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H01L2224/4502

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/4502Disposition

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Temperature-stable composite of a stranded wire having a contact pad
- Patent number 12,308,588
- Issue date May 20, 2025
- Yageo Nexensos GmbH
- Matthias Muziol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,288,760
- Issue date Apr 29, 2025
- Renesas Electronics Corporation
- Takayuki Igarashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadless current sensor package with high isolation
- Patent number 12,265,103
- Issue date Apr 1, 2025
- ALLEGRO MICROSYSTEMS, LLC
- Robert A. Briano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,887,963
- Issue date Jan 30, 2024
- Kioxia Corporation
- Kazuma Hasegawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method of semiconductor device
- Patent number 11,749,635
- Issue date Sep 5, 2023
- SK hynix Inc.
- Nam Jae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and semiconductor package
- Patent number 11,476,210
- Issue date Oct 18, 2022
- Kabushiki Kaisha Toshiba
- Keiichiro Ohsawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming an aluminum oxide layer, metal surface with alumi...
- Patent number 11,424,201
- Issue date Aug 23, 2022
- Infineon Technologies AG
- Michael Rogalli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Terminal structure of a power semiconductor device
- Patent number 11,239,188
- Issue date Feb 1, 2022
- Infineon Technologies AG
- Markus Zundel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 11,233,023
- Issue date Jan 25, 2022
- Kabushiki Kaisha Toshiba
- Hiroaki Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dry etch process landing on metal oxide etch stop layer over metal...
- Patent number 11,195,725
- Issue date Dec 7, 2021
- Texas Instruments Incorporated
- Sebastian Meier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor integrated circuit device
- Patent number 10,818,620
- Issue date Oct 27, 2020
- Renesas Electronics Corporation
- Hiromi Shigihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device
- Patent number 10,784,217
- Issue date Sep 22, 2020
- TOSHIBA MEMORY CORPORATION
- Hiroomi Nakajima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device load terminal
- Patent number 10,756,035
- Issue date Aug 25, 2020
- Infineon Technologies AG
- Roman Roth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 10,741,650
- Issue date Aug 11, 2020
- TOSHIBA MEMORY CORPORATION
- Tsutomu Fujita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dry etch process landing on metal oxide etch stop layer over metal...
- Patent number 10,707,089
- Issue date Jul 7, 2020
- Texas Instruments Incorporated
- Sebastian Meier
- G01 - MEASURING TESTING
Information Patent Grant
Corrosion resistant aluminum bond pad structure
- Patent number 10,615,137
- Issue date Apr 7, 2020
- International Business Machines Corporation
- Charles L. Arvin
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Semiconductor device
- Patent number 10,600,777
- Issue date Mar 24, 2020
- Kabushiki Kaisha Toshiba
- Hisao Ichijo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low CTE component with wire bond interconnects
- Patent number 10,475,726
- Issue date Nov 12, 2019
- Invensas Corporation
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire ball bonding in semiconductor devices
- Patent number 10,340,246
- Issue date Jul 2, 2019
- Texas Instruments Incorporated
- Han Zhong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Corrosion resistant aluminum bond pad structure
- Patent number 10,204,877
- Issue date Feb 12, 2019
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 10,153,241
- Issue date Dec 11, 2018
- Toyota Jidosha Kabushiki Kaisha
- Takemasa Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pillar structure and manufacturing method thereof
- Patent number 10,121,757
- Issue date Nov 6, 2018
- Unimicron Technology Corp.
- Cheng-Jui Chang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor devices and processing methods
- Patent number 10,103,123
- Issue date Oct 16, 2018
- Infineon Technologies AG
- Michael Rogalli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure
- Patent number 10,090,375
- Issue date Oct 2, 2018
- Mediatek Inc.
- Tzu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 10,083,924
- Issue date Sep 25, 2018
- Renesas Electronics Corporation
- Kazuyoshi Maekawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a semiconductor device and semiconductor product
- Patent number 10,002,836
- Issue date Jun 19, 2018
- LFoundry S.r.l.
- Gerhard Spitzlsperger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Corrosion resistant aluminum bond pad structure
- Patent number 9,953,940
- Issue date Apr 24, 2018
- International Business Machines Corporation
- Charles L. Arvin
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Semiconductor device and method of manufacturing the semiconductor...
- Patent number 9,793,228
- Issue date Oct 17, 2017
- RENESAS ELECTRONICS CORPORATION
- Akira Yajima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and manufacturing method thereof
- Patent number 9,768,067
- Issue date Sep 19, 2017
- Xintec Inc.
- Chien-Hung Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and method of fabricating an electronic device
- Patent number 9,756,726
- Issue date Sep 5, 2017
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHODS AND APPARATUS FOR EMBEDDING INTERCONNECT BRIDGES HAVING THR...
