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ELECTRICITY
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Electric elements
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SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
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Details of semiconductor or other solid state devices
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H01L23/15
Ceramic or glass substrates
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Patents Grants
last 30 patents
Information
Patent Grant
Glass core patch with in situ fabricated fan-out layer to enable di...
Patent number
11,978,685
Issue date
May 7, 2024
Intel Corporation
Srinivas Pietambaram
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Interposer
Patent number
11,973,013
Issue date
Apr 30, 2024
AMOSENSE CO., LTD.
Changwoo Oh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Unit with wiring board, module, and equipment
Patent number
11,972,990
Issue date
Apr 30, 2024
Canon Kabushiki Kaisha
Satoshi Nozu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Silica-containing substrates with vias having an axially variable s...
Patent number
11,972,993
Issue date
Apr 30, 2024
Corning Incorporated
Rachel Eileen Dahlberg
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Packaging substrate, and semiconductor device comprising same
Patent number
11,967,542
Issue date
Apr 23, 2024
ABSOLICS INC.
Sungjin Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and manufacturing method thereof
Patent number
11,961,742
Issue date
Apr 16, 2024
Amkor Technology Singapore Holding Pte Ltd.
Jong Sik Paek
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chip package structure and method for manufacturing the same, and m...
Patent number
11,929,313
Issue date
Mar 12, 2024
Shanghai Tianma Micro-Electronics Co., Ltd.
Mingyu Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bonded substrate and manufacturing method of bonded substrate
Patent number
11,917,752
Issue date
Feb 27, 2024
NGK Insulators, Ltd.
Takashi Ebigase
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Embedded die architecture and method of making
Patent number
11,901,248
Issue date
Feb 13, 2024
Intel Corporation
Robert L. Sankman
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor module
Patent number
11,901,272
Issue date
Feb 13, 2024
Fuji Electric Co., Ltd.
Yoshinori Uezato
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chip package
Patent number
11,894,306
Issue date
Feb 6, 2024
Ping-Jung Yang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Manufacturing method of package structure
Patent number
11,895,780
Issue date
Feb 6, 2024
Unimicron Technology Corp.
Kai-Ming Yang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for manufacturing glass device, and glass device
Patent number
11,881,414
Issue date
Jan 23, 2024
Toppan Printing Co., Ltd.
Masashi Sawadaishi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method for supporting ultra-thin semicondu...
Patent number
11,881,398
Issue date
Jan 23, 2024
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Gordon M. Grivna
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of forming integrated circuit package
Patent number
11,876,026
Issue date
Jan 16, 2024
Medtronic, Inc.
Chunho Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Nanowires plated on nanoparticles
Patent number
11,869,864
Issue date
Jan 9, 2024
Texas Instruments Incorporated
Benjamin Stassen Cook
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package component
Patent number
11,869,857
Issue date
Jan 9, 2024
AMOSENSE CO., LTD
Ji-Hyung Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
High dielectric constant carrier based packaging with enhanced WG m...
Patent number
11,862,584
Issue date
Jan 2, 2024
NXP USA, INC.
Jinbang Tang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
High-strength zirconia-alumina composite ceramic substrate applied...
Patent number
11,858,850
Issue date
Jan 2, 2024
LEATEC FINE CERAMICS CO., LTD.
Chih-Hung Chu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package structure on a PCB and semiconductor module i...
Patent number
11,848,255
Issue date
Dec 19, 2023
Samsung Electronics Co., Ltd.
YoungJoon Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
System for cooling a metal-ceramic substrate, a metal-ceramic subst...
Patent number
11,848,248
Issue date
Dec 19, 2023
Rogers Germany GmbH
Andreas Meyer
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated shield package and method
Patent number
11,848,275
Issue date
Dec 19, 2023
Amkor Technology Singapore Holding Pte Ltd.
