Packaging MEMS

Industry

CPC
B81C2203/01

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

BPERFORMING OPERATIONS TRANSPORTING B81Micro-structural technology B81CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICRO-STRUCTURAL DEVICES OR SYSTEMS B81C2203/00Forming micro-structural systems

Current Industry

B81C2203/01Packaging MEMS

Industries

Patents Grantslast 30 patents

Information Patent Grant
Enclosed cavity structures
- Patent number 12,162,747
- Issue date Dec 10, 2024
- X-CELEPRINT LIMITED
- Ronald S. Cok
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Anti-stiction process for MEMS device
- Patent number 12,157,667
- Issue date Dec 3, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jui-Chun Weng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Conductive bond structure to increase membrane sensitivity in MEMS...
- Patent number 12,139,399
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hung-Hua Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Undercut-free patterned aluminum nitride structure and methods for...
- Patent number 12,134,824
- Issue date Nov 5, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Yuan-Chih Hsieh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Reduced light reflection package
- Patent number 12,133,049
- Issue date Oct 29, 2024
- Invensense, Inc.
- Roberto Brioschi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Sensor devices with gas-permeable cover and associated production m...
- Patent number 12,122,667
- Issue date Oct 22, 2024
- Infineon Technologies AG
- Rainer Markus Schaller
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS device having decreased contact resistance
- Patent number 12,077,431
- Issue date Sep 3, 2024
- Qorvo US, Inc.
- Shibajyoti Ghosh Dastider
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Hermetically sealed MEMS mirror and method of manufacture
- Patent number 12,078,799
- Issue date Sep 3, 2024
- STMicroelectron S.r.l.
- Giorgio Allegato
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Micro-acoustic wafer-level package and method of manufacture
- Patent number 12,071,339
- Issue date Aug 27, 2024
- RF360 SINGAPORE PTE. LTD.
- Manuel Hofer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Ingress protection mechanism
- Patent number 12,035,092
- Issue date Jul 9, 2024
- GM CRUISE HOLDINGS LLC
- Amanda Lind
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of manufacturing a sensor device and moulding support structure
- Patent number 12,024,418
- Issue date Jul 2, 2024
- Melexis Technologies NV
- Appolonius Jacobus Van Der Wiel
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Sensing device and method for manufacturing sensing device
- Patent number 12,024,420
- Issue date Jul 2, 2024
- Mitsumi Electric Co., Ltd.
- Etsuji Hayakawa
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of manufacturing electronic devices and corresponding electr...
- Patent number 12,017,910
- Issue date Jun 25, 2024
- STMicroelectronics (Malta) Ltd.
- Kevin Formosa
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Hermetically sealed, toughened glass package and method for produci...
- Patent number 11,993,511
- Issue date May 28, 2024
- Schott AG
- Jens Ulrich Thomas
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS resonator system
- Patent number 11,987,495
- Issue date May 21, 2024
- SiTime Corporation
- Pavan Gupta
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Enclosed cavity structures
- Patent number 11,981,559
- Issue date May 14, 2024
- X-CELEPRINT LIMITED
- Ronald S. Cok
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Hermetically sealed transparent cavity and package for same
- Patent number 11,975,962
- Issue date May 7, 2024
- Schott AG
- Jens Ulrich Thomas
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for producing a microelectromechanical sensor and microelect...
- Patent number 11,958,740
- Issue date Apr 16, 2024
- Robert Bosch GmbH
- Achim Kronenberger
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Hollow package and method for manufacturing same
- Patent number 11,955,394
- Issue date Apr 9, 2024
- Nippon Kayaku Kabushiki Kaisha
- Tadashi Naito
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Integrated digital force sensors and related methods of manufacture
