comprising a micromechanical device connected to control or processing electronics

Industry

CPC
B81B2207/01

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Parent Industries

BPERFORMING OPERATIONS TRANSPORTING B81Micro-structural technology B81BMICRO-STRUCTURAL DEVICES OR SYSTEMS B81B2207/00Micro-structural systems or auxiliary parts thereof

Current Industry

B81B2207/01comprising a micromechanical device connected to control or processing electronics

Industries

Patents Grantslast 30 patents

Information Patent Grant
Sensor module having conductive bonding members with varying meltin...
- Patent number 12,000,857
- Issue date Jun 4, 2024
- Seiko Epson Corporation
- Masayasu Sakuma
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
CMOS-MEMS humidity sensor
- Patent number 12,000,792
- Issue date Jun 4, 2024
- HANGZHOU WEIMING XINKE TECHNOLOGY CO., LTD
- Han Xiao
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor package and method for manufacturing the same
- Patent number 11,973,048
- Issue date Apr 30, 2024
- Advanced Semiconductor Engineering, Inc.
- An-Nong Wen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Integrated digital force sensors and related methods of manufacture
- Patent number 11,946,817
- Issue date Apr 2, 2024
- DecaWave, Ltd.
- Ali Foughi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor transducer device with multilayer diaphragm and metho...
- Patent number 11,946,822
- Issue date Apr 2, 2024
- Sciosense B.V.
- Alessandro Faes
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Blood pressure detection device
- Patent number 11,944,412
- Issue date Apr 2, 2024
- Microjet Technology Co., Ltd.
- Hao-Jan Mou
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Systems and methods for providing getters in microelectromechanical...
- Patent number 11,945,713
- Issue date Apr 2, 2024
- Invensense, Inc.
- Daesung Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Electronic device and corresponding method
- Patent number 11,945,714
- Issue date Apr 2, 2024
- STMicroelectronics S.r.l.
- Alex Gritti
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Signal processing circuit for triple-membrane MEMS device
- Patent number 11,932,533
- Issue date Mar 19, 2024
- Infineon Technologies AG
- Marc Fueldner
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Heat dissipation system with microelectromechanical system (MEMS) f...
- Patent number 11,910,568
- Issue date Feb 20, 2024
- Cisco Technology, Inc.
- Joel Richard Goergen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Ovenized MEMS
- Patent number 11,909,354
- Issue date Feb 20, 2024
- SiTime Corporation
- Carl Arft
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Micromechanical sensor device having an ASIC chip integrated into a...
- Patent number 11,906,383
- Issue date Feb 20, 2024
- Robert Bosch GmbH
- Stefan Pinter
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Capless semiconductor package with a micro-electromechanical system...
- Patent number 11,897,763
- Issue date Feb 13, 2024
- STMicroelectronics, Inc.
- Jefferson Sismundo Talledo
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device and method for forming the same
- Patent number 11,897,759
- Issue date Feb 13, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Po Chen Yeh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Robust method for gyroscope drive amplitude measurement
- Patent number 11,867,509
- Issue date Jan 9, 2024
- Invensense, Inc.
- Damiano Milani
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Micro-electro mechanical system and manufacturing method thereof
- Patent number 11,851,321
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ting-Li Yang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microelectromechanical system (MEMS) sensor packages and methods fo...
- Patent number 11,851,322
- Issue date Dec 26, 2023
- Infineon Technologies AG
- Rainer Markus Schaller
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Heterogenous integration of complementary metal-oxide-semiconductor...
- Patent number 11,845,653
- Issue date Dec 19, 2023
- MERIDIAN INNOVATION PTE LTD
- Wan Chia Ang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Integrated piezoelectric microelectromechanical ultrasound transduc...
- Patent number 11,847,851
