Integrating an electronic processing unit with a micromechanical structure

Industry

CPC
B81C2203/07

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

BPERFORMING OPERATIONS TRANSPORTING B81Micro-structural technology B81CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICRO-STRUCTURAL DEVICES OR SYSTEMS B81C2203/00Forming micro-structural systems

Current Industry

B81C2203/07Integrating an electronic processing unit with a micromechanical structure

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Interconnection for monolithically integrated stacked devices and m...
- Patent number 12,330,189
- Issue date Jun 17, 2025
- GLOBALFOUNDRIES SINGAPOREPTE. LTD.
- You Qian
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device and method of forming microelectromechanical s...
- Patent number 12,319,564
- Issue date Jun 3, 2025
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Signal processing circuit for triple-membrane MEMS device
- Patent number 12,304,808
- Issue date May 20, 2025
- Infineon Technologies AG
- Marc Fueldner
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Device for protecting FEOL element and BEOL element
- Patent number 12,297,103
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ping-Chun Yeh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor structure including scribe line structures and method...
- Patent number 12,297,105
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Wei-Cheng Shen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Bottom electrode via structures for micromachined ultrasonic transd...
- Patent number 12,269,061
- Issue date Apr 8, 2025
- BFLY OPERATIONS, INC.
- Lingyun Miao
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Electrically controllable integrated switch
- Patent number 12,272,509
- Issue date Apr 8, 2025
- STMicroelectronics (Rousset) SAS
- Christian Rivero
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device having microelectromechanical systems devices...
- Patent number 12,257,602
- Issue date Mar 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- I-Hsuan Chiu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device and method for forming the same
- Patent number 12,227,410
- Issue date Feb 18, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Po Chen Yeh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for transferring a layer to a substrate
- Patent number 12,214,580
- Issue date Feb 4, 2025
- Imec VZW
- Boshen Liang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
CMUT-on-CMOS ultrasonic transducer by bonding active wafers and man...
- Patent number 12,208,416
- Issue date Jan 28, 2025
- Zhejiang Xiansheng Technology Co., Ltd.
- Feng Yin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS packages and methods of manufacture thereof
- Patent number 12,209,015
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Sensor package and method of producing the sensor package
- Patent number 12,180,066
- Issue date Dec 31, 2024
- Sciosense B.V.
- Willem Frederik Adrianus Besling
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Monolithic post complementary metal-oxide-semiconductor integration...
- Patent number 12,168,603
- Issue date Dec 17, 2024
- MERIDIAN INNOVATION PTE LTD
- Wan Chia Ang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method and structure for CMOS-MEMS thin film encapsulation
- Patent number 12,134,555
- Issue date Nov 5, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Yu-Chia Liu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microelectronics package with vertically stacked MEMS device and co...
- Patent number 12,129,168
- Issue date Oct 29, 2024
- Qorvo US, Inc.
- Julio C. Costa
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
SOC PMUT suitable for high-density system integration, array chip,...
- Patent number 12,060,264
- Issue date Aug 13, 2024
- NANJING SHENGXI XINYING TECHNOLOGY CO., LTD
- Hui Li
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for producing monolithic integration of piezoelectric microm...
- Patent number 12,037,239
- Issue date Jul 16, 2024
- VANGUARD INTERNATIONAL SEMICONDUCTOR SINGAPORE PTE. LTD.
- You Qian
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for producing a wafer connection
- Patent number 12,030,773
- Issue date Jul 9, 2024
- Robert Bosch GmbH
- Friedjof Heuck