- Patent number 11,946,817
- Issue date Apr 2, 2024
- DecaWave, Ltd.
- Ali Foughi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Systems and methods for providing getters in microelectromechanical...
- Patent number 11,945,713
- Issue date Apr 2, 2024
- Invensense, Inc.
- Daesung Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Electronic device and corresponding method
- Patent number 11,945,714
- Issue date Apr 2, 2024
- STMicroelectronics S.r.l.
- Alex Gritti
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS device, manufacturing method of the same, and integrated MEMS...
- Patent number 11,939,212
- Issue date Mar 26, 2024
- Industrial Technology Research Institute
- Heng-chung Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microelectromechanical structure including a functional element sit...
- Patent number 11,939,215
- Issue date Mar 26, 2024
- Robert Bosch GmbH
- Penny Weir
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS device having a metallization structure embedded in a dielectr...
- Patent number 11,932,534
- Issue date Mar 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hung-Hua Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Packaging of microfluidic devices and microfluidic integrated syste...
- Patent number 11,926,522
- Issue date Mar 12, 2024
- Corporation for National Research Initiatives
- Michael A. Huff
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Methods including panel bonding acts and electronic devices includi...
- Patent number 11,921,032
- Issue date Mar 5, 2024
- Infineon Technologies AG
- Horst Theuss
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Enclosed cavity structures
- Patent number 11,897,760
- Issue date Feb 13, 2024
- X-CELEPRINT LIMITED
- Ronald S. Cok
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Sensing module and manufacturing method thereof
- Patent number 11,894,473
- Issue date Feb 6, 2024
- Ruei Chi Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Enclosed cavity structures
- Patent number 11,884,537
- Issue date Jan 30, 2024
- X-CELEPRINT LIMITED
- Ronald S. Cok
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
ENCLOSURE
- Publication number 20240417244
- Publication date Dec 19, 2024
- SCHOTT AG
- Jens Ulrich Thomas
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MEMS DEVICE WITH A CAP LAYER HAVING GAPS AND METHOD OF MANUFACTURIN...
- Publication number 20240409398
- Publication date Dec 12, 2024
- Murata Manufacturing Co., Ltd.
- Konsta HANNULA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
OVER-THE-SINK DRYING ELEMENT
- Publication number 20240406640
- Publication date Dec 5, 2024
- DORAI HOME, INC.
- Jason Klug
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS DEVICE AND METHOD FOR MANUFACTURING MEMS DEVICE
- Publication number 20240400374
- Publication date Dec 5, 2024
- Rohm Co., Ltd.
- Toma FUJITA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR STRUCTURE AND FORMATION THEREOF
- Publication number 20240391761
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Kai-Lan CHANG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Packaging of microelectromechanical system devices
- Publication number 20240391762
- Publication date Nov 28, 2024
- Teknologian Tutkimuskeskus VTT Oy
- Jae-Wung Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
TOP NOTCH SLIT PROFILE FOR MEMS DEVICE
- Publication number 20240381034
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ting-Jung Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS Device and Fabrication Process with Reduced Z-Axis Stiction
- Publication number 20240375937
- Publication date Nov 14, 2024
- NXP USA, Inc.
- Lianjun Liu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
OUTGASSING MATERIAL COATED CAVITY FOR A MICRO-ELECTRO MECHANICAL SY...
- Publication number 20240367964
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Kuei-Sung Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
UNDERCUT-FREE PATTERNED ALUMINUM NITRIDE STRUCTURE AND METHODS FOR...
- Publication number 20240368746
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Yuan-Chih Hsieh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CONDUCTIVE BOND STRUCTURE TO INCREASE MEMBRANE SENSITIVTY IN MEMS D...
- Publication number 20240367965
