Profile of the lift-off mask

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H01L2224/11472

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/11472Profile of the lift-off mask

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Solderless interconnection structure and method of forming same
- Patent number 11,961,810
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company
- Yu-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for preparing indium pillar solder, chip substrate and chip
- Patent number 11,869,861
- Issue date Jan 9, 2024
- TENCENT TECHNOLOGY (SHENZHEN) COMPANY LIMITED
- Wenlong Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Industrial chip scale package for microelectronic device
- Patent number 11,749,616
- Issue date Sep 5, 2023
- Texas Instruments Incorporated
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conical-shaped or tier-shaped pillar connections
- Patent number 11,315,896
- Issue date Apr 26, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tin-Hao Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic circuit connection method and electronic circuit
- Patent number 11,270,968
- Issue date Mar 8, 2022
- National Institute of Advanced Industrial Science and Technology
- Masaru Hashino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solderless interconnection structure and method of forming same
- Patent number 11,043,462
- Issue date Jun 22, 2021
- Taiwan Semiconductor Manufacturing Company
- Yu-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate device, electronic apparatus, and method for manufacturin...
- Patent number 10,892,241
- Issue date Jan 12, 2021
- Sony Corporation
- Shigekazu Ishii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Collars for under-bump metal structures and associated systems and...
- Patent number 10,886,244
- Issue date Jan 5, 2021
- Micron Technology, Inc.
- Giorgio Mariottini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor structure
- Patent number 10,861,711
- Issue date Dec 8, 2020
- NANYA TECHNOLOGY CORPORATION
- Hsih-Yang Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device
- Patent number 10,790,250
- Issue date Sep 29, 2020
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Daisuke Sakurai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded semiconductor package and related methods
- Patent number 10,748,864
- Issue date Aug 18, 2020
- Semiconductor Components Industries, LLC
- Thomas Fairfax Long
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple sized bump bonds
- Patent number 10,727,192
- Issue date Jul 28, 2020
- International Business Machines Corporation
- David W. Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure with protrusion structure
- Patent number 10,692,828
- Issue date Jun 23, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Pei-Haw Tsao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal cored solder decal structure and process
- Patent number 10,658,267
- Issue date May 19, 2020
- International Business Machines Corporation
- Peter A. Gruber
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Expanded head pillar for bump bonds
- Patent number 10,636,758
- Issue date Apr 28, 2020
- Texas Instruments Incorporated
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Injection molded solder bumping
- Patent number 10,615,143
- Issue date Apr 7, 2020
- International Business Machines Corporation
- Toyohiro Aoki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Combing bump structure and manufacturing method thereof
- Patent number 10,446,514
- Issue date Oct 15, 2019
- NANYA TECHNOLOGY CORPORATION
- Po-Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solderless interconnection structure and method of forming same
- Patent number 10,319,691
- Issue date Jun 11, 2019
- Taiwan Semiconductor Manufacturing Company
- Yu-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure and semiconductor structures for assembly of...
- Patent number 10,242,968
- Issue date Mar 26, 2019
- Massachusetts Institute of Technology
- Rabindra N. Das
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Robust pillar structure for semicondcutor device contacts
- Patent number 10,236,268
- Issue date Mar 19, 2019
- Amkor Technology, Inc.
- Karthikeyan Dhandapani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices, methods of manufacture thereof, and packaged...
- Patent number 10,153,243
- Issue date Dec 11, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Jen Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive pillar structure
- Patent number 10,128,206
- Issue date Nov 13, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid-state imaging device
- Patent number 10,115,695
- Issue date Oct 30, 2018
- TOHOKU-MICROTEC CO., LTD
- Makoto Motoyoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of electroplating photoresist defined features from copper e...
- Patent number 10,104,782
- Issue date Oct 16, 2018
- Dow Global Technologies LLC
- Matthew Thorseth
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Combing bump structure and manufacturing method thereof
- Patent number 10,068,865
- Issue date Sep 4, 2018
- NANYA TECHNOLOGY CORPORATION
- Po-Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conical-shaped or tier-shaped pillar connections
- Patent number 10,056,345
- Issue date Aug 21, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tin-Hao Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor package structure
- Patent number 10,037,973
- Issue date Jul 31, 2018
- Taiwan Semiconductor Manufacturing Company Ltd.
- Hua-Wei Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures having a tapering curved profile and methods of making same
- Patent number 10,008,459
- Issue date Jun 26, 2018
- Taiwan Semiconductor Manufacturing Company
- Pei-Chun Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder stud structure
- Patent number 9,997,482
- Issue date Jun 12, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Li-Guo Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal cored solder decal structure and process
