Reshaping the bonding area in the bonding apparatus

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H01L2224/8003

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/8003Reshaping the bonding area in the bonding apparatus

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Member for solid-state image pickup device and method for manufactu...
- Patent number 12,142,629
- Issue date Nov 12, 2024
- Canon Kabushiki Kaisha
- Nobuyuki Endo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assembly from processed substrate
- Patent number 12,051,621
- Issue date Jul 30, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Dimension compensation control for directly bonded structures
- Patent number 12,009,338
- Issue date Jun 11, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Guilian Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic circuit for a hybrid molecular bonding
- Patent number 11,990,436
- Issue date May 21, 2024
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Emilie Bourjot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package structure, electronic substrate and method of ma...
- Patent number 11,978,706
- Issue date May 7, 2024
- Advanced Semiconductor Engineering, Inc.
- Shun-Tsat Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-dielectric bonding method and structure
- Patent number 11,978,719
- Issue date May 7, 2024
- Yangtze Memory Technologies Co., Ltd.
- Siping Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond enhancement structure in microelectronics for trapping contami...
- Patent number 11,967,575
- Issue date Apr 23, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Guilian Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low temperature hybrid bonding
- Patent number 11,911,839
- Issue date Feb 27, 2024
- Advanced Micro Devices, Inc.
- Priyal Shah
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Member for solid-state image pickup device and method for manufactu...
- Patent number 11,843,023
- Issue date Dec 12, 2023
- Canon Kabushiki Kaisha
- Nobuyuki Endo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive barrier direct hybrid bonding
- Patent number 11,830,838
- Issue date Nov 28, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-dielectric bonding method and structure
- Patent number 11,798,913
- Issue date Oct 24, 2023
- Yangtze Memory Technologies Co., Ltd.
- Siping Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and structures for improved electrical contact between bond...
- Patent number 11,784,123
- Issue date Oct 10, 2023
- Intel Corporation
- Richard Vreeland
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reliable hybrid bonded apparatus
- Patent number 11,742,314
- Issue date Aug 29, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die processing
- Patent number 11,742,315
- Issue date Aug 29, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device and semiconductor device
- Patent number 11,721,664
- Issue date Aug 8, 2023
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Eiichiro Kanda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded semiconductor die assembly with metal alloy bonding pads and...
- Patent number 11,646,282
- Issue date May 9, 2023
- SanDisk Technologies LLC
- Lin Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor device
- Patent number 11,600,598
- Issue date Mar 7, 2023
- SK hynix Inc.
- Jin Ha Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, fabrication method for a semiconductor device...
- Patent number 11,569,123
- Issue date Jan 31, 2023
- Sony Corporation
- Yoshihisa Kagawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chemical mechanical polishing for hybrid bonding
- Patent number 11,552,041
- Issue date Jan 10, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Gaius Gillman Fountain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Member for solid-state image pickup device and method for manufactu...
- Patent number 11,545,519
- Issue date Jan 3, 2023
- Canon Kabushiki Kaisha
- Nobuyuki Endo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-dielectric bonding method and structure
- Patent number 11,495,569
- Issue date Nov 8, 2022
- Yangtze Memory Technologies Co., Ltd.
- Siping Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Edge-trimming methods for wafer bonding and dicing
- Patent number 11,482,506
- Issue date Oct 25, 2022
- Taiwan Semiconductor Manufacturing Company Limited
- Feng-Chien Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded assembly containing oxidation barriers, hybrid bonding, or a...
- Patent number 11,393,780
- Issue date Jul 19, 2022
- SanDisk Technologies LLC
- Ramy Nashed Bassely Said
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assembly from processed substrate
- Patent number 11,367,652
- Issue date Jun 21, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Cyprian Emeka Uzoh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of assembly by direct bonding between two elements, each ele...
- Patent number 11,305,372
- Issue date Apr 19, 2022
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Lea Di Cioccio
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bond enhancement structure in microelectronics for trapping contami...
- Patent number 11,296,044
- Issue date Apr 5, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Guilian Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and structures for improved electrical contact between bond...
- Patent number 11,289,421
- Issue date Mar 29, 2022
- Intel Corporation
- Richard Vreeland
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive barrier direct hybrid bonding
- Patent number 11,264,345
- Issue date Mar 1, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device and semiconductor device
- Patent number 11,257,782
- Issue date Feb 22, 2022
