comprising a micromechanical device connected to control or processing electronics

Industry

CPC
B81B2207/01

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

BPERFORMING OPERATIONS TRANSPORTING B81Micro-structural technology B81BMICRO-STRUCTURAL DEVICES OR SYSTEMS B81B2207/00Micro-structural systems or auxiliary parts thereof

Current Industry

B81B2207/01comprising a micromechanical device connected to control or processing electronics

Industries

Patents Grantslast 30 patents

Information Patent Grant
Anti-stiction process for MEMS device
- Patent number 12,157,667
- Issue date Dec 3, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jui-Chun Weng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS sensor as well as method for operating a mems sensor
- Patent number 12,145,840
- Issue date Nov 19, 2024
- Robert Bosch GmbH
- Arne Dannenberg
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Sensor device and sensor
- Patent number 12,140,430
- Issue date Nov 12, 2024
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Hideki Ueda
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Reduced light reflection package
- Patent number 12,133,049
- Issue date Oct 29, 2024
- Invensense, Inc.
- Roberto Brioschi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microelectronics package with vertically stacked MEMS device and co...
- Patent number 12,129,168
- Issue date Oct 29, 2024
- Qorvo US, Inc.
- Julio C. Costa
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Device for supporting MEMS and/or ASIC components
- Patent number 12,116,270
- Issue date Oct 15, 2024
- TE CONNECTIVITY SOLUTIONS GmbH
- Ismael Brunner
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Bonded structures
- Patent number 12,100,684
- Issue date Sep 24, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Liang Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Sensor and package assembly thereof
- Patent number 12,091,312
- Issue date Sep 17, 2024
- Robert Bosch GmbH
- Ken Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Micro-electro-mechanical-system structures and applications thereof
- Patent number 12,084,340
- Issue date Sep 10, 2024
- Mekonos, Inc.
- Mark A. Webb
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
SOC PMUT suitable for high-density system integration, array chip,...
- Patent number 12,060,264
- Issue date Aug 13, 2024
- NANJING SHENGXI XINYING TECHNOLOGY CO., LTD
- Hui Li
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Active matrix programmable mirror
- Patent number 12,061,331
- Issue date Aug 13, 2024
- OBSIDIAN SENSORS, INC.
- John Hong
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Thermal metamaterial for low power MEMS thermal control
- Patent number 12,055,927
- Issue date Aug 6, 2024
- Honeywell International Inc.
- Robert Compton
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS microphone and MEMS accelerometer on a single substrate
- Patent number 12,054,383
- Issue date Aug 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Wen Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Waterproof MEMS button device, input device comprising the MEMS but...
- Patent number 12,050,102
- Issue date Jul 30, 2024
- STMicroelectronics S.r.l.
- Gabriele Gattere
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for producing monolithic integration of piezoelectric microm...
- Patent number 12,037,239
- Issue date Jul 16, 2024
- VANGUARD INTERNATIONAL SEMICONDUCTOR SINGAPORE PTE. LTD.
- You Qian
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Low-height optoelectronic modules and packages
- Patent number 12,037,238
- Issue date Jul 16, 2024
- ams Sensors Singapore Pte. Ltd.
- Javier Miguel Sànchez
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for producing a wafer connection
- Patent number 12,030,773
- Issue date Jul 9, 2024
- Robert Bosch GmbH
- Friedjof Heuck
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor integrated device with electrical contacts between st...
- Patent number 12,024,422
- Issue date Jul 2, 2024
- STMicroelectronics S.r.l.
- Enri Duqi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Sensing device and method for manufacturing sensing device
- Patent number 12,024,420
- Issue date Jul 2, 2024
- Mitsumi Electric Co., Ltd.