- Issue date Dec 19, 2023
- Invensense, Inc.
- Julius Ming-Lin Tsai
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
CMOS ultrasonic transducers and related apparatus and methods
- Patent number 11,833,542
- Issue date Dec 5, 2023
- BFLY OPERATIONS, INC.
- Jonathan M. Rothberg
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor package with built-in vibration isolation, thermal st...
- Patent number 11,834,328
- Issue date Dec 5, 2023
- Invensense, Inc.
- Hamid Eslampour
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Piezoelectric anti-stiction structure for microelectromechanical sy...
- Patent number 11,834,325
- Issue date Dec 5, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Fan Hu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Outgassing material coated cavity for a micro-electro mechanical sy...
- Patent number 11,827,513
- Issue date Nov 28, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Kuei-Sung Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Support structure for MEMS device with particle filter
- Patent number 11,807,521
- Issue date Nov 7, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Wen Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Sensor
- Patent number 11,810,863
- Issue date Nov 7, 2023
- TDK TAIWAN CORP.
- An-Ping Tseng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Bottom electrode via structures for micromachined ultrasonic transd...
- Patent number 11,806,747
- Issue date Nov 7, 2023
- BFLY OPERATIONS, INC.
- Lingyun Miao
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Reduced light reflection package
- Patent number 11,800,297
- Issue date Oct 24, 2023
- Invensense, Inc.
- Roberto Brioschi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS assembly substrates including a bond layer
- Patent number 11,787,690
- Issue date Oct 17, 2023
- Knowles Electronics, LLC
- Sung Bok Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS device with particle filter and method of manufacture
- Patent number 11,787,689
- Issue date Oct 17, 2023
- TDK Corporation
- Wolfgang Pahl
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS stress reduction structure embedded into package
- Patent number 11,760,627
- Issue date Sep 19, 2023
- Invensense, Inc.
- Roberto Brioschi
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
SIGNAL PROCESSING CIRCUIT FOR TRIPLE-MEMBRANE MEMS DEVICE
- Publication number 20240174514
- Publication date May 30, 2024
- INFINEON TECHNOLOGIES AG
- Marc Fueldner
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240158225
- Publication date May 16, 2024
- UNITED MICROELECTRONICS CORP.
- Jung-Hao Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME
- Publication number 20240140782
- Publication date May 2, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- PO CHEN YEH
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR MANUFACTURING A DEVICE COMPRISING TWO SEMICONDUCTOR DICE...
- Publication number 20240140783
- Publication date May 2, 2024
- STMicroelectronics S.r.l.
- Mark Andrew SHAW
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DECOUPLING METHOD FOR SEMICONDUCTOR DEVICE
- Publication number 20240132340
- Publication date Apr 25, 2024
- STMicroelectronics (Malta) Ltd.
- Roseanne DUCA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROMECHANICAL DEVICE COMPRISING A HYDROGEN DRAINAGE LAYER
- Publication number 20240124296
- Publication date Apr 18, 2024
- ROBERT BOSCH GmbH
- Johannes Boy
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CAPLESS SEMICONDUCTOR PACKAGE WITH A MICRO-ELECTROMECHANICAL SYSTEM...
- Publication number 20240124300
- Publication date Apr 18, 2024
- STMICROELECTRONICS, INC.
- Jefferson Sismundo TALLEDO
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SENSOR DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240109768
- Publication date Apr 4, 2024
- Advanced Semiconductor Engineering, Inc.
- Chieh-An YEH
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CMOS ULTRASONIC TRANSDUCERS AND RELATED APPARATUS AND METHODS
- Publication number 20240100565
- Publication date Mar 28, 2024
- BFLY OPERATIONS, INC.
- Jonathan M. Rothberg
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Support Device for One or More MEMS Components
- Publication number 20240101412
- Publication date Mar 28, 2024
- ROBERT BOSCH GmbH
- Joachim Friedl
