comprising a micromechanical device connected to control or processing electronics

Industry

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B81B2207/01

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Parent Industries

BPERFORMING OPERATIONS TRANSPORTING B81Micro-structural technology B81BMICRO-STRUCTURAL DEVICES OR SYSTEMS B81B2207/00Micro-structural systems or auxiliary parts thereof

Current Industry

B81B2207/01comprising a micromechanical device connected to control or processing electronics

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Piezoelectric anti-stiction structure for microelectromechanical sy...
- Patent number 12,215,016
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Fan Hu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
CMUT-on-CMOS ultrasonic transducer by bonding active wafers and man...
- Patent number 12,208,416
- Issue date Jan 28, 2025
- Zhejiang Xiansheng Technology Co., Ltd.
- Feng Yin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Signal processing method and device of mems microphone and mems mic...
- Patent number 12,207,061
- Issue date Jan 21, 2025
- GOERTEK INC.
- Dingyun Li
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor package using a polymer substrate
- Patent number 12,187,603
- Issue date Jan 7, 2025
- Amkor Technology Singapore Holding Pte Ltd.
- Yung Woo Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Sensor package and method of producing the sensor package
- Patent number 12,180,066
- Issue date Dec 31, 2024
- Sciosense B.V.
- Willem Frederik Adrianus Besling
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Anti-stiction process for MEMS device
- Patent number 12,157,667
- Issue date Dec 3, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jui-Chun Weng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS sensor as well as method for operating a mems sensor
- Patent number 12,145,840
- Issue date Nov 19, 2024
- Robert Bosch GmbH
- Arne Dannenberg
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Sensor device and sensor
- Patent number 12,140,430
- Issue date Nov 12, 2024
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Hideki Ueda
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Reduced light reflection package
- Patent number 12,133,049
- Issue date Oct 29, 2024
- Invensense, Inc.
- Roberto Brioschi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microelectronics package with vertically stacked MEMS device and co...
- Patent number 12,129,168
- Issue date Oct 29, 2024
- Qorvo US, Inc.
- Julio C. Costa
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Device for supporting MEMS and/or ASIC components
- Patent number 12,116,270
- Issue date Oct 15, 2024
- TE CONNECTIVITY SOLUTIONS GmbH
- Ismael Brunner
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Bonded structures
- Patent number 12,100,684
- Issue date Sep 24, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Liang Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Sensor and package assembly thereof
- Patent number 12,091,312
- Issue date Sep 17, 2024
- Robert Bosch GmbH
- Ken Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Micro-electro-mechanical-system structures and applications thereof
- Patent number 12,084,340
- Issue date Sep 10, 2024
- Mekonos, Inc.
- Mark A. Webb
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
SOC PMUT suitable for high-density system integration, array chip,...
- Patent number 12,060,264
- Issue date Aug 13, 2024
- NANJING SHENGXI XINYING TECHNOLOGY CO., LTD
- Hui Li
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Active matrix programmable mirror
- Patent number 12,061,331
- Issue date Aug 13, 2024
- OBSIDIAN SENSORS, INC.
- John Hong
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Thermal metamaterial for low power MEMS thermal control
- Patent number 12,055,927
- Issue date Aug 6, 2024
- Honeywell International Inc.
- Robert Compton
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS microphone and MEMS accelerometer on a single substrate
- Patent number 12,054,383
- Issue date Aug 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Wen Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Waterproof MEMS button device, input device comprising the MEMS but...
- Patent number 12,050,102
- Issue date Jul 30, 2024
- STMicroelectronics S.r.l.
- Gabriele Gattere
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for producing monolithic integration of piezoelectric microm...
- Patent number 12,037,239
- Issue date Jul 16, 2024
- VANGUARD INTERNATIONAL SEMICONDUCTOR SINGAPORE PTE. LTD.
- You Qian
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Low-height optoelectronic modules and packages
- Patent number 12,037,238
- Issue date Jul 16, 2024
- ams Sensors Singapore Pte. Ltd.
- Javier Miguel Sànchez
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for producing a wafer connection
- Patent number 12,030,773
- Issue date Jul 9, 2024
- Robert Bosch GmbH
- Friedjof Heuck
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor integrated device with electrical contacts between st...
- Patent number 12,024,422
- Issue date Jul 2, 2024
- STMicroelectronics S.r.l.
- Enri Duqi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Sensing device and method for manufacturing sensing device
- Patent number 12,024,420
- Issue date Jul 2, 2024
- Mitsumi Electric Co., Ltd.
- Etsuji Hayakawa
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Fabrication method for a MEMS device
- Patent number 12,017,909
- Issue date Jun 25, 2024
- Imec VZW
- Deniz Sabuncuoglu Tezcan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of manufacturing electronic devices and corresponding electr...
- Patent number 12,017,910
- Issue date Jun 25, 2024
- STMicroelectronics (Malta) Ltd.
- Kevin Formosa
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Sensor module having conductive bonding members with varying meltin...
- Patent number 12,000,857
- Issue date Jun 4, 2024
- Seiko Epson Corporation
- Masayasu Sakuma
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
CMOS-MEMS humidity sensor
- Patent number 12,000,792
- Issue date Jun 4, 2024
- HANGZHOU WEIMING XINKE TECHNOLOGY CO., LTD
- Han Xiao
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor package and method for manufacturing the same
- Patent number 11,973,048
- Issue date Apr 30, 2024
