 2024
- Intel Corporation
- Jianyong Mo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SCRIBED CERAMIC CIRCUIT SUBSTRATE, CERAMIC CIRCUIT SUBSTRATE, METHO...
- Publication number 20240332123
- Publication date Oct 3, 2024
- Kabushiki Kaisha Toshiba
- Yukihisa MATSUMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS TO MITIGATE ELECTROMIGRATION IN INTEGRATED CI...
- Publication number 20240332134
- Publication date Oct 3, 2024
- Intel Corporation
- Liang He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GLASS-INTEGRATED INDUCTORS IN INTEGRATED CIRCUIT PACKAGES
- Publication number 20240332100
- Publication date Oct 3, 2024
- Intel Corporation
- Pratyush Mishra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES INCLUDING SUBSTRATES WITH ENCAPSULATED...
- Publication number 20240321754
- Publication date Sep 26, 2024
- Intel Corporation
- Kristof Kuwawi Darmawikarta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING GLASS CORE SUBSTRATE AND METHOD OF...
- Publication number 20240321755
- Publication date Sep 26, 2024
- Samsung Electronics Co., Ltd.
- Myungsam KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GLASS CORE SUBSTRATE WITH LGA NOTCH
- Publication number 20240321656
- Publication date Sep 26, 2024
- Intel Corporation
- Gang DUAN
- H01 - BASIC ELECTRIC ELEMENTS

Ceramic or glass substrates

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device and method of forming ultra high density embed...

Hermetic metallized via with improved reliability

Method for forming semiconductor package and semiconductor package

Systems and methods for bidirectional message architecture for inve...

Copper/ceramic joined body and insulating circuit substrate

Bonded body, ceramic copper circuit substrate, and semiconductor de...

DBC substrate for power semiconductor devices, method for fabricati...

Method of manufacturing a supporting glass substrate

Through-substrate via structure and method of manufacture

Through electrode substrate and mounting substrate

Method of manufacturing semiconductor structure

Systems and methods for integrated gate driver for inverter for ele...

Power module

Glass core substrate and manufacturing method thereof

Electrically conductive vias and methods for producing same

Wrap-around source/drain method of making contacts for backside metals

Wrap-around source/drain method of making contacts for backside metals

Dielectric liners on through glass vias

Through-hole electrode substrate

Semiconductor structure and method of wafer bonding

Semiconductor device

Manufacturing method for glass substrate and glass substrate

Package substrate and method of manufacturing the same

Power module

Chip package

Devices and methods related to metallization of ceramic substrates...

Electronic component and semiconductor device

Systems and methods for reducing via formation impact on electronic...

Semiconductor device with die mounted to an insulating substrate an...

Semiconductor package and manufacturing method thereof

Patents Applicationslast 30 patents

CIRCUIT BOARD

CERAMIC SUBSTRATE FOR POWER MODULE, METHOD FOR MANUFACTURING SAME,...

SUBSTRATE WITH EMBEDDED ELEMENTS AND MANUFACTURING METHOD OF THE SAME

OPTICAL MODULE

Hybrid organic and non-organic interposer with embedded component a...

CHIP PACKAGE

CIRCUIT BOARD

CHIP PACKAGE WITH A GLASS INTERPOSER

METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE

SEMICONDUCTOR DEVICE AND CORRESPONDING METHOD OF MANUFACTURING SEMI...

SUPPORT GLASS SUBSTRATE, MULTI-LAYER BODY, METHOD FOR PRODUCING MUL...

CIRCUIT CHIPS INCORPORATING NEGATIVE POISSON`S RATIO STRUCTURES

COPPER/CERAMIC BONDED BODY AND INSULATING CIRCUIT SUBSTRATE

POWER MODULE

COPPER/CERAMIC BONDED BODY AND INSULATING CIRCUIT SUBSTRATE

GLASS PACKAGE SUBSTRATE WITH CHIP DISAGGREGATION INTERFACE

SEMICONDUCTOR DEVICE AND POWER CONVERSION APPARATUS

DISAGGREGATED PACKAGE SUBSTRATES WITH GLASS CORES

METHODS AND APPARATUS TO REDUCE STRESS BETWEEN SOCKETS AND ASSOCIAT...

METHODS AND APPARATUS TO REDUCE DELAMINATION IN HYBRID CORES

ELECTRONIC COMPONENT AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

DRY SEED REMOVAL BY LASER FOR LINE-SPACE AND VIA FORMATION

SUBSTRATES WITH A GLASS CORE AND GLASS BUILDUP LAYERS

SCRIBED CERAMIC CIRCUIT SUBSTRATE, CERAMIC CIRCUIT SUBSTRATE, METHO...

METHODS AND APPARATUS TO MITIGATE ELECTROMIGRATION IN INTEGRATED CI...

GLASS-INTEGRATED INDUCTORS IN INTEGRATED CIRCUIT PACKAGES

INTEGRATED CIRCUIT PACKAGES INCLUDING SUBSTRATES WITH ENCAPSULATED...

SEMICONDUCTOR PACKAGE INCLUDING GLASS CORE SUBSTRATE AND METHOD OF...

GLASS CORE SUBSTRATE WITH LGA NOTCH