Packaging MEMS

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B81C2203/01

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BPERFORMING OPERATIONS TRANSPORTING B81Micro-structural technology B81CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICRO-STRUCTURAL DEVICES OR SYSTEMS B81C2203/00Forming micro-structural systems

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B81C2203/01Packaging MEMS

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Methods and apparatus for electronic device packaging
- Patent number 12,365,584
- Issue date Jul 22, 2025
- Texas Instruments Incorporated
- Jane Liu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS resonator integrated cicruit fabrication
- Patent number 12,365,582
- Issue date Jul 22, 2025
- SiTime Corporation
- Pavan Gupta
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Fabrication of glass cells for hermetic gas enclosures
- Patent number 12,366,831
- Issue date Jul 22, 2025
- mb-microtec ag
- Serge Lukas Zihlmann
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Pressure sensor structure, pressure sensor device, and method of ma...
- Patent number 12,345,593
- Issue date Jul 1, 2025
- Murata Manufacturing Co., Ltd.
- Kaoru Kishigui
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Embedded permeable polysilicon layer in MEMS device for multiple ca...
- Patent number 12,330,934
- Issue date Jun 17, 2025
- STMICROELECTRONICS INTERNATIONAL N.V.
- Federico Vercesi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microelectromechanical device with out-of-plane stopper structure
- Patent number 12,325,628
- Issue date Jun 10, 2025
- STMicroelectronics S.r.l.
- Luca Guerinoni
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Systems and methods for providing getters in microelectromechanical...
- Patent number 12,319,562
- Issue date Jun 3, 2025
- Invensense, Inc.
- Daesung Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor package with metal column mold barrier
- Patent number 12,319,563
- Issue date Jun 3, 2025
- Texas Instruments Incorporated
- Rafael Jose Lizares Guevara
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS environmental sensor and preparation method therefor
- Patent number 12,319,565
- Issue date Jun 3, 2025
- MultiDimension Technology Co., Ltd.
- Insik Jin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Bond force concentrator
- Patent number 12,304,809
- Issue date May 20, 2025
- KYOCERA Technologies Oy
- Elmeri Österlund
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Device for protecting FEOL element and BEOL element
- Patent number 12,297,103
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ping-Chun Yeh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor structure and formation thereof
- Patent number 12,297,104
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Kai-Lan Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Inertial sensor and method for manufacturing the same
- Patent number 12,269,733
- Issue date Apr 8, 2025
- Denso Corporation
- Keitaro Ito
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method and system for fabricating a MEMS device
- Patent number 12,258,266
- Issue date Mar 25, 2025
- Invensense, Inc.
- Daesung Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Resonance device and resonance device manufacturing method
- Patent number 12,252,393
- Issue date Mar 18, 2025
- Murata Manufacturing Co., Ltd.
- Masakazu Fukumitsu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Sensor package substrate, sensor module having the same, and sensor...
- Patent number 12,240,751
- Issue date Mar 4, 2025
- TDK Corporation
- Kazutoshi Tsuyutani
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Top notch slit profile for MEMS device
- Patent number 12,238,478
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ting-Jung Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Outgassing material coated cavity for a micro-electro mechanical sy...
- Patent number 12,234,141
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Kuei-Sung Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS packages and methods of manufacture thereof
- Patent number 12,209,015
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer level package for device
- Patent number 12,209,012
- Issue date Jan 28, 2025
- Teknologian tutkimuskeskus VTT Oy
- Jae-Wung Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Micro electro mechanical system (MEMs) device having metal sealing...
- Patent number 12,202,724
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Ching-Kai Shen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for producing a plurality of sensor devices, and sensor device
- Patent number 12,195,330
- Issue date Jan 14, 2025
- Robert Bosch GmbH
- Daniel Haug
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS cavity with non-contaminating seal
- Patent number 12,187,606
- Issue date Jan 7, 2025
- SiTime Corporation
- Michael Julian Daneman
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method and system for fabricating a MEMS device
- Patent number 12,180,069
- Issue date Dec 31, 2024
- Invensense, Inc.
- Daesung Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Enclosed cavity structures
- Patent number 12,162,747
- Issue date Dec 10, 2024
- X-CELEPRINT LIMITED
- Ronald S. Cok
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Anti-stiction process for MEMS device
- Patent number 12,157,667
- Issue date Dec 3, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jui-Chun Weng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Conductive bond structure to increase membrane sensitivity in MEMS...
- Patent number 12,139,399
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hung-Hua Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Undercut-free patterned aluminum nitride structure and methods for...
- Patent number 12,134,824
- Issue date Nov 5, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Yuan-Chih Hsieh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Reduced light reflection package
- Patent number 12,133,049
- Issue date Oct 29, 2024
- Invensense, Inc.
- Roberto Brioschi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Sensor devices with gas-permeable cover and associated production m...
- Patent number 12,122,667
- Issue date Oct 22, 2024