- Advanced Semiconductor Engineering, Inc.
- An-Nong Wen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Integrated digital force sensors and related methods of manufacture
- Patent number 11,946,817
- Issue date Apr 2, 2024
- DecaWave, Ltd.
- Ali Foughi
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED MEMS OPTICAL SWITCH WITH PIEZOELECTRIC MEMS ACTUATORS
- Publication number 20250042720
- Publication date Feb 6, 2025
- nEYE Systems, Inc.
- Tae Joon SEOK
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS ACOUSTIC ELEMENT
- Publication number 20250039611
- Publication date Jan 30, 2025
- Murata Manufacturing Co., Ltd.
- Ryosuke NIWA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
FOUNDRY-COMPATIBLE PROCESS FOR INTEGRATED MICRO-SPEAKER AND MICROPHONE
- Publication number 20250030998
- Publication date Jan 23, 2025
- Vibrant Microsystems Inc.
- Joseph Doll
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SENSOR DEVICE
- Publication number 20250011164
- Publication date Jan 9, 2025
- INFINEON TECHNOLOGIES AG
- Klaus ELIAN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS Microphone
- Publication number 20250011158
- Publication date Jan 9, 2025
- AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD
- Xingfu Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Suspension for Resonators and MEMS Devices
- Publication number 20250011162
- Publication date Jan 9, 2025
- SiTime Corporation
- Nicholas MILLER
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS MICROPHONE
- Publication number 20250016508
- Publication date Jan 9, 2025
- AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD
- Xingfu Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Ovenized MEMS
- Publication number 20250007455
- Publication date Jan 2, 2025
- SiTime Corporation
- Carl Arft
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROELECTRONICS PACKAGE WITH VERTICALLY STACKED MEMS DEVICE AND CO...
- Publication number 20250002330
- Publication date Jan 2, 2025
- Qorvo US, Inc.
- Julio C. Costa
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS-based Imaging Devices
- Publication number 20250008220
- Publication date Jan 2, 2025
- Microsoft Technology Licensing, LLC
- Gritsko PEREZ NOGUERA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
COMBINED SOUND TRANSDUCER AND PRESSURE SENSOR PACKAGE
- Publication number 20240425363
- Publication date Dec 26, 2024
- INFINEON TECHNOLOGIES AG
- Bernhard Rieder
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
OVER-THE-SINK DRYING ELEMENT
- Publication number 20240406640
- Publication date Dec 5, 2024
- DORAI HOME, INC.
- Jason Klug
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR STRUCTURE AND FORMATION THEREOF
- Publication number 20240391761
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Kai-Lan CHANG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS COMPONENT WITH UPSIDE-DOWN CHIP
- Publication number 20240391759
- Publication date Nov 28, 2024
- Murata Manufacturing Co., Ltd.
- Sami NURMI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME
- Publication number 20240383005
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kang-Yi Lien
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
OUTGASSING MATERIAL COATED CAVITY FOR A MICRO-ELECTRO MECHANICAL SY...
- Publication number 20240367964
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Kuei-Sung Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROMECHANICAL COMPONENT AND SCANNING DEVICE
- Publication number 20240343556
- Publication date Oct 17, 2024
- ROBERT BOSCH GmbH
- Helmut Grutzeck
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ELECTRONIC CIGARETTE
- Publication number 20240327202
- Publication date Oct 3, 2024
- AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD
- Jinyang Li
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICRO-ELECTRO-MECHANICAL SYSTEM MICROPHONE, MICROPHONE UNIT AND ELE...
- Publication number 20240334132
- Publication date Oct 3, 2024
- GOERTEK MICROELECTRONICS INC.
- Quanbo Zou
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR MANUFACTURING A MEMS TRANSDUCER DEVICE WITH THIN MEMBRAN...
- Publication number 20240327203
- Publication date Oct 3, 2024
- STMicroelectronics International N.V.
- Mark Andrew SHAW
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS MIRROR FOR COUPLING AND COMPENSATING LASER DEVICE TO PHOTONIC...
- Publication number 20240288679
- Publication date Aug 29, 2024
- Cisco Technology, Inc.
- Jaleel MOIDU
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PROCESS FLOW FOR THIN CONTACTLESS THERMAL SENSORS
- Publication number 20240272004
- Publication date Aug 15, 2024
- STMicroelectronics International N.V.
- Enri DUQI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DECOUPLING METHOD FOR SEMICONDUCTOR DEVICE
- Publication number 20240228264
- Publication date Jul 11, 2024
- STMicroelectronics International N.V.
- Roseanne DUCA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
VERTICALLY STACKED MEMS DEVICES AND CONTROLLER DEVICE
- Publication number 20240199411
- Publication date Jun 20, 2024
- Qorvo US, Inc.
- Robertus Petrus Van Kampen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SIGNAL PROCESSING CIRCUIT FOR TRIPLE-MEMBRANE MEMS DEVICE
- Publication number 20240174514
- Publication date May 30, 2024
- INFINEON TECHNOLOGIES AG
- Marc Fueldner
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240158225
- Publication date May 16, 2024
- UNITED MICROELECTRONICS CORP.
- Jung-Hao Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME
- Publication number 20240140782
- Publication date May 2, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- PO CHEN YEH
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR MANUFACTURING A DEVICE COMPRISING TWO SEMICONDUCTOR DICE...
- Publication number 20240140783
- Publication date May 2, 2024
- STMicroelectronics S.r.l.
- Mark Andrew SHAW
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DECOUPLING METHOD FOR SEMICONDUCTOR DEVICE
- Publication number 20240132340
- Publication date Apr 25, 2024
- STMicroelectronics (Malta) Ltd.
- Roseanne DUCA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROMECHANICAL DEVICE COMPRISING A HYDROGEN DRAINAGE LAYER
- Publication number 20240124296
- Publication date Apr 18, 2024
- ROBERT BOSCH GmbH
- Johannes Boy
- B81 - MICRO-STRUCTURAL TECHNOLOGY