- Publication number 20250218953
- Publication date Jul 3, 2025
- Intel Corporation
- Zhixin Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC MODULES HAVING ELECTRICAL CONNECTION ELEMENTS IN THE FOR...
- Publication number 20250219008
- Publication date Jul 3, 2025
- Heraeus Electronics GmbH & Co. KG
- Marcel NEUBAUER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP PACKAGING DEFECT FREE DIMPLE PROCESS AND DEVICE
- Publication number 20250210471
- Publication date Jun 26, 2025
- NXP B.V.
- Chanon SUWANKASAB
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PANEL LEVEL FABRICATION OF STACKED ELECTRONIC DEVICE PACKAGES WITH...
- Publication number 20250167083
- Publication date May 22, 2025
- NXP USA, Inc.
- Sharan Kishore
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20250022785
- Publication date Jan 16, 2025
- Samsung Electronics Co., Ltd.
- PYUNGHWA HAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED CHIPLETS WITH BACKSIDE POWER DELIVERY NETWORK
- Publication number 20250006617
- Publication date Jan 2, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Xu CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP OR MULTI-CHIPLET FAN-OUT DEVICE FOR LAMINATE AND LEADFRA...
- Publication number 20240421051
- Publication date Dec 19, 2024
- Deca Technologies USA, Inc.
- Timothy L. OLSON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP OR MULTI-CHIPLET FAN-OUT DEVICE FOR LAMINATE AND LEADFRA...
- Publication number 20240421052
- Publication date Dec 19, 2024
- Deca Technologies USA, Inc.
- Timothy L. OLSON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGES
- Publication number 20240404931
- Publication date Dec 5, 2024
- Samsung Electronics Co., Ltd.
- Hyejin LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD FOR BONDED BODY, BONDED BODY, MANUFACTURING ME...
- Publication number 20240339368
- Publication date Oct 10, 2024
- FUJIFILM CORPORATION
- Atsushi NAKAMURA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
CARRIER WITH EMBEDDED ELECTRICAL CONNECTION, COMPONENT AND METHOD F...
- Publication number 20240332133
- Publication date Oct 3, 2024
- ams-OSRAM International GmbH
- Michael Zitzlsperger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A SEMICONDUCTOR PACKAGE ASSEMBLY AS WELL A...
- Publication number 20240332144
- Publication date Oct 3, 2024
- NEXPERIA B.V.
- Hiu Hay Nichole Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240219630
- Publication date Jul 4, 2024
- Shanghai Xizhi Technology Co., Ltd.
- Yichen SHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR DEVICE WITH SOLDERABLE POWER PAD
- Publication number 20240194580
- Publication date Jun 13, 2024
- INFINEON TECHNOLOGIES AG
- Susanne Schulte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRE-MOLD SUBSTRATE AND METHOD FOR MANUFACTURING THE PRE-MOLD SUBSTRATE
- Publication number 20240170291
- Publication date May 23, 2024
- HAESUNG DS CO., LTD.
- Jong Hoe Ku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BODY, MOUNTING SUBSTRATE, METHOD FOR MANUFACTURING WIRING BO...
- Publication number 20240153859
- Publication date May 9, 2024
- Panasonic Intellectual Property Management Co., Ltd.
- Takayoshi NIRENGI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD
- Publication number 20240145332
- Publication date May 2, 2024
- Hitachi Energy Ltd
- Niko PAVLICEK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMALLY CONDUCTIVE FILM-LIKE ADHESIVE, SEMICONDUCTOR PACKAGE, AND...
- Publication number 20240128154
- Publication date Apr 18, 2024
- FURUKAWA ELECTRIC CO., LTD.
- Minoru MORITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING BONDING WIRE COATED WITH OXIDE INSU...
- Publication number 20240088088
- Publication date Mar 14, 2024
- Soo Jae PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADLESS CURRENT SENSOR PACKAGE WITH HIGH ISOLATION
- Publication number 20240044946
- Publication date Feb 8, 2024
- ALLEGRO MICROSYSTEMS, LLC
- Robert A. Briano
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240006357
- Publication date Jan 4, 2024
- Rohm Co., Ltd.
- Takayuki OSAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEMPERATURE-STABLE COMPOSITE OF A STRANDED WIRE HAVING A CONTACT PAD
- Publication number 20230318207
- Publication date Oct 5, 2023
- Heraeus Nexensos GmbH
- Matthias MUZIOL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonding Wire and Method for Manufacturing the Same
- Publication number 20230125151
- Publication date Apr 27, 2023
- Nippon Telegraph and Telephone Corporation
- Toshiki Kishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230111921
- Publication date Apr 13, 2023
- RENESAS ELECTRONICS CORPORATION
- Takashi TONEGAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230010383
- Publication date Jan 12, 2023
- RENESAS ELECTRONICS CORPORATION
- Takayuki IGARASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20220130791
- Publication date Apr 28, 2022
- SK HYNIX INC.
- Nam Jae LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220052015
- Publication date Feb 17, 2022
- KIOXIA Corporation
- Kazuma HASEGAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE
- Publication number 20210288006
- Publication date Sep 16, 2021
- Kabushiki Kaisha Toshiba
- Keiichiro Ohsawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20210091021
- Publication date Mar 25, 2021
- Kabushiki Kaisha Toshiba
- Hiroaki TAKAHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE
- Publication number 20200381381
- Publication date Dec 3, 2020
- Toshiba Memory Corporation
- Hiroomi NAKAJIMA
- H01 - BASIC ELECTRIC ELEMENTS