- Infineon Technologies AG
- Rainer Markus Schaller
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
BOND FORCE CONCENTRATOR
- Publication number 20250236512
- Publication date Jul 24, 2025
- KYOCERA Technologies Oy
- Elmeri ÖSTERLUND
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Inertial Sensor And Electronic Component
- Publication number 20250236511
- Publication date Jul 24, 2025
- SEIKO EPSON CORPORATION
- Tomonaga KOBAYASHI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS cavity with non-contaminating seal
- Publication number 20250236513
- Publication date Jul 24, 2025
- SiTime Corporation
- Michael Julian Daneman
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20250230036
- Publication date Jul 17, 2025
- Taiwan Semiconductor Manufacturing company Ltd.
- WEN-TUAN LO
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PACKAGING FOR MICRO-ELECTROMECHANICAL SYSTEM (MEMS) DEVICE
- Publication number 20250197196
- Publication date Jun 19, 2025
- QUALCOMM Incorporated
- Emre TOPAL
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20250197195
- Publication date Jun 19, 2025
- AAC TECHNOLOGIES PTE. LTD
- Veronica Tan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEALED MICROELECTROMECHANICAL MEMBRANE DEVICE
- Publication number 20250178886
- Publication date Jun 5, 2025
- STMicroelectronics International N.V.
- Mark Andrew SHAW
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROELECTROMECHANICAL COMPONENT WITH A METAL STANDOFF
- Publication number 20250178887
- Publication date Jun 5, 2025
- Murata Manufacturing Co., Ltd.
- Marcus RINKIÖ
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PROCESS FOR MANUFACTURING A COMBINED MICROELECTROMECHANICAL DEVICE...
- Publication number 20250178889
- Publication date Jun 5, 2025
- STMicroelectronics International N.V.
- Anna GUERRA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR MANUFACTURING A PACKAGING STRUCTURE
- Publication number 20250171299
- Publication date May 29, 2025
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Audrey BERTHELOT
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
OUTGASSING MATERIAL COATED CAVITY FOR A MICRO-ELECTRO MECHANICAL SY...
- Publication number 20250162859
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Kuei-Sung Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD AND SYSTEM FOR FABRICATING A MEMS DEVICE
- Publication number 20250145456
- Publication date May 8, 2025
- InvenSense, Inc.
- Daesung Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICRO-ELECTRO-MECHANICAL SYSTEM PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20250145452
- Publication date May 8, 2025
- Vanguard International Semiconductor Corporation
- RAKESH CHAND
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
WAFER-LEVEL FABRICATION PROCESSES FOR FERRIMAGNETIC RESONATORS AND...
- Publication number 20250136441
- Publication date May 1, 2025
- The Regents of the University of California
- Andrei M. SHKEL
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS SWITCH WITH PLANAR THROUGH GLASS VIAS (TGV)
- Publication number 20250136436
- Publication date May 1, 2025
- Menlo Microsystems, Inc.
- Aric Shorey
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
BOND FORCE CONCENTRATOR
- Publication number 20250136438
- Publication date May 1, 2025
- KYOCERA Technologies Oy
- Elmeri ÖSTERLUND
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MICROELECTROMECHANICAL SENSING DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20250128935
- Publication date Apr 24, 2025
- Industrial Technology Research Institute
- Ming-Fa CHEN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROELECTROMECHANICAL COMPONENT WITH GAP-CONTROL STRUCTURE AND A M...
- Publication number 20250109015
- Publication date Apr 3, 2025
- Murata Manufacturing Co., Ltd.
- Jeanette LINDROOS
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD AND SYSTEM FOR FABRICATING A MEMS DEVICE
- Publication number 20250074766
- Publication date Mar 6, 2025
- InvenSense, Inc.
- Daesung Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
HIGH RELIABILITY SENSOR
- Publication number 20250074765
- Publication date Mar 6, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Daiki Komatsu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS ACOUSTIC ELEMENT
- Publication number 20250039611
- Publication date Jan 30, 2025
- Murata Manufacturing Co., Ltd.
- Ryosuke NIWA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INERTIAL SENSOR AND METHOD FOR FORMING THE SAME
- Publication number 20250026630
- Publication date Jan 23, 2025
- AAC TECHNOLOGIES PTE. LTD
- Veronica Tan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
STACKED-DIE MEMS RESONATOR
- Publication number 20250019229
- Publication date Jan 16, 2025
- SiTime Corporation
- Pavan Gupta
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS RESONATOR AND METHOD FOR PRODUCING THE SAME
- Publication number 20240425360
- Publication date Dec 26, 2024
- Rohm Co., Ltd.
- Toma FUJITA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ENCLOSURE
- Publication number 20240417244
- Publication date Dec 19, 2024
- SCHOTT AG
- Jens Ulrich Thomas
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MEMS DEVICE WITH A CAP LAYER HAVING GAPS AND METHOD OF MANUFACTURIN...
- Publication number 20240409398
- Publication date Dec 12, 2024
- Murata Manufacturing Co., Ltd.
- Konsta HANNULA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
OVER-THE-SINK DRYING ELEMENT
- Publication number 20240406640
- Publication date Dec 5, 2024
- DORAI HOME, INC.
- Jason Klug
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS DEVICE AND METHOD FOR MANUFACTURING MEMS DEVICE
- Publication number 20240400374
- Publication date Dec 5, 2024
- Rohm Co., Ltd.
- Toma FUJITA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR STRUCTURE AND FORMATION THEREOF
- Publication number 20240391761
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Kai-Lan CHANG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Packaging of microelectromechanical system devices
- Publication number 20240391762
- Publication date Nov 28, 2024
- Teknologian Tutkimuskeskus VTT Oy
- Jae-Wung Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Packaging MEMS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Methods and apparatus for electronic device packaging