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Hua Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DOUBLE LAYER MEMS DEVICES AND METHOD OF MANUFACTURE
- Publication number 20240343558
- Publication date Oct 17, 2024
- Murata Manufacturing Co., Ltd.
- Petteri KILPINEN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240336474
- Publication date Oct 10, 2024
- AAC TECHNOLOGIES PTE. LTD
- Houming Chong
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS DEVICE AND MANUFACTURING METHOD OF MEMS DEVICE
- Publication number 20240317580
- Publication date Sep 26, 2024
- Murata Manufacturing Co., Ltd.
- Fumiya KUROKAWA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS DEVICE AND MANUFACTURING METHOD OF MEMS DEVICE
- Publication number 20240317578
- Publication date Sep 26, 2024
- Murata Manufacturing Co., Ltd.
- Fumiya KUROKAWA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PROCESS FLOW FOR THIN CONTACTLESS THERMAL SENSORS
- Publication number 20240272004
- Publication date Aug 15, 2024
- STMicroelectronics International N.V.
- Enri DUQI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR PRODUCING A MICROMECHANICAL DEVICE COMPRISING A CAVITY H...
- Publication number 20240262682
- Publication date Aug 8, 2024
- ROBERT BOSCH GmbH
- Raphael Schuler
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
WIRING BOARD ASSEMBLY, LID ASSEMBLY, PACKAGE SET, AND METHOD FOR MA...
- Publication number 20240253978
- Publication date Aug 1, 2024
- KYOCERA CORPORATION
- Koutarou NAKAMOTO
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS DEVICE HAVING AN IMPROVED CAP AND MANUFACTURING PROCESS THEREOF
- Publication number 20240239648
- Publication date Jul 18, 2024
- STMicroelectronics S.r.l.
- Silvia NICOLI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHODS AND APPARATUS FOR SEMICONDUCTOR PACKAGES WITH WINDOW ASSEMB...
- Publication number 20240228265
- Publication date Jul 11, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Jane Liu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
LASER SEALING METHODS FOR CLOSING VENTHOLES OF MICROMECAHNICAL DEVICES
- Publication number 20240228267
- Publication date Jul 11, 2024
- ROBERT BOSCH GmbH
- Bo CHENG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS SENSOR AND METHOD OF MANUFACTURING MEMS SENSOR
- Publication number 20240208804
- Publication date Jun 27, 2024
- Rohm Co., Ltd.
- Martin Wilfried HELLER
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
EMBEDDED PERMEABLE POLYSILICON LAYER IN MEMS DEVICE FOR MULTIPLE CA...
- Publication number 20240199415
- Publication date Jun 20, 2024
- STMicroelectronics International N.V.
- Federico VERCESI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Systems of Getters for Microelectronics and Methods for Production...
- Publication number 20240174515
- Publication date May 30, 2024
- Mesoline Inc.
- Marnix P. Rebergen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR BONDING A MICROELECTROMECHANICAL DEVICE
- Publication number 20240166499
- Publication date May 23, 2024
- Murata Manufacturing Co., Ltd.
- Mikko PARTANEN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PIEZOELECTRIC MICROELECTROMECHANICAL RESONATOR DEVICE AND CORRESPON...
- Publication number 20240154599
- Publication date May 9, 2024
- STMicroelectronics S.r.l.
- Federico VERCESI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
LASER SEALING METHODS FOR CLOSING VENTHOLES OF MICROMECAHNICAL DEVICES
- Publication number 20240132342
- Publication date Apr 25, 2024
- ROBERT BOSCH GmbH
- Bo CHENG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PROCESS FOR MANUFACTURING A MICRO-ELECTRO-MECHANICAL DEVICE INCLUDI...
- Publication number 20240124299
- Publication date Apr 18, 2024
- STMicroelectronics S.r.l.
- Paolo FERRARI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PACKAGED CAVITY STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240116752
- Publication date Apr 11, 2024
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming CHEN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR SEALING A MEMS DEVICE AND A SEALED MEMS DEVICE
- Publication number 20240116753
- Publication date Apr 11, 2024
- Murata Manufacturing Co., Ltd.
- Antti IIHOLA
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Packaging MEMS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Enclosed cavity structures