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Eiichiro Kanda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for bonding and connecting substrates
- Patent number 11,107,855
- Issue date Aug 31, 2021
- Sony Corporation
- Nobutoshi Fujii
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CHEMICAL MECHANICAL POLISHING FOR HYBRID BONDING
- Publication number 20240379607
- Publication date Nov 14, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Gaius Gillman Fountain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIMENSION COMPENSATION CONTROL FOR DIRECTLY BONDED STRUCTURES
- Publication number 20240312953
- Publication date Sep 19, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Guilian Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE BARRIER DIRECT HYBRID BONDING
- Publication number 20240243085
- Publication date Jul 18, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR BONDING SEMICONDUCTOR DEVICES
- Publication number 20240178180
- Publication date May 30, 2024
- TOKYO ELECTRON LIMITED
- Sitaram ARKALGUD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BONDING OF A THIN SEMICONDUCTOR DIE
- Publication number 20240170442
- Publication date May 23, 2024
- ASMPT Singapore Pte. Ltd.
- Yiu Ming CHEUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD, SEMICONDUCTOR DEVICE, IN...
- Publication number 20240170447
- Publication date May 23, 2024
- Tomoaki SHIBATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED STRUCTURE AND METHOD OF FORMING SAME
- Publication number 20240105674
- Publication date Mar 28, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMBER FOR SOLID-STATE IMAGE PICKUP DEVICE AND METHOD FOR MANUFACTU...
- Publication number 20240088196
- Publication date Mar 14, 2024
- Canon Kabushiki Kaisha
- Nobuyuki Endo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RELIABLE HYBRID BONDED APPARATUS
- Publication number 20240021573
- Publication date Jan 18, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE PROCESSING
- Publication number 20240021572
- Publication date Jan 18, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE TRENCH FOR IMPROVED HYBRID BONDING
- Publication number 20240006358
- Publication date Jan 4, 2024
- Intel Corporation
- Zhihua Zou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR STRUCTURE
- Publication number 20230402426
- Publication date Dec 14, 2023
- Powerchip Semiconductor Manufacturing Corporation
- Shih-Ping Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20230317654
- Publication date Oct 5, 2023
- Samsung Electronics Co., Ltd.
- Jihoon KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHEMICAL MECHANICAL POLISHING FOR HYBRID BONDING
- Publication number 20230268308
- Publication date Aug 24, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Gaius Gillman Fountain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER BONDING DEVICE AND WAFER BONDING METHOD
- Publication number 20230223377
- Publication date Jul 13, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC
- CHIH-WEI CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20230207529
- Publication date Jun 29, 2023
- SK HYNIX INC.
- Jin Ha KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND ENHANCEMENT FOR DIRECT-BONDING PROCESSES
- Publication number 20230187398
- Publication date Jun 15, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Guilian GAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT BONDING METHODS AND STRUCTURES
- Publication number 20230140107
- Publication date May 4, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Etching of Metal
- Publication number 20230108117
- Publication date Apr 6, 2023
- TOKYO ELECTRON LIMITED
- Sergey Voronin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
BONDING METHOD
- Publication number 20230100455
- Publication date Mar 30, 2023
- SEMES CO., LTD.
- Hang Lim LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS, SYSTEMS, APPARATUS, AND ARTICLES OF MANUFACTURE TO PRODUCE...
- Publication number 20230090449
- Publication date Mar 23, 2023
- Intel Corporation
- Suddhasattwa Nad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMBER FOR SOLID-STATE IMAGE PICKUP DEVICE AND METHOD FOR MANUFACTU...
- Publication number 20230075728
- Publication date Mar 9, 2023
- Canon Kabushiki Kaisha
- Nobuyuki Endo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE STRUCTURE, ELECTRONIC SUBSTRATE AND METHOD OF MA...
- Publication number 20230061684
- Publication date Mar 2, 2023
- Advanced Semiconductor Engineering, Inc.
- Shun-Tsat TU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE AND METHOD FOR FORMING THE SAME
- Publication number 20230005864
- Publication date Jan 5, 2023
- YANGTZE MEMORY TECHNOLOGIES CO., LTD.
- Yuancheng Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-DIELECTRIC BONDING METHOD AND STRUCTURE
- Publication number 20230005876
- Publication date Jan 5, 2023
- Yangtze Memory Technologies Co., Ltd.
- Siping HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND SYSTEMS FOR IMPROVING FUSION BONDING
- Publication number 20220367405
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hong-Ta Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EDGE-TRIMMING METHODS FOR WAFER BONDING AND DICING
- Publication number 20220336411
- Publication date Oct 20, 2022
- Taiwan Semiconductor Manufacturing Company Limited
- Feng-Chien Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT BONDING METHODS AND STRUCTURES
- Publication number 20220320035
- Publication date Oct 6, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLY FROM PROCESSED SUBSTRATE
- Publication number 20220285213
- Publication date Sep 8, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Cyprian Emeka UZOH
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CONDUCTIVE BARRIER DIRECT HYBRID BONDING
- Publication number 20220254746
- Publication date Aug 11, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Paul M. ENQUIST
- H01 - BASIC ELECTRIC ELEMENTS

