Chemical cleaning

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H01L2224/80011

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/80011Chemical cleaning

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Method for fabricating hybrid bonded structure
- Patent number 12,021,103
- Issue date Jun 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Bo-Tsung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device for bonding chips
- Patent number 11,990,463
- Issue date May 21, 2024
- EV Group E. Thallner GmbH
- Markus Wimplinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-dielectric bonding method and structure
- Patent number 11,978,719
- Issue date May 7, 2024
- Yangtze Memory Technologies Co., Ltd.
- Siping Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond enhancement structure in microelectronics for trapping contami...
- Patent number 11,967,575
- Issue date Apr 23, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Guilian Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing
- Patent number 11,916,031
- Issue date Feb 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Chia Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive barrier direct hybrid bonding
- Patent number 11,830,838
- Issue date Nov 28, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding system and bonding method
- Patent number 11,817,338
- Issue date Nov 14, 2023
- Tokyo Electron Limited
- Yoshitaka Otsuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-dielectric bonding method and structure
- Patent number 11,798,913
- Issue date Oct 24, 2023
- Yangtze Memory Technologies Co., Ltd.
- Siping Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and device for bonding of chips
- Patent number 11,764,198
- Issue date Sep 19, 2023
- EV Group E. Thallner GmbH
- Markus Wimplinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reliable hybrid bonded apparatus
- Patent number 11,742,314
- Issue date Aug 29, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die processing
- Patent number 11,742,315
- Issue date Aug 29, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor device with re-fill layer
- Patent number 11,646,292
- Issue date May 9, 2023
- NANYA TECHNOLOGY CORPORATION
- Shing-Yih Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, fabrication method for a semiconductor device...
- Patent number 11,569,123
- Issue date Jan 31, 2023
- Sony Corporation
- Yoshihisa Kagawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-dielectric bonding method and structure
- Patent number 11,495,569
- Issue date Nov 8, 2022
- Yangtze Memory Technologies Co., Ltd.
- Siping Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid bonded structure
- Patent number 11,437,422
- Issue date Sep 6, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Bo-Tsung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing
- Patent number 11,335,656
- Issue date May 17, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Chia Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond enhancement structure in microelectronics for trapping contami...
- Patent number 11,296,044
- Issue date Apr 5, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Guilian Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive barrier direct hybrid bonding
- Patent number 11,264,345
- Issue date Mar 1, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures and methods for forming same
- Patent number 11,195,748
- Issue date Dec 7, 2021
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid bonding method for semiconductor wafers and related three-di...
- Patent number 11,127,776
- Issue date Sep 21, 2021
- LFoundry S.r.l.
- Giovanni De Amicis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding method with electron-stimulated desorption
- Patent number 11,081,463
- Issue date Aug 3, 2021
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Frank Fournel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die processing
- Patent number 10,985,133
- Issue date Apr 20, 2021
- INVENSAS BONDING TECHNOLOGIES, INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, fabrication method for a semiconductor device...
- Patent number 10,985,102
- Issue date Apr 20, 2021
- Sony Corporation
- Yoshihisa Kagawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid wafer-to-wafer bonding and methods of surface preparation fo...
- Patent number 10,886,249
- Issue date Jan 5, 2021
- ams International AG
- Jens Hofrichter
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for bonding wafers and bonding tool
- Patent number 10,872,873
- Issue date Dec 22, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chien-Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing
- Patent number 10,784,219
- Issue date Sep 22, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Chia Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die processing
- Patent number 10,714,449
- Issue date Jul 14, 2020
- INVENSAS BONDING TECHNOLOGIES, INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid bonded structure
- Patent number 10,672,820
- Issue date Jun 2, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Bo-Tsung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die processing
- Patent number 10,515,925
- Issue date Dec 24, 2019
- INVENSAS BONDING TECHNOLOGIES, INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, fabrication method for a semiconductor device...
- Patent number 10,431,621
- Issue date Oct 1, 2019
- Sony Corporation
- Yoshihisa Kagawa
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, CLEANING DEVICE, CLE...