comprising a micromechanical device connected to control or processing electronics

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Piezoelectric anti-stiction structure for microelectromechanical sy...

CMUT-on-CMOS ultrasonic transducer by bonding active wafers and man...

Signal processing method and device of mems microphone and mems mic...

Semiconductor package using a polymer substrate

Sensor package and method of producing the sensor package

Anti-stiction process for MEMS device

MEMS sensor as well as method for operating a mems sensor

Sensor device and sensor

Reduced light reflection package

Microelectronics package with vertically stacked MEMS device and co...

Device for supporting MEMS and/or ASIC components

Bonded structures

Sensor and package assembly thereof

Micro-electro-mechanical-system structures and applications thereof

SOC PMUT suitable for high-density system integration, array chip,...

Active matrix programmable mirror

Thermal metamaterial for low power MEMS thermal control

MEMS microphone and MEMS accelerometer on a single substrate

Waterproof MEMS button device, input device comprising the MEMS but...

Method for producing monolithic integration of piezoelectric microm...

Low-height optoelectronic modules and packages

Method for producing a wafer connection

Semiconductor integrated device with electrical contacts between st...

Sensing device and method for manufacturing sensing device

Fabrication method for a MEMS device

Method of manufacturing electronic devices and corresponding electr...

Sensor module having conductive bonding members with varying meltin...

CMOS-MEMS humidity sensor

Semiconductor package and method for manufacturing the same

Integrated digital force sensors and related methods of manufacture

Patents Applicationslast 30 patents

INTEGRATED MEMS OPTICAL SWITCH WITH PIEZOELECTRIC MEMS ACTUATORS

MEMS ACOUSTIC ELEMENT

FOUNDRY-COMPATIBLE PROCESS FOR INTEGRATED MICRO-SPEAKER AND MICROPHONE

SENSOR DEVICE

MEMS Microphone

Suspension for Resonators and MEMS Devices

MEMS MICROPHONE

Ovenized MEMS

MICROELECTRONICS PACKAGE WITH VERTICALLY STACKED MEMS DEVICE AND CO...

MEMS-based Imaging Devices

COMBINED SOUND TRANSDUCER AND PRESSURE SENSOR PACKAGE

OVER-THE-SINK DRYING ELEMENT

SEMICONDUCTOR STRUCTURE AND FORMATION THEREOF

MEMS COMPONENT WITH UPSIDE-DOWN CHIP

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME

OUTGASSING MATERIAL COATED CAVITY FOR A MICRO-ELECTRO MECHANICAL SY...

MICROMECHANICAL COMPONENT AND SCANNING DEVICE

ELECTRONIC CIGARETTE

MICRO-ELECTRO-MECHANICAL SYSTEM MICROPHONE, MICROPHONE UNIT AND ELE...

METHOD FOR MANUFACTURING A MEMS TRANSDUCER DEVICE WITH THIN MEMBRAN...

MEMS MIRROR FOR COUPLING AND COMPENSATING LASER DEVICE TO PHOTONIC...

PROCESS FLOW FOR THIN CONTACTLESS THERMAL SENSORS

DECOUPLING METHOD FOR SEMICONDUCTOR DEVICE

VERTICALLY STACKED MEMS DEVICES AND CONTROLLER DEVICE

SIGNAL PROCESSING CIRCUIT FOR TRIPLE-MEMBRANE MEMS DEVICE

MEMS DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME

METHOD FOR MANUFACTURING A DEVICE COMPRISING TWO SEMICONDUCTOR DICE...

DECOUPLING METHOD FOR SEMICONDUCTOR DEVICE

MICROMECHANICAL DEVICE COMPRISING A HYDROGEN DRAINAGE LAYER