- Etsuji Hayakawa
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Fabrication method for a MEMS device
- Patent number 12,017,909
- Issue date Jun 25, 2024
- Imec VZW
- Deniz Sabuncuoglu Tezcan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of manufacturing electronic devices and corresponding electr...
- Patent number 12,017,910
- Issue date Jun 25, 2024
- STMicroelectronics (Malta) Ltd.
- Kevin Formosa
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Sensor module having conductive bonding members with varying meltin...
- Patent number 12,000,857
- Issue date Jun 4, 2024
- Seiko Epson Corporation
- Masayasu Sakuma
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
CMOS-MEMS humidity sensor
- Patent number 12,000,792
- Issue date Jun 4, 2024
- HANGZHOU WEIMING XINKE TECHNOLOGY CO., LTD
- Han Xiao
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor package and method for manufacturing the same
- Patent number 11,973,048
- Issue date Apr 30, 2024
- Advanced Semiconductor Engineering, Inc.
- An-Nong Wen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Integrated digital force sensors and related methods of manufacture
- Patent number 11,946,817
- Issue date Apr 2, 2024
- DecaWave, Ltd.
- Ali Foughi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor transducer device with multilayer diaphragm and metho...
- Patent number 11,946,822
- Issue date Apr 2, 2024
- Sciosense B.V.
- Alessandro Faes
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Blood pressure detection device
- Patent number 11,944,412
- Issue date Apr 2, 2024
- Microjet Technology Co., Ltd.
- Hao-Jan Mou
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Systems and methods for providing getters in microelectromechanical...
- Patent number 11,945,713
- Issue date Apr 2, 2024
- Invensense, Inc.
- Daesung Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Electronic device and corresponding method
- Patent number 11,945,714
- Issue date Apr 2, 2024
- STMicroelectronics S.r.l.
- Alex Gritti
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Signal processing circuit for triple-membrane MEMS device
- Patent number 11,932,533
- Issue date Mar 19, 2024
- Infineon Technologies AG
- Marc Fueldner
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
OVER-THE-SINK DRYING ELEMENT
- Publication number 20240406640
- Publication date Dec 5, 2024
- DORAI HOME, INC.
- Jason Klug
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR STRUCTURE AND FORMATION THEREOF
- Publication number 20240391761
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Kai-Lan CHANG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS COMPONENT WITH UPSIDE-DOWN CHIP
- Publication number 20240391759
- Publication date Nov 28, 2024
- Murata Manufacturing Co., Ltd.
- Sami NURMI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME
- Publication number 20240383005
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kang-Yi Lien
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
OUTGASSING MATERIAL COATED CAVITY FOR A MICRO-ELECTRO MECHANICAL SY...
- Publication number 20240367964
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Kuei-Sung Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROMECHANICAL COMPONENT AND SCANNING DEVICE
- Publication number 20240343556
- Publication date Oct 17, 2024
- ROBERT BOSCH GmbH
- Helmut Grutzeck
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ELECTRONIC CIGARETTE
- Publication number 20240327202
- Publication date Oct 3, 2024
- AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD
- Jinyang Li
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICRO-ELECTRO-MECHANICAL SYSTEM MICROPHONE, MICROPHONE UNIT AND ELE...
- Publication number 20240334132
- Publication date Oct 3, 2024
- GOERTEK MICROELECTRONICS INC.
- Quanbo Zou
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR MANUFACTURING A MEMS TRANSDUCER DEVICE WITH THIN MEMBRAN...
- Publication number 20240327203
- Publication date Oct 3, 2024
- STMicroelectronics International N.V.
- Mark Andrew SHAW
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS MIRROR FOR COUPLING AND COMPENSATING LASER DEVICE TO PHOTONIC...
- Publication number 20240288679
- Publication date Aug 29, 2024
- Cisco Technology, Inc.
- Jaleel MOIDU