- Publication number 20240321818
- Publication date Sep 26, 2024
- Resonac Corporation
- Toshiaki SHIRASAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING HYBRID BONDED STRUCTURE
- Publication number 20240313026
- Publication date Sep 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Bo-Tsung TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD FOR BONDING TRANSPARENT CONDUCTOR SUBSTRATES
- Publication number 20240312951
- Publication date Sep 19, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE BARRIER DIRECT HYBRID BONDING
- Publication number 20240243085
- Publication date Jul 18, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structures and Processes for Void-Free Hybrid Bonding
- Publication number 20240222313
- Publication date Jul 4, 2024
- International Business Machines Corporation
- Roy R. Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED PROCESS FLOWS FOR HYBRID BONDING
- Publication number 20240170443
- Publication date May 23, 2024
- Ruiping WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND DEVICE FOR BONDING OF CHIPS
- Publication number 20240170474
- Publication date May 23, 2024
- EV GROUP E. THALLNER GMBH
- Markus Wimplinger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
NEXT GENERATION BONDING LAYER FOR 3D HETEROGENEOUS INTEGRATION
- Publication number 20240071984
- Publication date Feb 29, 2024
- TOKYO ELECTRON LIMITED
- Kandabara Tapily
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
BONDING SYSTEM
- Publication number 20240047257
- Publication date Feb 8, 2024
- TOKYO ELECTRON LIMITED
- Yoshitaka Otsuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RELIABLE HYBRID BONDED APPARATUS
- Publication number 20240021573
- Publication date Jan 18, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE PROCESSING
- Publication number 20240021572
- Publication date Jan 18, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER SHAPE CONTROL FOR W2W BONDING
- Publication number 20230326767
- Publication date Oct 12, 2023
- TOKYO ELECTRON LIMITED
- Anthony R. SCHEPIS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
A PROCEDURE TO ENABLE DIE REWORK FOR HYBRID BONDING
- Publication number 20230260955
- Publication date Aug 17, 2023
- Ying WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND ENHANCEMENT FOR DIRECT-BONDING PROCESSES
- Publication number 20230187398
- Publication date Jun 15, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Guilian GAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT BONDING METHODS AND STRUCTURES
- Publication number 20230140107
- Publication date May 4, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING SEMICONDUCTOR DEVICE WITH RE-FILL LAYER
- Publication number 20230110531
- Publication date Apr 13, 2023
- NANYA TECHNOLOGY CORPORATION
- Shing-Yih SHIH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING METHOD
- Publication number 20230100455
- Publication date Mar 30, 2023
- SEMES CO., LTD.
- Hang Lim LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-DIELECTRIC BONDING METHOD AND STRUCTURE
- Publication number 20230005876
- Publication date Jan 5, 2023
- Yangtze Memory Technologies Co., Ltd.
- Siping HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING HYBRID BONDED STRUCTURE
- Publication number 20220359601
- Publication date Nov 10, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Bo-Tsung TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Manufacturing
- Publication number 20220278063
- Publication date Sep 1, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Chia Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE BARRIER DIRECT HYBRID BONDING
- Publication number 20220254746
- Publication date Aug 11, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Paul M. ENQUIST
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND ENHANCEMENT STRUCTURE IN MICROELECTRONICS FOR TRAPPING CONTAMI...
- Publication number 20220246564
- Publication date Aug 4, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Guilian GAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-DIELECTRIC BONDING METHOD AND STRUCTURE
- Publication number 20220238479
- Publication date Jul 28, 2022
- Yangtze Memory Technologies Co., Ltd.
- Siping HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURES AND METHODS FOR FORMING SAME
- Publication number 20220130714
- Publication date Apr 28, 2022
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RELIABLE HYBRID BONDED APPARATUS
- Publication number 20210305202
- Publication date Sep 30, 2021
- INVENSAS BONDING TECHNOLOGIES, INC.
- Cyprian Emeka UZOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE PROCESSING
- Publication number 20210233888
- Publication date Jul 29, 2021
- INVENSAS BONDING TECHNOLOGIES, INC.
- Cyprian Emeka UZOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-DIELECTRIC BONDING METHOD AND STRUCTURE
- Publication number 20210210459
- Publication date Jul 8, 2021
- Yangtze Memory Technologies Co., Ltd.
- Siping HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND DEVICE FOR BONDING OF CHIPS
- Publication number 20210134782
- Publication date May 6, 2021
- EV GROUP E. THALLNER GMBH
- Markus Wimplinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING SYSTEM AND BONDING METHOD
- Publication number 20210050243
- Publication date Feb 18, 2021
- TOKYO ELECTRON LIMITED
- Yoshitaka Otsuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Manufacturing
- Publication number 20210005561
- Publication date Jan 7, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Chia Hu
- H01 - BASIC ELECTRIC ELEMENTS