- Patent number 9,972,556
- Issue date May 15, 2018
- International Business Machines Corporation
- Peter A. Gruber
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240321797
- Publication date Sep 26, 2024
- Kabushiki Kaisha Toshiba
- Yoshiaki SHIMOOKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INDUSTRIAL CHIP SCALE PACKAGE FOR MICROELECTRONIC DEVICE
- Publication number 20240162163
- Publication date May 16, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND FORMING METHOD THEREOF
- Publication number 20220328443
- Publication date Oct 13, 2022
- CHIPMORE TECHNOLOGY CORPORATION LIMITED
- HAO CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Forming Semiconductor Package and Semiconductor Package
- Publication number 20220173063
- Publication date Jun 2, 2022
- Yibu Semiconductor Co., Ltd.
- Weiping LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PREPARING INDIUM PILLAR SOLDER, CHIP SUBSTRATE AND CHIP
- Publication number 20220130784
- Publication date Apr 28, 2022
- TENCENT TECHNOLOGY (SHENZHEN) COMPANY LIMITED
- Wenlong ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Solderless Interconnection Structure and Method of Forming Same
- Publication number 20210313287
- Publication date Oct 7, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC CIRCUIT CONNECTION METHOD AND ELECTRONIC CIRCUIT
- Publication number 20210249374
- Publication date Aug 12, 2021
- NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY
- Masaru HASHINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COLLARS FOR UNDER-BUMP METAL STRUCTURES AND ASSOCIATED SYSTEMS AND...
- Publication number 20210151400
- Publication date May 20, 2021
- Micron Technology, Inc.
- Giorgio Mariottini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED SEMICONDUCTOR PACKAGE AND RELATED METHODS
- Publication number 20200350271
- Publication date Nov 5, 2020
- Semiconductor Components Industries, LLC
- Thomas Fairfax LONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EXPANDED HEAD PILLAR FOR BUMP BONDS
- Publication number 20200258856
- Publication date Aug 13, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Sreenivasan K. KODURI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Solderless Interconnection Structure and Method of Forming Same
- Publication number 20190295971
- Publication date Sep 26, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Conical-Shaped or Tier-Shaped Pillar Connections
- Publication number 20180358316
- Publication date Dec 13, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tin-Hao Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMBING BUMP STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20180337154
- Publication date Nov 22, 2018
- NANYA TECHNOLOGY CORPORATION
- Po-Chun LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID-STATE IMAGING DEVICE
- Publication number 20180315727
- Publication date Nov 1, 2018
- TOHOKU-MICROTEC CO., LTD.
- Makoto MOTOYOSHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL CORED SOLDER DECAL STRUCTURE AND PROCESS
- Publication number 20180174949
- Publication date Jun 21, 2018
- International Business Machines Corporation
- Peter A. Gruber
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF ELECTROPLATING PHOTORESIST DEFINED FEATURES FROM COPPER E...
- Publication number 20170042037
- Publication date Feb 9, 2017
- Rohm and Haas Electronic Materials L.L.C.
- Matthew Thorseth
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD OF ELECTROPLATING PHOTORESIST DEFINED FEATURES FROM COPPER E...
- Publication number 20170037527
- Publication date Feb 9, 2017
- Rohm and Haas Electronic Materials L.L.C.
- Matthew Thorseth
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20150061122
- Publication date Mar 5, 2015
- Toyota Jidosha Kabushiki Kaisha
- Takashi USHIJIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Pillar Bumps and Process for Making Same
- Publication number 20140363966
- Publication date Dec 11, 2014
- Cheng-Chung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20140361431
- Publication date Dec 11, 2014
- SONY CORPORATION
- Katsuji Matsumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING SEMICONDUCTOR DEVICE HAVING BUMP
- Publication number 20140329382
- Publication date Nov 6, 2014
- Samsung Electronics Co., Ltd.
- SON-KWAN HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME
- Publication number 20140312498
- Publication date Oct 23, 2014
- RENESAS ELECTRONICS CORPORATION
- Michiaki Sugiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electrical Connectors and Methods for Forming the Same
- Publication number 20140256126
- Publication date Sep 11, 2014
- Chun-Chieh Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device with Conductive Pillars Having Recesses or Pro...
- Publication number 20140225256
- Publication date Aug 14, 2014
- STATS ChipPAC, Ltd.
- Jen Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20140217580
- Publication date Aug 7, 2014
- Samsung Electronics Co., Ltd.
- Jong Yun MYUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP PACKAGE AND METHOD FOR MANUFACTURING THEREOF
- Publication number 20140203387
- Publication date Jul 24, 2014
- XINTEC INC.
- Wei-Luen SUEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT SOLDER BUMPS FOR DIE TESTING
- Publication number 20140167808
- Publication date Jun 19, 2014
- International Business Machines Corporation
- Gerald K. Bartley
- G01 - MEASURING TESTING
Information Patent Application
Semiconductor Devices, Methods of Manufacture Thereof, and Packaged...
- Publication number 20140167253
- Publication date Jun 19, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Jen Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT, ELECTRONIC APPARATUS INCLUDING THE SAME, AND...
- Publication number 20140159235
- Publication date Jun 12, 2014
- Fujitsu Limited
- Muneyuki Odaira
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20140145327
- Publication date May 29, 2014
- Samsung Electronics Co., Ltd.
- Hyung-Jun JEON
- H01 - BASIC ELECTRIC ELEMENTS