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PROCESS FLOW FOR THIN CONTACTLESS THERMAL SENSORS
- Publication number 20240272004
- Publication date Aug 15, 2024
- STMicroelectronics International N.V.
- Enri DUQI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DECOUPLING METHOD FOR SEMICONDUCTOR DEVICE
- Publication number 20240228264
- Publication date Jul 11, 2024
- STMicroelectronics International N.V.
- Roseanne DUCA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
VERTICALLY STACKED MEMS DEVICES AND CONTROLLER DEVICE
- Publication number 20240199411
- Publication date Jun 20, 2024
- Qorvo US, Inc.
- Robertus Petrus Van Kampen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SIGNAL PROCESSING CIRCUIT FOR TRIPLE-MEMBRANE MEMS DEVICE
- Publication number 20240174514
- Publication date May 30, 2024
- INFINEON TECHNOLOGIES AG
- Marc Fueldner
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240158225
- Publication date May 16, 2024
- UNITED MICROELECTRONICS CORP.
- Jung-Hao Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME
- Publication number 20240140782
- Publication date May 2, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- PO CHEN YEH
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR MANUFACTURING A DEVICE COMPRISING TWO SEMICONDUCTOR DICE...
- Publication number 20240140783
- Publication date May 2, 2024
- STMicroelectronics S.r.l.
- Mark Andrew SHAW
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DECOUPLING METHOD FOR SEMICONDUCTOR DEVICE
- Publication number 20240132340
- Publication date Apr 25, 2024
- STMicroelectronics (Malta) Ltd.
- Roseanne DUCA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROMECHANICAL DEVICE COMPRISING A HYDROGEN DRAINAGE LAYER
- Publication number 20240124296
- Publication date Apr 18, 2024
- ROBERT BOSCH GmbH
- Johannes Boy
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CAPLESS SEMICONDUCTOR PACKAGE WITH A MICRO-ELECTROMECHANICAL SYSTEM...
- Publication number 20240124300
- Publication date Apr 18, 2024
- STMICROELECTRONICS, INC.
- Jefferson Sismundo TALLEDO
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SENSOR DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240109768
- Publication date Apr 4, 2024
- Advanced Semiconductor Engineering, Inc.
- Chieh-An YEH
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CMOS ULTRASONIC TRANSDUCERS AND RELATED APPARATUS AND METHODS
- Publication number 20240100565
- Publication date Mar 28, 2024
- BFLY OPERATIONS, INC.
- Jonathan M. Rothberg
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Support Device for One or More MEMS Components
- Publication number 20240101412
- Publication date Mar 28, 2024
- ROBERT BOSCH GmbH
- Joachim Friedl
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INTEGRATED MEMS ELECTROSTATIC MICRO-SPEAKER DEVICE AND METHOD
- Publication number 20240092629
- Publication date Mar 21, 2024
- Vibrant Microsystems Inc.
- Steven NASIRI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS, METHOD OF MANUFACTURING AN MEMS AND METHOD OF CONFIGURING AN...
- Publication number 20240092633
- Publication date Mar 21, 2024
- Fraunhofer-Gesellschaft zur Forderung der angewandten Forschung e.V.
- Anton MELNIKOV
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICRO-ELECTRO MECHANICAL SYSTEM AND MANUFACTURING METHOD THEREOF
- Publication number 20240083742
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ting-Li YANG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
BOTTOM ELECTRODE VIA STRUCTURES FOR MICROMACHINED ULTRASONIC TRANSD...
- Publication number 20240024917
- Publication date Jan 25, 2024
- BFLY OPERATIONS, INC.
- Lingyun Miao
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Haptic Device with Multiple Fluidically-Controlled Voids
- Publication number 20240019934
- Publication date Jan 18, 2024
- Meta Platforms Technologies, LLC
- Sean Jason Keller
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SCANNING MIRROR SYSTEMS AND METHODS OF MANUFACTURE
- Publication number 20240012237
- Publication date Jan 11, 2024
- Magic Leap, Inc.
- Julien Gamet
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
REDUCED LIGHT REFLECTION PACKAGE
- Publication number 20240015447
- Publication date Jan 11, 2024
- InvenSense, Inc.
- Roberto Brioschi
- B81 - MICRO-STRUCTURAL TECHNOLOGY