MEMS resonator integrated cicruit fabrication

Fabrication of glass cells for hermetic gas enclosures

Pressure sensor structure, pressure sensor device, and method of ma...

Embedded permeable polysilicon layer in MEMS device for multiple ca...

Microelectromechanical device with out-of-plane stopper structure

Systems and methods for providing getters in microelectromechanical...

Semiconductor package with metal column mold barrier

MEMS environmental sensor and preparation method therefor

Bond force concentrator

Device for protecting FEOL element and BEOL element

Semiconductor structure and formation thereof

Inertial sensor and method for manufacturing the same

Method and system for fabricating a MEMS device

Resonance device and resonance device manufacturing method

Sensor package substrate, sensor module having the same, and sensor...

Top notch slit profile for MEMS device

Outgassing material coated cavity for a micro-electro mechanical sy...

MEMS packages and methods of manufacture thereof

Wafer level package for device

Micro electro mechanical system (MEMs) device having metal sealing...

Method for producing a plurality of sensor devices, and sensor device

MEMS cavity with non-contaminating seal

Method and system for fabricating a MEMS device

Enclosed cavity structures

Anti-stiction process for MEMS device

Conductive bond structure to increase membrane sensitivity in MEMS...

Undercut-free patterned aluminum nitride structure and methods for...

Reduced light reflection package

Sensor devices with gas-permeable cover and associated production m...

Patents Applicationslast 30 patents

BOND FORCE CONCENTRATOR

Inertial Sensor And Electronic Component

MEMS cavity with non-contaminating seal

PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME

PACKAGING FOR MICRO-ELECTROMECHANICAL SYSTEM (MEMS) DEVICE

MEMS DEVICE AND MANUFACTURING METHOD THEREOF

SEALED MICROELECTROMECHANICAL MEMBRANE DEVICE

MICROELECTROMECHANICAL COMPONENT WITH A METAL STANDOFF

PROCESS FOR MANUFACTURING A COMBINED MICROELECTROMECHANICAL DEVICE...

METHOD FOR MANUFACTURING A PACKAGING STRUCTURE

OUTGASSING MATERIAL COATED CAVITY FOR A MICRO-ELECTRO MECHANICAL SY...

METHOD AND SYSTEM FOR FABRICATING A MEMS DEVICE

MICRO-ELECTRO-MECHANICAL SYSTEM PACKAGE AND FABRICATION METHOD THEREOF

WAFER-LEVEL FABRICATION PROCESSES FOR FERRIMAGNETIC RESONATORS AND...

MEMS SWITCH WITH PLANAR THROUGH GLASS VIAS (TGV)

BOND FORCE CONCENTRATOR

MICROELECTROMECHANICAL SENSING DEVICE AND MANUFACTURING METHOD THEREOF

MICROELECTROMECHANICAL COMPONENT WITH GAP-CONTROL STRUCTURE AND A M...

METHOD AND SYSTEM FOR FABRICATING A MEMS DEVICE

HIGH RELIABILITY SENSOR

MEMS ACOUSTIC ELEMENT

INERTIAL SENSOR AND METHOD FOR FORMING THE SAME

STACKED-DIE MEMS RESONATOR

MEMS RESONATOR AND METHOD FOR PRODUCING THE SAME

ENCLOSURE

MEMS DEVICE WITH A CAP LAYER HAVING GAPS AND METHOD OF MANUFACTURIN...

OVER-THE-SINK DRYING ELEMENT

MEMS DEVICE AND METHOD FOR MANUFACTURING MEMS DEVICE

SEMICONDUCTOR STRUCTURE AND FORMATION THEREOF

Packaging of microelectromechanical system devices