Anti-stiction process for MEMS device

Conductive bond structure to increase membrane sensitivity in MEMS...

Undercut-free patterned aluminum nitride structure and methods for...

Reduced light reflection package

Sensor devices with gas-permeable cover and associated production m...

MEMS device having decreased contact resistance

Hermetically sealed MEMS mirror and method of manufacture

Micro-acoustic wafer-level package and method of manufacture

Ingress protection mechanism

Method of manufacturing a sensor device and moulding support structure

Sensing device and method for manufacturing sensing device

Method of manufacturing electronic devices and corresponding electr...

Hermetically sealed, toughened glass package and method for produci...

MEMS resonator system

Enclosed cavity structures

Hermetically sealed transparent cavity and package for same

Method for producing a microelectromechanical sensor and microelect...

Hollow package and method for manufacturing same

Integrated digital force sensors and related methods of manufacture

Systems and methods for providing getters in microelectromechanical...

Electronic device and corresponding method

MEMS device, manufacturing method of the same, and integrated MEMS...

Microelectromechanical structure including a functional element sit...

MEMS device having a metallization structure embedded in a dielectr...

Packaging of microfluidic devices and microfluidic integrated syste...

Methods including panel bonding acts and electronic devices includi...

Enclosed cavity structures

Sensing module and manufacturing method thereof

Enclosed cavity structures

Patents Applicationslast 30 patents

ENCLOSURE

MEMS DEVICE WITH A CAP LAYER HAVING GAPS AND METHOD OF MANUFACTURIN...

OVER-THE-SINK DRYING ELEMENT

MEMS DEVICE AND METHOD FOR MANUFACTURING MEMS DEVICE

SEMICONDUCTOR STRUCTURE AND FORMATION THEREOF

Packaging of microelectromechanical system devices

TOP NOTCH SLIT PROFILE FOR MEMS DEVICE

MEMS Device and Fabrication Process with Reduced Z-Axis Stiction

OUTGASSING MATERIAL COATED CAVITY FOR A MICRO-ELECTRO MECHANICAL SY...

UNDERCUT-FREE PATTERNED ALUMINUM NITRIDE STRUCTURE AND METHODS FOR...

CONDUCTIVE BOND STRUCTURE TO INCREASE MEMBRANE SENSITIVTY IN MEMS D...

DOUBLE LAYER MEMS DEVICES AND METHOD OF MANUFACTURE

MEMS DEVICE AND MANUFACTURING METHOD THEREOF

MEMS DEVICE AND MANUFACTURING METHOD OF MEMS DEVICE

MEMS DEVICE AND MANUFACTURING METHOD OF MEMS DEVICE

PROCESS FLOW FOR THIN CONTACTLESS THERMAL SENSORS

METHOD FOR PRODUCING A MICROMECHANICAL DEVICE COMPRISING A CAVITY H...

WIRING BOARD ASSEMBLY, LID ASSEMBLY, PACKAGE SET, AND METHOD FOR MA...

MEMS DEVICE HAVING AN IMPROVED CAP AND MANUFACTURING PROCESS THEREOF

METHODS AND APPARATUS FOR SEMICONDUCTOR PACKAGES WITH WINDOW ASSEMB...

LASER SEALING METHODS FOR CLOSING VENTHOLES OF MICROMECAHNICAL DEVICES

MEMS SENSOR AND METHOD OF MANUFACTURING MEMS SENSOR

EMBEDDED PERMEABLE POLYSILICON LAYER IN MEMS DEVICE FOR MULTIPLE CA...

Systems of Getters for Microelectronics and Methods for Production...

METHOD FOR BONDING A MICROELECTROMECHANICAL DEVICE

PIEZOELECTRIC MICROELECTROMECHANICAL RESONATOR DEVICE AND CORRESPON...

LASER SEALING METHODS FOR CLOSING VENTHOLES OF MICROMECAHNICAL DEVICES

PROCESS FOR MANUFACTURING A MICRO-ELECTRO-MECHANICAL DEVICE INCLUDI...

PACKAGED CAVITY STRUCTURE AND MANUFACTURING METHOD THEREOF

METHOD FOR SEALING A MEMS DEVICE AND A SEALED MEMS DEVICE