Reshaping the bonding area in the bonding apparatus

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Member for solid-state image pickup device and method for manufactu...

Microelectronic assembly from processed substrate

Dimension compensation control for directly bonded structures

Electronic circuit for a hybrid molecular bonding

Electronic package structure, electronic substrate and method of ma...

Metal-dielectric bonding method and structure

Bond enhancement structure in microelectronics for trapping contami...

Low temperature hybrid bonding

Member for solid-state image pickup device and method for manufactu...

Conductive barrier direct hybrid bonding

Metal-dielectric bonding method and structure

Methods and structures for improved electrical contact between bond...

Reliable hybrid bonded apparatus

Die processing

Method of manufacturing semiconductor device and semiconductor device

Bonded semiconductor die assembly with metal alloy bonding pads and...

Manufacturing method of semiconductor device

Semiconductor device, fabrication method for a semiconductor device...

Chemical mechanical polishing for hybrid bonding

Member for solid-state image pickup device and method for manufactu...

Metal-dielectric bonding method and structure

Edge-trimming methods for wafer bonding and dicing

Bonded assembly containing oxidation barriers, hybrid bonding, or a...

Microelectronic assembly from processed substrate

Method of assembly by direct bonding between two elements, each ele...

Bond enhancement structure in microelectronics for trapping contami...

Methods and structures for improved electrical contact between bond...

Conductive barrier direct hybrid bonding

Method of manufacturing semiconductor device and semiconductor device

Method for bonding and connecting substrates

Patents Applicationslast 30 patents

CHEMICAL MECHANICAL POLISHING FOR HYBRID BONDING

DIMENSION COMPENSATION CONTROL FOR DIRECTLY BONDED STRUCTURES

CONDUCTIVE BARRIER DIRECT HYBRID BONDING

SYSTEMS AND METHODS FOR BONDING SEMICONDUCTOR DEVICES

HYBRID BONDING OF A THIN SEMICONDUCTOR DIE

SEMICONDUCTOR DEVICE MANUFACTURING METHOD, SEMICONDUCTOR DEVICE, IN...

BONDED STRUCTURE AND METHOD OF FORMING SAME

MEMBER FOR SOLID-STATE IMAGE PICKUP DEVICE AND METHOD FOR MANUFACTU...

RELIABLE HYBRID BONDED APPARATUS

DIE PROCESSING

SUBSTRATE TRENCH FOR IMPROVED HYBRID BONDING

MANUFACTURING METHOD OF SEMICONDUCTOR STRUCTURE

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

CHEMICAL MECHANICAL POLISHING FOR HYBRID BONDING

WAFER BONDING DEVICE AND WAFER BONDING METHOD

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

BOND ENHANCEMENT FOR DIRECT-BONDING PROCESSES

DIRECT BONDING METHODS AND STRUCTURES

Method for Etching of Metal

BONDING METHOD

METHODS, SYSTEMS, APPARATUS, AND ARTICLES OF MANUFACTURE TO PRODUCE...

MEMBER FOR SOLID-STATE IMAGE PICKUP DEVICE AND METHOD FOR MANUFACTU...

ELECTRONIC PACKAGE STRUCTURE, ELECTRONIC SUBSTRATE AND METHOD OF MA...

THREE-DIMENSIONAL MEMORY DEVICE AND METHOD FOR FORMING THE SAME

METAL-DIELECTRIC BONDING METHOD AND STRUCTURE

METHODS AND SYSTEMS FOR IMPROVING FUSION BONDING

EDGE-TRIMMING METHODS FOR WAFER BONDING AND DICING

DIRECT BONDING METHODS AND STRUCTURES

MICROELECTRONIC ASSEMBLY FROM PROCESSED SUBSTRATE

CONDUCTIVE BARRIER DIRECT HYBRID BONDING