comprising a micromechanical device connected to control or processing electronics

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Anti-stiction process for MEMS device

MEMS sensor as well as method for operating a mems sensor

Sensor device and sensor

Reduced light reflection package

Microelectronics package with vertically stacked MEMS device and co...

Device for supporting MEMS and/or ASIC components

Bonded structures

Sensor and package assembly thereof

Micro-electro-mechanical-system structures and applications thereof

SOC PMUT suitable for high-density system integration, array chip,...

Active matrix programmable mirror

Thermal metamaterial for low power MEMS thermal control

MEMS microphone and MEMS accelerometer on a single substrate

Waterproof MEMS button device, input device comprising the MEMS but...

Method for producing monolithic integration of piezoelectric microm...

Low-height optoelectronic modules and packages

Method for producing a wafer connection

Semiconductor integrated device with electrical contacts between st...

Sensing device and method for manufacturing sensing device

Fabrication method for a MEMS device

Method of manufacturing electronic devices and corresponding electr...

Sensor module having conductive bonding members with varying meltin...

CMOS-MEMS humidity sensor

Semiconductor package and method for manufacturing the same

Integrated digital force sensors and related methods of manufacture

Semiconductor transducer device with multilayer diaphragm and metho...

Blood pressure detection device

Systems and methods for providing getters in microelectromechanical...

Electronic device and corresponding method

Signal processing circuit for triple-membrane MEMS device

Patents Applicationslast 30 patents

OVER-THE-SINK DRYING ELEMENT

SEMICONDUCTOR STRUCTURE AND FORMATION THEREOF

MEMS COMPONENT WITH UPSIDE-DOWN CHIP

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME

OUTGASSING MATERIAL COATED CAVITY FOR A MICRO-ELECTRO MECHANICAL SY...

MICROMECHANICAL COMPONENT AND SCANNING DEVICE

ELECTRONIC CIGARETTE

MICRO-ELECTRO-MECHANICAL SYSTEM MICROPHONE, MICROPHONE UNIT AND ELE...

METHOD FOR MANUFACTURING A MEMS TRANSDUCER DEVICE WITH THIN MEMBRAN...

MEMS MIRROR FOR COUPLING AND COMPENSATING LASER DEVICE TO PHOTONIC...

PROCESS FLOW FOR THIN CONTACTLESS THERMAL SENSORS

DECOUPLING METHOD FOR SEMICONDUCTOR DEVICE

VERTICALLY STACKED MEMS DEVICES AND CONTROLLER DEVICE

SIGNAL PROCESSING CIRCUIT FOR TRIPLE-MEMBRANE MEMS DEVICE

MEMS DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME

METHOD FOR MANUFACTURING A DEVICE COMPRISING TWO SEMICONDUCTOR DICE...

DECOUPLING METHOD FOR SEMICONDUCTOR DEVICE

MICROMECHANICAL DEVICE COMPRISING A HYDROGEN DRAINAGE LAYER

CAPLESS SEMICONDUCTOR PACKAGE WITH A MICRO-ELECTROMECHANICAL SYSTEM...

SENSOR DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME

CMOS ULTRASONIC TRANSDUCERS AND RELATED APPARATUS AND METHODS

Support Device for One or More MEMS Components

INTEGRATED MEMS ELECTROSTATIC MICRO-SPEAKER DEVICE AND METHOD

MEMS, METHOD OF MANUFACTURING AN MEMS AND METHOD OF CONFIGURING AN...

MICRO-ELECTRO MECHANICAL SYSTEM AND MANUFACTURING METHOD THEREOF

BOTTOM ELECTRODE VIA STRUCTURES FOR MICROMACHINED ULTRASONIC TRANSD...

Haptic Device with Multiple Fluidically-Controlled Voids

SCANNING MIRROR SYSTEMS AND METHODS OF MANUFACTURE

REDUCED LIGHT REFLECTION PACKAGE