Profile of the lift-off mask

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Solderless interconnection structure and method of forming same

Method for preparing indium pillar solder, chip substrate and chip

Industrial chip scale package for microelectronic device

Conical-shaped or tier-shaped pillar connections

Electronic circuit connection method and electronic circuit

Solderless interconnection structure and method of forming same

Substrate device, electronic apparatus, and method for manufacturin...

Collars for under-bump metal structures and associated systems and...

Method of manufacturing a semiconductor structure

Method for manufacturing semiconductor device

Bonded semiconductor package and related methods

Multiple sized bump bonds

Package structure with protrusion structure

Metal cored solder decal structure and process

Expanded head pillar for bump bonds

Injection molded solder bumping

Combing bump structure and manufacturing method thereof

Solderless interconnection structure and method of forming same

Interconnect structure and semiconductor structures for assembly of...

Robust pillar structure for semicondcutor device contacts

Semiconductor devices, methods of manufacture thereof, and packaged...

Conductive pillar structure

Solid-state imaging device

Method of electroplating photoresist defined features from copper e...

Combing bump structure and manufacturing method thereof

Conical-shaped or tier-shaped pillar connections

Method for manufacturing semiconductor package structure

Structures having a tapering curved profile and methods of making same

Solder stud structure

Metal cored solder decal structure and process

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

INDUSTRIAL CHIP SCALE PACKAGE FOR MICROELECTRONIC DEVICE

PACKAGE STRUCTURE AND FORMING METHOD THEREOF

Method for Forming Semiconductor Package and Semiconductor Package

METHOD FOR PREPARING INDIUM PILLAR SOLDER, CHIP SUBSTRATE AND CHIP

Solderless Interconnection Structure and Method of Forming Same

ELECTRONIC CIRCUIT CONNECTION METHOD AND ELECTRONIC CIRCUIT

COLLARS FOR UNDER-BUMP METAL STRUCTURES AND ASSOCIATED SYSTEMS AND...

BONDED SEMICONDUCTOR PACKAGE AND RELATED METHODS

EXPANDED HEAD PILLAR FOR BUMP BONDS

Solderless Interconnection Structure and Method of Forming Same

Conical-Shaped or Tier-Shaped Pillar Connections

COMBING BUMP STRUCTURE AND MANUFACTURING METHOD THEREOF

SOLID-STATE IMAGING DEVICE

METAL CORED SOLDER DECAL STRUCTURE AND PROCESS

METHOD OF ELECTROPLATING PHOTORESIST DEFINED FEATURES FROM COPPER E...

METHOD OF ELECTROPLATING PHOTORESIST DEFINED FEATURES FROM COPPER E...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

Pillar Bumps and Process for Making Same

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

METHOD OF FABRICATING SEMICONDUCTOR DEVICE HAVING BUMP

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME

Electrical Connectors and Methods for Forming the Same

Semiconductor Device with Conductive Pillars Having Recesses or Pro...

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR CHIP PACKAGE AND METHOD FOR MANUFACTURING THEREOF

INTERCONNECT SOLDER BUMPS FOR DIE TESTING

Semiconductor Devices, Methods of Manufacture Thereof, and Packaged...

ELECTRONIC COMPONENT, ELECTRONIC APPARATUS INCLUDING THE SAME, AND...

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME