PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICRO-STRUCTURAL DEVICES OR SYSTEMS

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package and method for manufacturing the same
- Patent number 11,973,048
- Issue date Apr 30, 2024
- Advanced Semiconductor Engineering, Inc.
- An-Nong Wen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Package structure and method for manufacturing the same
- Patent number 11,970,388
- Issue date Apr 30, 2024
- Winbond Electronics Corp.
- Jin-Neng Wu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for producing microchannel device
- Patent number 11,970,390
- Issue date Apr 30, 2024
- Canon Kabushiki Kaisha
- Takeshi Yamamoto
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Self-packing three-arm thermal scanning probe for micro-nano manufa...
- Patent number 11,970,392
- Issue date Apr 30, 2024
- Zhejiang University
- Huan Hu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Plate
- Patent number 11,970,681
- Issue date Apr 30, 2024
- Ushio Denki Kabushiki Kaisha
- Daisuke Nomoto
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Micro-electro mechanical system device containing a bump stopper an...
- Patent number 11,970,387
- Issue date Apr 30, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Chun-wen Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Flexible electrode and preparation method thereof
- Patent number 11,970,391
- Issue date Apr 30, 2024
- SHENZHEN INSTITUTES OF ADVANCED TECHNOLOGY
- Tianzhun Wu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Sealed force sensor with etch stop layer
- Patent number 11,965,787
- Issue date Apr 23, 2024
- NEXTINPUT, INC.
- Julius Minglin Tsai
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS device having uniform contacts
- Patent number 11,964,866
- Issue date Apr 23, 2024
- Qorvo US, Inc.
- Mickael Renault
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Bipolar transistor type MEMS pressure sensor and preparation method...
- Patent number 11,965,797
- Issue date Apr 23, 2024
- Wuxi Sencoch Semiconductor Co., Ltd.
- Tongqing Liu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method and apparatus for controlling stress variation in a material...
- Patent number 11,961,722
- Issue date Apr 16, 2024
- SPTS Technologies Limited
- Anthony Wilby
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for ablating or roughening wafer surfaces
- Patent number 11,958,739
- Issue date Apr 16, 2024
- University of Rhode Island Board of Trustees
- Jason Rodger Dwyer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for producing a microelectromechanical sensor and microelect...
- Patent number 11,958,740
- Issue date Apr 16, 2024
- Robert Bosch GmbH
- Achim Kronenberger
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microelectromechanical system (MEMS) structure and method of formation
- Patent number 11,953,674
- Issue date Apr 9, 2024
- Texas Instruments Incorporated
- Jose A. Martinez
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Modification to rough polysilicon using ion implantation and silicide
- Patent number 11,952,267
- Issue date Apr 9, 2024
- Invensense, Inc.
- Alan Cuthbertson
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Engineered substrates, free-standing semiconductor microstructures,...
- Patent number 11,952,268
- Issue date Apr 9, 2024
- Lawrence Semiconductor Research Laboratory, Inc.
- Chantal Arena
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Optical device production method
- Patent number 11,953,675
- Issue date Apr 9, 2024
- Hamamatsu Photonics K.K.
- Tatsuya Sugimoto
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Electronic device
- Patent number 11,952,264
- Issue date Apr 9, 2024
- Merry Electronics (Shenzhen) Co., Ltd.
- Jia Yin Wu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Hollow package and method for manufacturing same
- Patent number 11,955,394
- Issue date Apr 9, 2024
- Nippon Kayaku Kabushiki Kaisha
- Tadashi Naito
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Packaging structure and method of MEMS pressure sensor
- Patent number 11,953,392
- Issue date Apr 9, 2024
- Wuxi Sencoch Semiconductor Co., Ltd.