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor integrated device with electrical contacts between st...
- Patent number 12,024,422
- Issue date Jul 2, 2024
- STMicroelectronics S.r.l.
- Enri Duqi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Sensing device and method for manufacturing sensing device
- Patent number 12,024,420
- Issue date Jul 2, 2024
- Mitsumi Electric Co., Ltd.
- Etsuji Hayakawa
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of manufacturing electronic devices and corresponding electr...
- Patent number 12,017,910
- Issue date Jun 25, 2024
- STMicroelectronics (Malta) Ltd.
- Kevin Formosa
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Gas sensor MEMS structures and methods of fabrication thereof
- Patent number 11,988,600
- Issue date May 21, 2024
- National University of Singapore
- Enrico Macrelli
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
CMOS cap for MEMS devices
- Patent number 11,990,498
- Issue date May 21, 2024
- MERIDIAN INNOVATION PTE LTD
- Wan Chia Ang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor package and method for manufacturing the same
- Patent number 11,973,048
- Issue date Apr 30, 2024
- Advanced Semiconductor Engineering, Inc.
- An-Nong Wen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Integrated digital force sensors and related methods of manufacture
- Patent number 11,946,817
- Issue date Apr 2, 2024
- DecaWave, Ltd.
- Ali Foughi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS device having a metallization structure embedded in a dielectr...
- Patent number 11,932,534
- Issue date Mar 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hung-Hua Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Signal processing circuit for triple-membrane MEMS device
- Patent number 11,932,533
- Issue date Mar 19, 2024
- Infineon Technologies AG
- Marc Fueldner
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Micromechanical sensor device having an ASIC chip integrated into a...
- Patent number 11,906,383
- Issue date Feb 20, 2024
- Robert Bosch GmbH
- Stefan Pinter
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS tab removal process
- Patent number 11,905,170
- Issue date Feb 20, 2024
- Invensense, Inc.
- Daesung Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
MEMS MIRROR MODULE WITH STRESS-DECOUPLED VIBRATIONAL MODES
- Publication number 20250236509
- Publication date Jul 24, 2025
- Microsoft Technology Licensing, LLC
- Di SUN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF MAKING
- Publication number 20250223153
- Publication date Jul 10, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Yu-Hsun LI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE HAVING MICROELECTROMECHANICAL SYSTEMS DEVICES...
- Publication number 20250214108
- Publication date Jul 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- I-Hsuan Chiu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROELECTROMECHANICAL DEVICE
- Publication number 20250199414
- Publication date Jun 19, 2025
- ROBERT BOSCH GmbH
- Ralf NOLTEMEYER
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHODS OF FABRICATING MICRO ELECTRO-MECHANICAL SYSTEMS STRUCTURES
- Publication number 20250162860
- Publication date May 22, 2025
- The University of British Columbia
- Chang Ge
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME
- Publication number 20250145454
- Publication date May 8, 2025
- Taiwan Semiconductor Manufacturing company Ltd.
- PO CHEN YEH
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INTEGRATED SENSOR DEVICE
- Publication number 20250109011
- Publication date Apr 3, 2025
- INFINEON TECHNOLOGIES AG
- Horst Theuss
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
FOUNDRY-COMPATIBLE THROUGH SILICON VIA PROCESS FOR INTEGRATED MICRO...
- Publication number 20250059023
- Publication date Feb 20, 2025
- Vibrant Microsystems Inc.
- Joseph Doll
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS ACOUSTIC ELEMENT
- Publication number 20250039611
- Publication date Jan 30, 2025
- Murata Manufacturing Co., Ltd.
- Ryosuke NIWA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
FOUNDRY-COMPATIBLE PROCESS FOR INTEGRATED MICRO-SPEAKER AND MICROPHONE
- Publication number 20250030998
- Publication date Jan 23, 2025
- Vibrant Microsystems Inc.
- Joseph Doll
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROELECTRONICS PACKAGE WITH VERTICALLY STACKED MEMS DEVICE AND CO...
- Publication number 20250002330
- Publication date Jan 2, 2025
- Qorvo US, Inc.
- Julio C. Costa
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
OVER-THE-SINK DRYING ELEMENT
- Publication number 20240406640
- Publication date Dec 5, 2024
- DORAI HOME, INC.
- Jason Klug
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROELECTROMECHANICAL DEVICE AND METHOD FOR MAKING THE SAME
- Publication number 20240383743
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Yu LIAO
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME
- Publication number 20240383005
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kang-Yi Lien
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
HIGHLY SENSITIVE THERMOELECTRIC-BASED INFRARED DETECTOR WITH HIGH C...
- Publication number 20240351863
- Publication date Oct 24, 2024
- Meridian Innovation Pte Ltd
- Wan Chia Ang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR MANUFACTURING A MEMS TRANSDUCER DEVICE WITH THIN MEMBRAN...
- Publication number 20240327203
- Publication date Oct 3, 2024
- STMicroelectronics International N.V.
- Mark Andrew SHAW
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PROCESS FLOW FOR THIN CONTACTLESS THERMAL SENSORS
- Publication number 20240272004
- Publication date Aug 15, 2024
- STMicroelectronics International N.V.
- Enri DUQI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DECOUPLING METHOD FOR SEMICONDUCTOR DEVICE
- Publication number 20240228264
- Publication date Jul 11, 2024
- STMicroelectronics International N.V.
- Roseanne DUCA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROFLUIDIC DEVICE AND A METHOD FOR MANUFACTURING A MICROFLUIDIC D...
- Publication number 20240207845
- Publication date Jun 27, 2024
- IMEC vzw
- Lei ZHANG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
VERTICALLY STACKED MEMS DEVICES AND CONTROLLER DEVICE
- Publication number 20240199411
- Publication date Jun 20, 2024
- Qorvo US, Inc.
- Robertus Petrus Van Kampen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR PRODUCING A MICROELECTROMECHANICAL COMPONENT
- Publication number 20240182298
- Publication date Jun 6, 2024
- ROBERT BOSCH GmbH
- Johannes CLASSEN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS LOUDSPEAKER MANUFACTURING METHOD AND MEMS LOUDSPEAKER
- Publication number 20240174513
- Publication date May 30, 2024
- AAC Kaitai Technologies (Wuhan) CO., LTD
- Qiang Dan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SIGNAL PROCESSING CIRCUIT FOR TRIPLE-MEMBRANE MEMS DEVICE
- Publication number 20240174514
- Publication date May 30, 2024
- INFINEON TECHNOLOGIES AG
- Marc Fueldner
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME
- Publication number 20240140782
- Publication date May 2, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- PO CHEN YEH
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR MANUFACTURING A DEVICE COMPRISING TWO SEMICONDUCTOR DICE...
- Publication number 20240140783
- Publication date May 2, 2024
- STMicroelectronics S.r.l.
- Mark Andrew SHAW
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DECOUPLING METHOD FOR SEMICONDUCTOR DEVICE
- Publication number 20240132340
- Publication date Apr 25, 2024
- STMicroelectronics (Malta) Ltd.
- Roseanne DUCA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CMOS ULTRASONIC TRANSDUCERS AND RELATED APPARATUS AND METHODS
- Publication number 20240100565
- Publication date Mar 28, 2024
- BFLY OPERATIONS, INC.
- Jonathan M. Rothberg
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICRO-ELECTRO MECHANICAL SYSTEM AND MANUFACTURING METHOD THEREOF
- Publication number 20240083742
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ting-Li YANG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROFABRICATED ULTRASONIC TRANSDUCERS AND RELATED APPARATUS AND ME...
- Publication number 20240044846
- Publication date Feb 8, 2024
- BFLY OPERATIONS, INC.
- Jonathan M. Rothberg
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
BOTTOM ELECTRODE VIA STRUCTURES FOR MICROMACHINED ULTRASONIC TRANSD...
- Publication number 20240024917
- Publication date Jan 25, 2024
- BFLY OPERATIONS, INC.
- Lingyun Miao
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Integrating an electronic processing unit with a micromechanical structure

