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ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/0556
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Patents Grants
last 30 patents
Information
Patent Grant
Display panel and display device
Patent number
12,262,605
Issue date
Mar 25, 2025
Wuhan China Star Optoelectronics Technology Co., Ltd.
Shuya Dong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package structure comprising via structure and redist...
Patent number
12,255,166
Issue date
Mar 18, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Neng-Chieh Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Memory device
Patent number
12,254,949
Issue date
Mar 18, 2025
Macronix International Co., Ltd.
Teng-Hao Yeh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Thermocompression bonding using metastable gas atoms
Patent number
12,245,379
Issue date
Mar 4, 2025
SET North America, LLC
Eric Frank Schulte
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Thermocompression bonding with passivated copper-based contacting m...
Patent number
12,245,380
Issue date
Mar 4, 2025
SET North America, LLC
Eric Frank Schulte
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Thermocompression bonding with passivated nickel-based contacting m...
Patent number
12,245,381
Issue date
Mar 4, 2025
SET North America, LLC
Eric Frank Schulte
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Display panel and display apparatus
Patent number
12,243,880
Issue date
Mar 4, 2025
Wuhan Tianma Microelectronics Co., Ltd. Shanghai Branch
Yingying Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic package and implantable medical device including same
Patent number
12,237,281
Issue date
Feb 25, 2025
Medtronic, Inc.
Mark E. Henschel
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of forming the same
Patent number
12,237,282
Issue date
Feb 25, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Wei-Huan Fu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wafer level package with polymer layer delamination prevention desi...
Patent number
12,230,593
Issue date
Feb 18, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Kai-Heng Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods for registration of circuit dies and electrical interconnects
Patent number
12,224,184
Issue date
Feb 11, 2025
3M Innovative Properties Company
Ankit Mahajan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and method of forming the same
Patent number
12,218,096
Issue date
Feb 4, 2025
Samsung Electronics Co., Ltd.
Yeongkwon Ko
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chip parts
Patent number
12,218,123
Issue date
Feb 4, 2025
Rohm Co., Ltd.
Keisuke Fukae
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Barrier structures between external electrical connectors
Patent number
12,218,035
Issue date
Feb 4, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Chia-Chun Miao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit test method and structure thereof
Patent number
12,205,853
Issue date
Jan 21, 2025
Taiwan Semiconductor Manufacturing Co., Ltd
Hsien-Wen Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device including via structure and method for manufac...
Patent number
12,199,015
Issue date
Jan 14, 2025
Samsung Electronics Co., Ltd.
Yeonjin Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Display substrate and preparation method thereof, and display appar...
Patent number
12,199,081
Issue date
Jan 14, 2025
BOE Technology Group Co., Ltd.
Wenqu Liu
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Semiconductor device including a structure for higher integration
Patent number
12,199,123
Issue date
Jan 14, 2025
SONY SEMICONDUCTOR SOLUTIONS CORPORATION
Yoshiya Hagimoto
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and manufacturing method of semiconductor device
Patent number
12,191,266
Issue date
Jan 7, 2025
Kabushiki Kaisha Toshiba
Emiko Inoue
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for manufacturing semiconductor structure
Patent number
12,183,715
Issue date
Dec 31, 2024
NANYA TECHNOLOGY CORPORATION
Ting-Cih Kang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multiple pixel package structure with buried chip and electronic de...
Patent number
12,183,724
Issue date
Dec 31, 2024
Lite-On Opto Technology (Changzhou) Co., Ltd.
Chen-Hsiu Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wafer level dicing method and semiconductor device
Patent number
12,176,248
Issue date
Dec 24, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Ying-Ju Chen
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Contact pad fabrication process for a semiconductor product
Patent number
12,170,256
Issue date
Dec 17, 2024
Texas Instruments Incorporated
Sudtida Lavangkul
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Single-shot encapsulation
Patent number
12,166,001
Issue date
Dec 10, 2024
Semtech Corporation
Kok Khoon Ho
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of manufacturing the same
Patent number
12,165,997
Issue date
Dec 10, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Ching-Hung Kao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and method of manufacturing the semiconductor...
Patent number
12,159,826
Issue date
Dec 3, 2024
Samsung Electronics Co., Ltd.
Myungsam Kang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Light emitting diode and display apparatus having the same
Patent number
12,159,861
Issue date
Dec 3, 2024
SEOUL VIOSYS CO., LTD.
Seong Kyu Jang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Display device
Patent number
12,159,882
Issue date
Dec 3, 2024
KYOCERA Coporation
Hiroaki Ito
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device assembly with die support structures
Patent number
12,148,727
Issue date
Nov 19, 2024
Micron Technology, Inc.
Brandon P. Wirz
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device with interconnectors of different density
Patent number
12,148,689
Issue date
Nov 19, 2024
NANYA TECHNOLOGY CORPORATION
Liang-Pin Chou
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
INTEGRATED CIRCUITS INCLUDING STACKED THIN FILM INDUCTORS AND METHO...
Publication number
20250096117
Publication date
Mar 20, 2025
QUALCOMM Incorporated
Anshih TSENG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED DEVICE COMPRISING A PILLAR SHELL INTERCONNECT AND AN INN...