- Tongqing Liu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Micro-device structures with etch holes
- Patent number 11,952,266
- Issue date Apr 9, 2024
- X-CELEPRINT LIMITED
- Pierluigi Rubino
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microfluidic device
- Patent number 11,944,965
- Issue date Apr 2, 2024
- Imec VZW
- Giuseppe Fiorentino
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Integrated digital force sensors and related methods of manufacture
- Patent number 11,946,817
- Issue date Apr 2, 2024
- DecaWave, Ltd.
- Ali Foughi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor transducer device with multilayer diaphragm and metho...
- Patent number 11,946,822
- Issue date Apr 2, 2024
- Sciosense B.V.
- Alessandro Faes
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Capacitive micromachined ultrasonic transducer and method of fabric...
- Patent number 11,944,998
- Issue date Apr 2, 2024
- Korea Institute of Science and Technology
- Byung Chul Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Process for manufacturing a micro-electro-mechanical device, and ME...
- Patent number 11,945,712
- Issue date Apr 2, 2024
- STMicroelectronics S.r.l.
- Giorgio Allegato
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Bonded structures
- Patent number 11,948,847
- Issue date Apr 2, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Rajesh Katkar
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Systems and methods for providing getters in microelectromechanical...
- Patent number 11,945,713
- Issue date Apr 2, 2024
- Invensense, Inc.
- Daesung Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Electronic device and corresponding method
- Patent number 11,945,714
- Issue date Apr 2, 2024
- STMicroelectronics S.r.l.
- Alex Gritti
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Implantable microneedle and manufacturing method therefor
- Patent number 11,938,308
- Issue date Mar 26, 2024
- SNVIA CO., LTD.
- Seung Yun Yang
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF ATTACHING FILM
- Publication number 20240140785
- Publication date May 2, 2024
- Advanced Semiconductor Engineering, Inc.
- Chin-Song LEE
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROMECHANICAL SENSOR WITH INTEGRATED STRESS SENSOR AND METHOD FOR...
- Publication number 20240142490
- Publication date May 2, 2024
- ROBERT BOSCH GmbH
- Johannes Classen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME
- Publication number 20240140782
- Publication date May 2, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- PO CHEN YEH
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR MANUFACTURING A DEVICE COMPRISING TWO SEMICONDUCTOR DICE...
- Publication number 20240140783
- Publication date May 2, 2024
- STMicroelectronics S.r.l.
- Mark Andrew SHAW
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Inattentive HF Concentration Vapors Phase Release of Micro-electro-...
- Publication number 20240140786
- Publication date May 2, 2024
- UNM Rainforest Innovations
- Tito Busani
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR ENCLOSING REFERENCE GASES IN MEMS CELLS
- Publication number 20240133802
- Publication date Apr 25, 2024
- HAHN-SCHICKARD-GESELLSCHAFT FUR ANGEWANDTE FORSCHUNG E.V.
- Achim BITTNER
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
LASER SEALING METHODS FOR CLOSING VENTHOLES OF MICROMECAHNICAL DEVICES
- Publication number 20240132342
- Publication date Apr 25, 2024
- ROBERT BOSCH GmbH
- Bo CHENG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CAPACITIVE MICROPHONE SENSOR DESIGN AND FABRICATION METHOD FOR ACHI...
- Publication number 20240137711
- Publication date Apr 25, 2024
- Innogrity Pte Ltd
- KATHIRGAMASUNDARAM SOORIAKUMAR
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DECOUPLING METHOD FOR SEMICONDUCTOR DEVICE
- Publication number 20240132340
- Publication date Apr 25, 2024
- STMicroelectronics (Malta) Ltd.
- Roseanne DUCA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Semiconductor Devices and Methods of Manufacture
- Publication number 20240124298
- Publication date Apr 18, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yun-Chung Wu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PROCESS FOR MANUFACTURING A MICRO-ELECTRO-MECHANICAL DEVICE INCLUDI...