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Interconnection for monolithically integrated stacked devices and m...

Semiconductor device and method of forming microelectromechanical s...

Signal processing circuit for triple-membrane MEMS device

Device for protecting FEOL element and BEOL element

Semiconductor structure including scribe line structures and method...

Bottom electrode via structures for micromachined ultrasonic transd...

Electrically controllable integrated switch

Semiconductor device having microelectromechanical systems devices...

Semiconductor device and method for forming the same

Method for transferring a layer to a substrate

CMUT-on-CMOS ultrasonic transducer by bonding active wafers and man...

MEMS packages and methods of manufacture thereof

Sensor package and method of producing the sensor package

Monolithic post complementary metal-oxide-semiconductor integration...

Method and structure for CMOS-MEMS thin film encapsulation

Microelectronics package with vertically stacked MEMS device and co...

SOC PMUT suitable for high-density system integration, array chip,...

Method for producing monolithic integration of piezoelectric microm...

Method for producing a wafer connection

Semiconductor integrated device with electrical contacts between st...

Sensing device and method for manufacturing sensing device

Method of manufacturing electronic devices and corresponding electr...

Gas sensor MEMS structures and methods of fabrication thereof

CMOS cap for MEMS devices

Semiconductor package and method for manufacturing the same

Integrated digital force sensors and related methods of manufacture

MEMS device having a metallization structure embedded in a dielectr...

Signal processing circuit for triple-membrane MEMS device

Micromechanical sensor device having an ASIC chip integrated into a...

MEMS tab removal process

Patents Applicationslast 30 patents

MEMS MIRROR MODULE WITH STRESS-DECOUPLED VIBRATIONAL MODES

SEMICONDUCTOR STRUCTURE AND METHOD OF MAKING

SEMICONDUCTOR DEVICE HAVING MICROELECTROMECHANICAL SYSTEMS DEVICES...

MICROELECTROMECHANICAL DEVICE

METHODS OF FABRICATING MICRO ELECTRO-MECHANICAL SYSTEMS STRUCTURES

SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME

INTEGRATED SENSOR DEVICE

FOUNDRY-COMPATIBLE THROUGH SILICON VIA PROCESS FOR INTEGRATED MICRO...

MEMS ACOUSTIC ELEMENT

FOUNDRY-COMPATIBLE PROCESS FOR INTEGRATED MICRO-SPEAKER AND MICROPHONE

MICROELECTRONICS PACKAGE WITH VERTICALLY STACKED MEMS DEVICE AND CO...

OVER-THE-SINK DRYING ELEMENT

MICROELECTROMECHANICAL DEVICE AND METHOD FOR MAKING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME

HIGHLY SENSITIVE THERMOELECTRIC-BASED INFRARED DETECTOR WITH HIGH C...

METHOD FOR MANUFACTURING A MEMS TRANSDUCER DEVICE WITH THIN MEMBRAN...

PROCESS FLOW FOR THIN CONTACTLESS THERMAL SENSORS

DECOUPLING METHOD FOR SEMICONDUCTOR DEVICE

MICROFLUIDIC DEVICE AND A METHOD FOR MANUFACTURING A MICROFLUIDIC D...

VERTICALLY STACKED MEMS DEVICES AND CONTROLLER DEVICE

METHOD FOR PRODUCING A MICROELECTROMECHANICAL COMPONENT

MEMS LOUDSPEAKER MANUFACTURING METHOD AND MEMS LOUDSPEAKER

SIGNAL PROCESSING CIRCUIT FOR TRIPLE-MEMBRANE MEMS DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME

METHOD FOR MANUFACTURING A DEVICE COMPRISING TWO SEMICONDUCTOR DICE...

DECOUPLING METHOD FOR SEMICONDUCTOR DEVICE

CMOS ULTRASONIC TRANSDUCERS AND RELATED APPARATUS AND METHODS

MICRO-ELECTRO MECHANICAL SYSTEM AND MANUFACTURING METHOD THEREOF

MICROFABRICATED ULTRASONIC TRANSDUCERS AND RELATED APPARATUS AND ME...

BOTTOM ELECTRODE VIA STRUCTURES FOR MICROMACHINED ULTRASONIC TRANSD...