Publication number
20250087611
Publication date
Mar 13, 2025
QUALCOMM Incorporated
Yujen Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CONDUCTIVE STRUCTURE, SEMICONDUCTOR CHIP INCLUDING THE SAME AND MAN...
Publication number
20250087612
Publication date
Mar 13, 2025
Samsung Electronics Co., Ltd.
JUNHYUN AN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME
Publication number
20250079360
Publication date
Mar 6, 2025
MEDIATEK INC.
Cheng Lin HUANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE ASSEMBLY WITH DIE SUPPORT STRUCTURES
Publication number
20250079376
Publication date
Mar 6, 2025
Micron Technology, Inc.
Brandon P. Wirz
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ARRAY SUBSTRATE, DISPLAY PANEL, AND DISPLAY DEVICE
Publication number
20250070061
Publication date
Feb 27, 2025
HEFEI VISIONOX TECHNOLOGY CO., LTD.
Bo YUAN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WAFER LEVEL DICING METHOD AND SEMICONDUCTOR DEVICE
Publication number
20250069954
Publication date
Feb 27, 2025
Taiwan Semiconductor Manufacturing Co., Ltd.
Ying-Ju Chen
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
LIGHT EMITTING DIODE AND DISPLAY APPARATUS HAVING THE SAME
Publication number
20250062295
Publication date
Feb 20, 2025
Seoul Viosys Co., Ltd.
Seong Kyu JANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SIGNAL TRANSMISSION DEVICE
Publication number
20250062256
Publication date
Feb 20, 2025
DENSO CORPORATION
Shuji ASANO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
Publication number
20250062221
Publication date
Feb 20, 2025
Samsung Electronics Co., Ltd.
Myungsam KANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURES AND METHODS OF FORMING THE SAME
Publication number
20250054885
Publication date
Feb 13, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Hsing-Hsiang Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DEVICE PACKAGES INCLUDING COMMAND/ADDRESS CONNECTIONS, AND RELATED...
Publication number
20250046710
Publication date
Feb 6, 2025
Micron Technology Inc.
Scott Smith
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FUNCTIONAL COMPONENT, FORMING METHOD THEREOF AND ELECTRONIC DEVICE
Publication number
20250046699
Publication date
Feb 6, 2025
Shanghai Avic Opto Electronics Co., Ltd.
Huijun JIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE
Publication number
20250046747
Publication date
Feb 6, 2025
Samsung Electronics Co., Ltd.
Junyun KWEON
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUITS WITH CAPACITORS
Publication number
20250038104
Publication date
Jan 30, 2025
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Rajesh Katkar
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ADHESIVE ATTACHMENT OF PLASMA-ETCH-DICED RFID INTEGRATED CIRCUITS W...
Publication number
20250038139
Publication date
Jan 30, 2025
Impinj, Inc.
James GUZZO
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
Advanced Device Assembly Structures And Methods
Publication number
20250033138
Publication date
Jan 30, 2025
ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
Cyprian Emeka Uzoh
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
MANAGING CONDUCTIVE CONNECTIONS FOR SEMICONDUCTIVE DEVICES
Publication number
20250038044
Publication date
Jan 30, 2025
Yangtze Memory Technologies Co., Ltd.
Yingcheng Zhao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method of Manufacturing a Package Having an Electronic Component an...
Publication number
20250029884
Publication date
Jan 23, 2025
INFINEON TECHNOLOGIES AG
Daniel Porwol
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
Publication number
20250022823
Publication date
Jan 16, 2025
Samsung Electronics Co., Ltd.
Ju-Il CHOI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DEVICE COMPRISING STACKED THROUGH ENCAPSULATION VIA INTERCONNECTS
Publication number
20250022858
Publication date
Jan 16, 2025
QUALCOMM Incorporated
Kai LIU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE
Publication number
20250022758
Publication date
Jan 16, 2025
Samsung Electronics Co., Ltd.
Yongho KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE
Publication number
20250014974
Publication date
Jan 9, 2025
Samsung Electronics Co., Ltd.
Jing Cheng LIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGED MULTI-CHIP SEMICONDUCTOR DEVICES AND METHODS OF FABRICATIN...
Publication number
20250015026
Publication date
Jan 9, 2025
Samsung Electronics Co., LTD
Hyuekjae Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE ASSEMBLY WITH SURFACE-MOUNT DIE SUPPORT STRUCT...
Publication number
20240429191
Publication date
Dec 26, 2024
Micron Technology, Inc.
Brandon P. Wirz
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DIE ATTACH SURFACE COPPER LAYER WITH PROTECTIVE LAYER FOR MICROELEC...
Publication number
20240421045
Publication date
Dec 19, 2024
TEXAS INSTRUMENTS INCORPORATED
Christopher Daniel Manack
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MIM Capacitor in IC Heterogenous Integration
Publication number
20240421063
Publication date
Dec 19, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Tsung-Chieh Hsiao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
Publication number
20240421095
Publication date
Dec 19, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Chih-Hung Cheng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LOCALIZED HIGH DENSITY SUBSTRATE ROUTING
Publication number
20240421073
Publication date
Dec 19, 2024
Intel Corporation
Robert Starkston
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DIE STRUCTURES AND METHODS OF FORMING THE SAME
Publication number
20240413028
Publication date
Dec 12, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Hsien-Wei Chen
H01 - BASIC ELECTRIC ELEMENTS