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INTEGRATED MEMS ELECTROSTATIC MICRO-SPEAKER DEVICE AND METHOD
- Publication number 20240092629
- Publication date Mar 21, 2024
- Vibrant Microsystems Inc.
- Steven NASIRI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS, METHOD OF MANUFACTURING AN MEMS AND METHOD OF CONFIGURING AN...
- Publication number 20240092633
- Publication date Mar 21, 2024
- Fraunhofer-Gesellschaft zur Forderung der angewandten Forschung e.V.
- Anton MELNIKOV
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICRO-ELECTRO MECHANICAL SYSTEM AND MANUFACTURING METHOD THEREOF
- Publication number 20240083742
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ting-Li YANG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
BOTTOM ELECTRODE VIA STRUCTURES FOR MICROMACHINED ULTRASONIC TRANSD...
- Publication number 20240024917
- Publication date Jan 25, 2024
- BFLY OPERATIONS, INC.
- Lingyun Miao
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Haptic Device with Multiple Fluidically-Controlled Voids
- Publication number 20240019934
- Publication date Jan 18, 2024
- Meta Platforms Technologies, LLC
- Sean Jason Keller
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SCANNING MIRROR SYSTEMS AND METHODS OF MANUFACTURE
- Publication number 20240012237
- Publication date Jan 11, 2024
- Magic Leap, Inc.
- Julien Gamet
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
REDUCED LIGHT REFLECTION PACKAGE
- Publication number 20240015447
- Publication date Jan 11, 2024
- InvenSense, Inc.
- Roberto Brioschi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DETECTION STRUCTURE FOR A MEMS ACCELEROMETER HAVING IMPROVED PERFOR...
- Publication number 20240010490
- Publication date Jan 11, 2024
- STMicroelectronics S.r.l.
- Gabriele GATTERE
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
HIGH ACCURACY TEMPERATURE-COMPENSATED PIEZORESISTIVE POSITION SENSI...
- Publication number 20240004184
- Publication date Jan 4, 2024
- ASML NETHERLANDS B.V.
- Luc Roger Simonne HASPESLAGH
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS PRESSURE SENSOR
- Publication number 20230417614
- Publication date Dec 28, 2023
- MEI Micro, Inc.
- Robert Mark Boysel
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME
- Publication number 20230399225
- Publication date Dec 14, 2023
- Taiwan Semiconductor Manufacturing company Ltd.
- PO CHEN YEH
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Capacitive Linearization Method Applied to MEMS Microphones Systems
- Publication number 20230399223
- Publication date Dec 14, 2023
- Wilfried Florian
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICRO-ELECTROMECHANICAL SYSTEMS (MEMS) DEVICE WITH OUTGAS LAYER
- Publication number 20230399226
- Publication date Dec 14, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Fan Hu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INTEGRATED ULTRASONIC TRANSDUCERS
- Publication number 20230389897
- Publication date Dec 7, 2023
- Exo Imaging, Inc.
- Janusz Bryzek
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS MICROPHONE PACKAGE
- Publication number 20230391610
- Publication date Dec 7, 2023
- Fortemedia, Inc.
- Yen-Son Paul HUANG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROMACHINED SUPERCONDUCTING INTERCONNECT IN SILICON
- Publication number 20230391609
- Publication date Dec 7, 2023
- International Business Machines Corporation
- Muir Kumph
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS MICROPHONE AND MEMS ACCELEROMETER ON A SINGLE SUBSTRATE
- Publication number 20230382716
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Wen Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PIEZOELECTRIC ANTI-STICTION STRUCTURE FOR MICROELECTROMECHANICAL SY...
- Publication number 20230373780
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Fan Hu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS SENSOR PACKAGE AND ITS MANUFACTURING METHOD
- Publication number 20230365396
- Publication date Nov 16, 2023
- TDK Corporation
- Toyotaka KOBAYASHI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
OUTGASSING MATERIAL COATED CAVITY FOR A MICRO-ELECTRO MECHANICAL SY...
- Publication number 20230365398
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Kuei-Sung Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY

comprising a micromechanical device connected to control or processing electronics

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Sensor module having conductive bonding members with varying meltin...

CMOS-MEMS humidity sensor

Semiconductor package and method for manufacturing the same

Integrated digital force sensors and related methods of manufacture

Semiconductor transducer device with multilayer diaphragm and metho...

Blood pressure detection device

Systems and methods for providing getters in microelectromechanical...

Electronic device and corresponding method

Signal processing circuit for triple-membrane MEMS device

Heat dissipation system with microelectromechanical system (MEMS) f...

Ovenized MEMS

Micromechanical sensor device having an ASIC chip integrated into a...

Capless semiconductor package with a micro-electromechanical system...

Semiconductor device and method for forming the same

Robust method for gyroscope drive amplitude measurement

Micro-electro mechanical system and manufacturing method thereof

Microelectromechanical system (MEMS) sensor packages and methods fo...

Heterogenous integration of complementary metal-oxide-semiconductor...

Integrated piezoelectric microelectromechanical ultrasound transduc...

CMOS ultrasonic transducers and related apparatus and methods

Semiconductor package with built-in vibration isolation, thermal st...

Piezoelectric anti-stiction structure for microelectromechanical sy...

Outgassing material coated cavity for a micro-electro mechanical sy...

Support structure for MEMS device with particle filter

Sensor

Bottom electrode via structures for micromachined ultrasonic transd...

Reduced light reflection package

MEMS assembly substrates including a bond layer

MEMS device with particle filter and method of manufacture

MEMS stress reduction structure embedded into package

Patents Applicationslast 30 patents

SIGNAL PROCESSING CIRCUIT FOR TRIPLE-MEMBRANE MEMS DEVICE

MEMS DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME

METHOD FOR MANUFACTURING A DEVICE COMPRISING TWO SEMICONDUCTOR DICE...

DECOUPLING METHOD FOR SEMICONDUCTOR DEVICE

MICROMECHANICAL DEVICE COMPRISING A HYDROGEN DRAINAGE LAYER

CAPLESS SEMICONDUCTOR PACKAGE WITH A MICRO-ELECTROMECHANICAL SYSTEM...

SENSOR DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME

CMOS ULTRASONIC TRANSDUCERS AND RELATED APPARATUS AND METHODS

Support Device for One or More MEMS Components

INTEGRATED MEMS ELECTROSTATIC MICRO-SPEAKER DEVICE AND METHOD

MEMS, METHOD OF MANUFACTURING AN MEMS AND METHOD OF CONFIGURING AN...

MICRO-ELECTRO MECHANICAL SYSTEM AND MANUFACTURING METHOD THEREOF

BOTTOM ELECTRODE VIA STRUCTURES FOR MICROMACHINED ULTRASONIC TRANSD...

Haptic Device with Multiple Fluidically-Controlled Voids

SCANNING MIRROR SYSTEMS AND METHODS OF MANUFACTURE

REDUCED LIGHT REFLECTION PACKAGE

DETECTION STRUCTURE FOR A MEMS ACCELEROMETER HAVING IMPROVED PERFOR...

HIGH ACCURACY TEMPERATURE-COMPENSATED PIEZORESISTIVE POSITION SENSI...

MEMS PRESSURE SENSOR

SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME

Capacitive Linearization Method Applied to MEMS Microphones Systems

MICRO-ELECTROMECHANICAL SYSTEMS (MEMS) DEVICE WITH OUTGAS LAYER

INTEGRATED ULTRASONIC TRANSDUCERS

MEMS MICROPHONE PACKAGE

MICROMACHINED SUPERCONDUCTING INTERCONNECT IN SILICON

MEMS MICROPHONE AND MEMS ACCELEROMETER ON A SINGLE SUBSTRATE

PIEZOELECTRIC ANTI-STICTION STRUCTURE FOR MICROELECTROMECHANICAL SY...

MEMS SENSOR PACKAGE AND ITS MANUFACTURING METHOD

OUTGASSING MATERIAL COATED CAVITY FOR A MICRO-ELECTRO MECHANICAL SY...