Disposition

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Temperature-stable composite of a stranded wire having a contact pad

Semiconductor device

Leadless current sensor package with high isolation

Semiconductor device

Semiconductor device and manufacturing method of semiconductor device

Semiconductor device and semiconductor package

Method of forming an aluminum oxide layer, metal surface with alumi...

Terminal structure of a power semiconductor device

Semiconductor device and method of manufacturing semiconductor device

Dry etch process landing on metal oxide etch stop layer over metal...

Semiconductor integrated circuit device

Memory device

Semiconductor device load terminal

Semiconductor device and method of manufacturing the same

Dry etch process landing on metal oxide etch stop layer over metal...

Corrosion resistant aluminum bond pad structure

Semiconductor device

Low CTE component with wire bond interconnects

Wire ball bonding in semiconductor devices

Corrosion resistant aluminum bond pad structure

Semiconductor device and method of manufacturing the same

Pillar structure and manufacturing method thereof

Semiconductor devices and processing methods

Semiconductor structure

Semiconductor device and manufacturing method thereof

Method of fabricating a semiconductor device and semiconductor product

Corrosion resistant aluminum bond pad structure

Semiconductor device and method of manufacturing the semiconductor...

Chip package and manufacturing method thereof

Electronic device and method of fabricating an electronic device

Patents Applicationslast 30 patents

METHODS AND APPARATUS FOR EMBEDDING INTERCONNECT BRIDGES HAVING THR...

ELECTRONIC MODULES HAVING ELECTRICAL CONNECTION ELEMENTS IN THE FOR...

SEMICONDUCTOR CHIP PACKAGING DEFECT FREE DIMPLE PROCESS AND DEVICE

PANEL LEVEL FABRICATION OF STACKED ELECTRONIC DEVICE PACKAGES WITH...

SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

EMBEDDED CHIPLETS WITH BACKSIDE POWER DELIVERY NETWORK

MULTI-CHIP OR MULTI-CHIPLET FAN-OUT DEVICE FOR LAMINATE AND LEADFRA...

MULTI-CHIP OR MULTI-CHIPLET FAN-OUT DEVICE FOR LAMINATE AND LEADFRA...

METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGES

MANUFACTURING METHOD FOR BONDED BODY, BONDED BODY, MANUFACTURING ME...

CARRIER WITH EMBEDDED ELECTRICAL CONNECTION, COMPONENT AND METHOD F...

METHOD FOR MANUFACTURING A SEMICONDUCTOR PACKAGE ASSEMBLY AS WELL A...

CHIP PACKAGE AND MANUFACTURING METHOD THEREOF

POWER SEMICONDUCTOR DEVICE WITH SOLDERABLE POWER PAD

PRE-MOLD SUBSTRATE AND METHOD FOR MANUFACTURING THE PRE-MOLD SUBSTRATE

WIRING BODY, MOUNTING SUBSTRATE, METHOD FOR MANUFACTURING WIRING BO...

POWER SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD

THERMALLY CONDUCTIVE FILM-LIKE ADHESIVE, SEMICONDUCTOR PACKAGE, AND...

SEMICONDUCTOR PACKAGE INCLUDING BONDING WIRE COATED WITH OXIDE INSU...

LEADLESS CURRENT SENSOR PACKAGE WITH HIGH ISOLATION

SEMICONDUCTOR DEVICE

TEMPERATURE-STABLE COMPOSITE OF A STRANDED WIRE HAVING A CONTACT PAD

Bonding Wire and Method for Manufacturing the Same

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

MEMORY DEVICE