- Publication number 20240124299
- Publication date Apr 18, 2024
- STMicroelectronics S.r.l.
- Paolo FERRARI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CAPLESS SEMICONDUCTOR PACKAGE WITH A MICRO-ELECTROMECHANICAL SYSTEM...
- Publication number 20240124300
- Publication date Apr 18, 2024
- STMICROELECTRONICS, INC.
- Jefferson Sismundo TALLEDO
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
FUSED QUARTZ DUAL SHELL RESONATOR AND METHOD OF FABRICATION
- Publication number 20240125599
- Publication date Apr 18, 2024
- The Regents of the University of California
- Andrei M. SHKEL
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CARTRIDGE INTERFERENCE
- Publication number 20240124297
- Publication date Apr 18, 2024
- VueReal Inc.
- Gholamreza CHAJI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR PROCESSING GLASS BY ALKALINE ETCHING
- Publication number 20240116805
- Publication date Apr 11, 2024
- SCHOTT AG
- Andreas Ortner
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
BONDED STRUCTURES
- Publication number 20240120245
- Publication date Apr 11, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Rajesh Katkar
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROCHIPS FOR USE IN ELECTRON MICROSCOPES AND RELATED METHODS
- Publication number 20240120172
- Publication date Apr 11, 2024
- Northwestern University
- Vinayak P. Dravid
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PACKAGED CAVITY STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240116752
- Publication date Apr 11, 2024
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming CHEN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR SEALING A MEMS DEVICE AND A SEALED MEMS DEVICE
- Publication number 20240116753
- Publication date Apr 11, 2024
- Murata Manufacturing Co., Ltd.
- Antti IIHOLA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD OF FABRICATING MICRO-ELECTROMECHANICAL SYSTEM DEVICE
- Publication number 20240116749
- Publication date Apr 11, 2024
- Vanguard International Semiconductor Corporation
- Jia Jie Xia
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240116751
- Publication date Apr 11, 2024
- XINTEC INC.
- Chia-Ming CHENG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SENSOR DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240109768
- Publication date Apr 4, 2024
- Advanced Semiconductor Engineering, Inc.
- Chieh-An YEH
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240109769
- Publication date Apr 4, 2024
- XINTEC INC.
- Wei-Luen SUEN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Spring Supported and Sealed MEMS Diaphragm Assembly
- Publication number 20240109770
- Publication date Apr 4, 2024
- KNOWLES ELECTRONICS, LLC
- Peter V. Loeppert
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHODS FOR SEALING CAVITIES IN MICRO-FABRICATED DEVICES AND MICRO-...
- Publication number 20240109771
- Publication date Apr 4, 2024
- The University of British Columbia
- Kenichi TAKAHATA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
IMPLANTABLE MICRONEEDLE AND MANUFACTURING METHOD THEREFOR
- Publication number 20240108817
- Publication date Apr 4, 2024
- SNVIA CO., LTD.
- Seung Yun YANG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICRO-ELECTRO-MECHANICAL SYSTEMS MICROMIRRORS AND MICROMIRROR ARRAYS
- Publication number 20240111148
- Publication date Apr 4, 2024
- Preciseley Microtechnology Corp.
- Tiansheng ZHOU
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
NEURAL LATTICE DEVICE FOR CHARACTERIZATION OF NEURON BEHAVIOR
- Publication number 20240101943
- Publication date Mar 28, 2024
- International Business Machines Corporation
- Sagarika Mukesh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SELF-ALIGNED AIR GAP FORMATION IN MICROELECTRONICS PACKAGES
- Publication number 20240101413
- Publication date Mar 28, 2024
- Intel Corporation
- Jeremy D. Ecton
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Microfluidic Products with Controlled Fluid Flow
- Publication number 20240100519
- Publication date Mar 28, 2024
- Brian David BABCOCK
- B81 - MICRO-STRUCTURAL TECHNOLOGY

PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICRO-STRUCTURAL DEVICES OR SYSTEMS

Industry

Parent Industries

Current Industry

Sub Industries

Patents Grantslast 30 patents

Semiconductor package and method for manufacturing the same

Package structure and method for manufacturing the same

Method for producing microchannel device

Self-packing three-arm thermal scanning probe for micro-nano manufa...

Plate

Micro-electro mechanical system device containing a bump stopper an...

Flexible electrode and preparation method thereof

Sealed force sensor with etch stop layer

MEMS device having uniform contacts

Bipolar transistor type MEMS pressure sensor and preparation method...

Method and apparatus for controlling stress variation in a material...

Method for ablating or roughening wafer surfaces

Method for producing a microelectromechanical sensor and microelect...

Microelectromechanical system (MEMS) structure and method of formation

Modification to rough polysilicon using ion implantation and silicide

Engineered substrates, free-standing semiconductor microstructures,...

Optical device production method

Electronic device

Hollow package and method for manufacturing same

Packaging structure and method of MEMS pressure sensor

Micro-device structures with etch holes

Microfluidic device

Integrated digital force sensors and related methods of manufacture

Semiconductor transducer device with multilayer diaphragm and metho...

Capacitive micromachined ultrasonic transducer and method of fabric...

Process for manufacturing a micro-electro-mechanical device, and ME...

Bonded structures

Systems and methods for providing getters in microelectromechanical...

Electronic device and corresponding method

Implantable microneedle and manufacturing method therefor

Patents Applicationslast 30 patents

METHOD OF ATTACHING FILM

MICROMECHANICAL SENSOR WITH INTEGRATED STRESS SENSOR AND METHOD FOR...

SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME

METHOD FOR MANUFACTURING A DEVICE COMPRISING TWO SEMICONDUCTOR DICE...

Inattentive HF Concentration Vapors Phase Release of Micro-electro-...

METHOD FOR ENCLOSING REFERENCE GASES IN MEMS CELLS

LASER SEALING METHODS FOR CLOSING VENTHOLES OF MICROMECAHNICAL DEVICES

CAPACITIVE MICROPHONE SENSOR DESIGN AND FABRICATION METHOD FOR ACHI...

DECOUPLING METHOD FOR SEMICONDUCTOR DEVICE

Semiconductor Devices and Methods of Manufacture

PROCESS FOR MANUFACTURING A MICRO-ELECTRO-MECHANICAL DEVICE INCLUDI...

CAPLESS SEMICONDUCTOR PACKAGE WITH A MICRO-ELECTROMECHANICAL SYSTEM...

FUSED QUARTZ DUAL SHELL RESONATOR AND METHOD OF FABRICATION

CARTRIDGE INTERFERENCE

METHOD FOR PROCESSING GLASS BY ALKALINE ETCHING

BONDED STRUCTURES

MICROCHIPS FOR USE IN ELECTRON MICROSCOPES AND RELATED METHODS

PACKAGED CAVITY STRUCTURE AND MANUFACTURING METHOD THEREOF

METHOD FOR SEALING A MEMS DEVICE AND A SEALED MEMS DEVICE

METHOD OF FABRICATING MICRO-ELECTROMECHANICAL SYSTEM DEVICE

CHIP PACKAGE AND MANUFACTURING METHOD THEREOF

SENSOR DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME

CHIP PACKAGE AND MANUFACTURING METHOD THEREOF

Spring Supported and Sealed MEMS Diaphragm Assembly

METHODS FOR SEALING CAVITIES IN MICRO-FABRICATED DEVICES AND MICRO-...

IMPLANTABLE MICRONEEDLE AND MANUFACTURING METHOD THEREFOR

MICRO-ELECTRO-MECHANICAL SYSTEMS MICROMIRRORS AND MICROMIRROR ARRAYS

NEURAL LATTICE DEVICE FOR CHARACTERIZATION OF NEURON BEHAVIOR

SELF-ALIGNED AIR GAP FORMATION IN MICROELECTRONICS PACKAGES

Microfluidic Products with Controlled Fluid Flow