Paul Mescher
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package substrate with reduced interconnect stress
Patent number
11,824,013
Issue date
Nov 21, 2023
Intel Corporation
Lauren A. Link
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Recycled glass and glass-ceramic carrier sustrates
Patent number
11,823,967
Issue date
Nov 21, 2023
Corning Incorporated
Robert Alan Bellman
C03 - GLASS MINERAL OR SLAG WOOL
Information
Patent Grant
Carrier, assembly comprising a substrate and a carrier, and method...
Patent number
11,810,845
Issue date
Nov 7, 2023
OSRAM OLED GmbH
Jörg Erich Sorg
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for producing a metal-ceramic substrate with electrically co...
Patent number
11,804,383
Issue date
Oct 31, 2023
Infineon Technologies AG
Alexander Roth
C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information
Patent Grant
Ceramic/aluminum bonded body, insulating substrate, LED module, cer...
Patent number
11,798,856
Issue date
Oct 24, 2023
Mitsubishi Materials Corporation
Nobuyuki Terasaki
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method for isolating a conductive via from a glass substrate
Patent number
11,798,816
Issue date
Oct 24, 2023
University of Central Florida Research Foundation, Inc.
Omar Saad Ahmed
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Fluidic flow channel over active surface of a die
Patent number
11,798,854
Issue date
Oct 24, 2023
Arvin Emadi
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Method of metalizing a glass article
Patent number
11,798,815
Issue date
Oct 24, 2023
Corning Incorporated
Philip Simon Brown
C03 - GLASS MINERAL OR SLAG WOOL
Patents Applications
last 30 patents
Information
Patent Application
ELECTRICAL MODULE AND METHOD OF MANUFACTURING AN ELECTRICAL MODULE
Publication number
20240145323
Publication date
May 2, 2024
ROLLS-ROYCE DEUTSCHLAND LTD & CO KG
Uwe Waltrich
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME
Publication number
20240145322
Publication date
May 2, 2024
Medtronic, Inc.
Chunho KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SUBSTRATE INTEGRATED WITH PASSIVE DEVICES AND MANUFACTURING METHOD...
Publication number
20240145321
Publication date
May 2, 2024
BOE TECHNOLOGY GROUP CO., LTD.
Chuncheng CHE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
COMPOSITE ELECTRONIC COMPONENT
Publication number
20240136342
Publication date
Apr 25, 2024
Murata Manufacturing Co., Ltd.
Yukihiro FUJITA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME
Publication number
20240136262
Publication date
Apr 25, 2024
Samsung Electronics Co., Ltd.
DONGHYEON JANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
EMBEDDED DIE ARCHITECTURE AND METHOD OF MAKING
Publication number
20240128138
Publication date
Apr 18, 2024
Intel Corporation
Robert L. Sankman
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGING SUBSTRATE AND SEMICONDUCTOR APPARATUS COMPRISING SAME
Publication number
20240128177
Publication date
Apr 18, 2024
ABSOLICS INC.
Sungjin KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Carrier Substrate
Publication number
20240120244
Publication date
Apr 11, 2024
Solid-tech Co., Ltd.
Tzu Chien Hung
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP PACKAGE
Publication number
20240120281
Publication date
Apr 11, 2024
Ping-Jung Yang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED HORIZONTAL VARISTOR ON GLASS CORE FOR VOLTAGE REGULATION
Publication number
20240113048
Publication date
Apr 4, 2024
Intel Corporation
Srinivasan Raman
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SINGULATION OF INTEGRATED CIRCUIT PACKAGE SUBSTRATES WITH GLASS CORES
Publication number
20240112970
Publication date
Apr 4, 2024
Intel Corporation
Hanyu Song
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS AND APPARATUSES FOR THROUGH-GLASS VIAS
Publication number
20240112973
Publication date
Apr 4, 2024
Intel Corporation
Jeremy D. Ecton
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SINGULATION OF INTEGRATED CIRCUIT PACKAGE SUBSTRATES WITH GLASS CORES
Publication number
20240113072
Publication date
Apr 4, 2024
Intel Corporation
Whitney Bryks
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
POROUS POLYMER DIELECTRIC LAYER ON CORE
Publication number
20240113009
Publication date
Apr 4, 2024
Intel Corporation
Whitney Bryks
B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information
Patent Application
EMBEDDED THIN FILM VARISTOR IN THROUGH GLASS VIAS
Publication number
20240113046
Publication date
Apr 4, 2024
Intel Corporation
Jason Scott Steill
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SINGULATION OF INTEGRATED CIRCUIT PACKAGE SUBSTRATES WITH GLASS CORES
Publication number
20240112971
Publication date
Apr 4, 2024
Intel Corporation
Yiqun Bai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DUAL SIDED EMBEDDED PASSIVES VIA PANEL LEVEL THERMAL COMPRESSION BO...
Publication number
20240113000
Publication date
Apr 4, 2024
Intel Corporation
Kristof Darmawikarta
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICROELECTRONICS PACKAGES WITH PHOTO-INTEGRATED GLASS INTERPOSER
Publication number
20240112972
Publication date
Apr 4, 2024
Intel Corporation
Hiroki Tanaka
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WIRING SUBSTRATE
Publication number
20240113008
Publication date
Apr 4, 2024
Niterra Co., Ltd.
Kensuke MATSUHASHI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MULTICHIP IC DEVICES IN GLASS MEDIUM & INCLUDING AN INTERCONNECT BR...
Publication number
20240113029
Publication date
Apr 4, 2024
Intel Corporation
Jeremy Ecton
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SYSTEMS AND METHODS FOR POWER MODULE FOR INVERTER FOR ELECTRIC VEHICLE
Publication number
20240105534
Publication date
Mar 28, 2024
DELPHI TECHNOLOGIES IP LIMITED
David Paul Buehler
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
IMPLANTATION OF SPECIES ON GLASS CORE SURFACE FOR LOW LOSS AND HIGH...
Publication number
20240105571
Publication date
Mar 28, 2024
Intel Corporation
Brandon C. MARIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
REDISTRIBUTION LAYERS, AND RELATED METHODS AND DEVICES
Publication number
20240105574
Publication date
Mar 28, 2024
Micron Technology, Inc.
M. Ataul Karim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SURFACE FINISH WITH METAL DOME
Publication number
20240105580
Publication date
Mar 28, 2024
Intel Corporation
Kristof DARMAWIKARTA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP PACKAGING METHOD AND CHIP PACKAGING STRUCTURE
Publication number
20240105532
Publication date
Mar 28, 2024
Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
Zhigang PAN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SYSTEMS AND METHODS FOR POWER MODULE FOR INVERTER FOR ELECTRIC VEHICLE
Publication number
20240105533
Publication date
Mar 28, 2024
DELPHI TECHNOLOGIES IP LIMITED
David Paul Buehler
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CIRCUIT BOARD FOR HIGH FREQUENCY DEVICES, AND HIGH FREQUENCY DEVICE
Publication number
20240098891
Publication date
Mar 21, 2024
AGC Inc.
Takeyuki KATO
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
PACKAGING SUBSTRATE, SEMICONDUCTOR PACKAGE, PACKAGING SUBSTRATE PRE...
Publication number
20240096724
Publication date
Mar 21, 2024
ABSOLICS INC.
Sungjin KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
COPPER CLAD LAMINATE (CCL) FOR PLATING PADS WITHIN A GLASS CAVITY F...
Publication number
20240087971
Publication date
Mar 14, 2024
Intel Corporation
Brandon C. MARIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FAN-OUT PACKAGING UNIT USED IN POP PACKAGING AND METHOD FOR MANUFAC...
Publication number
20240088008
Publication date
Mar 14, 2024
SJ Semiconductor(Jiangyin) Corporation
Yenheng Chen
H01 - BASIC ELECTRIC ELEMENTS