Chemical cleaning

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for fabricating hybrid bonded structure

Device for bonding chips

Metal-dielectric bonding method and structure

Bond enhancement structure in microelectronics for trapping contami...

Semiconductor device and method of manufacturing

Conductive barrier direct hybrid bonding

Bonding system and bonding method

Metal-dielectric bonding method and structure

Method and device for bonding of chips

Reliable hybrid bonded apparatus

Die processing

Method for fabricating semiconductor device with re-fill layer

Semiconductor device, fabrication method for a semiconductor device...

Metal-dielectric bonding method and structure

Hybrid bonded structure

Semiconductor device and method of manufacturing

Bond enhancement structure in microelectronics for trapping contami...

Conductive barrier direct hybrid bonding

Interconnect structures and methods for forming same

Hybrid bonding method for semiconductor wafers and related three-di...

Bonding method with electron-stimulated desorption

Die processing

Semiconductor device, fabrication method for a semiconductor device...

Hybrid wafer-to-wafer bonding and methods of surface preparation fo...

Method for bonding wafers and bonding tool

Semiconductor device and method of manufacturing

Die processing

Hybrid bonded structure

Die processing

Semiconductor device, fabrication method for a semiconductor device...

Patents Applicationslast 30 patents

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, CLEANING DEVICE, CLE...

METHOD FOR FABRICATING HYBRID BONDED STRUCTURE

SYSTEM AND METHOD FOR BONDING TRANSPARENT CONDUCTOR SUBSTRATES

CONDUCTIVE BARRIER DIRECT HYBRID BONDING

Structures and Processes for Void-Free Hybrid Bonding

INTEGRATED PROCESS FLOWS FOR HYBRID BONDING

METHOD AND DEVICE FOR BONDING OF CHIPS

NEXT GENERATION BONDING LAYER FOR 3D HETEROGENEOUS INTEGRATION

BONDING SYSTEM

RELIABLE HYBRID BONDED APPARATUS

DIE PROCESSING

WAFER SHAPE CONTROL FOR W2W BONDING

A PROCEDURE TO ENABLE DIE REWORK FOR HYBRID BONDING

BOND ENHANCEMENT FOR DIRECT-BONDING PROCESSES

DIRECT BONDING METHODS AND STRUCTURES

METHOD FOR FABRICATING SEMICONDUCTOR DEVICE WITH RE-FILL LAYER

BONDING METHOD

METAL-DIELECTRIC BONDING METHOD AND STRUCTURE

METHOD FOR FABRICATING HYBRID BONDED STRUCTURE

Semiconductor Device and Method of Manufacturing

CONDUCTIVE BARRIER DIRECT HYBRID BONDING

BOND ENHANCEMENT STRUCTURE IN MICROELECTRONICS FOR TRAPPING CONTAMI...

METAL-DIELECTRIC BONDING METHOD AND STRUCTURE

INTERCONNECT STRUCTURES AND METHODS FOR FORMING SAME

RELIABLE HYBRID BONDED APPARATUS

DIE PROCESSING

METAL-DIELECTRIC BONDING METHOD AND STRUCTURE

METHOD AND DEVICE FOR BONDING OF CHIPS

BONDING SYSTEM AND BONDING METHOD

Semiconductor Device and Method of Manufacturing