Resist used only for applying catalyst, not for plating itself

Industry

CPC
H05K2203/0565

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00

Current Industry

H05K2203/0565Resist used only for applying catalyst, not for plating itself

Industries

Patents Grantslast 30 patents

Information Patent Grant
Single-layer circuit board, multi-layer circuit board, and manufact...
- Patent number 11,917,768
- Issue date Feb 27, 2024
- RICHVIEW ELECTRONICS CO., LTD.
- Siping Bai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electroless metal-defined thin pad first level interconnects for li...
- Patent number 11,728,258
- Issue date Aug 15, 2023
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Single-layer circuit board, multi-layer circuit board, and manufact...
- Patent number 11,266,027
- Issue date Mar 1, 2022
- RICHVIEW ELECTRONICS CO., LTD.
- Siping Bai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electroless metal-defined thin pad first level interconnects for li...
- Patent number 11,257,745
- Issue date Feb 22, 2022
- Intel Corporation
- Aleksandar Aleksov
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Single-layer circuit board, multi-layer circuit board, and manufact...
- Patent number 11,032,915
- Issue date Jun 8, 2021
- RICHVIEW ELECTRONICS CO., LTD.
- Siping Bai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Single-layer circuit board, multi-layer circuit board, and manufact...
- Patent number 10,757,820
- Issue date Aug 25, 2020
- RICHVIEW ELECTRONICS CO., LTD.
- Siping Bai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Patterning of electroless metals by selective deactivation of catal...
- Patent number 10,034,386
- Issue date Jul 24, 2018
- AVERATEK CORPORATION
- Mihir Reddy
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Patterning of electroless metals by selective deactivation of catal...
- Patent number 9,699,914
- Issue date Jul 4, 2017
- AVERATEK CORPORATION
- Mihir Reddy
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Circuit board, and semiconductor device having component mounted on...
- Patent number 9,351,402
- Issue date May 24, 2016
- Panasonic Corporation
- Shingo Yoshioka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of producing multilayer circuit board
- Patent number 9,332,650
- Issue date May 3, 2016
- Panasonic Corporation
- Shingo Yoshioka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board
- Patent number 9,332,642
- Issue date May 3, 2016
- Panasonic Corporation
- Shingo Yoshioka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin composition and method for producing circuit board
- Patent number 9,175,151
- Issue date Nov 3, 2015
- Panasonic Corporation
- Yuko Konno
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Method for preparing a patterned electric circuit
- Patent number 9,000,303
- Issue date Apr 7, 2015
- Nederlandse Organisatie voor Toegepast-Natuurwetenschappelijk Onderzoek TNO
- Roland Anthony Tacken
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board, and semiconductor device having component mounted on...
- Patent number 8,929,092
- Issue date Jan 6, 2015
- Panasonic Corporation
- Shingo Yoshioka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin composition and method for producing circuit board
- Patent number 8,877,843
- Issue date Nov 4, 2014
- Panasonic Corporation
- Yuko Konno
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Method of producing circuit board, and circuit board obtained using...
- Patent number 8,698,003
- Issue date Apr 15, 2014
- Panasonic Corporation
- Shingo Yoshioka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of producing circuit board
- Patent number 8,272,126
- Issue date Sep 25, 2012
- Panasonic Corporation
- Shingo Yoshioka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of producing a circuit board
- Patent number 8,240,036
- Issue date Aug 14, 2012
- Panasonic Corporation
- Shingo Yoshioka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for via stub elimination
- Patent number 8,230,592
- Issue date Jul 31, 2012
- International Business Machines Corporation
- Joseph Kuczynski
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Perforated porous resin base material and production process of por...
- Patent number 8,147,911
- Issue date Apr 3, 2012
- Sumitomo Electric Industries, Ltd.
- Yasuhiro Okuda
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method of forming a substrate having a plurality of insulator layers
- Patent number 8,136,240
- Issue date Mar 20, 2012
- International Business Machines Corporation
- Joseph Kuczynski
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of fabricating a solder pad structure
- Patent number 8,051,560
- Issue date Nov 8, 2011
- Unimicron Technology Corp.
- Tzyy-Jang Tseng
- B32 - LAYERED PRODUCTS
Information Patent Grant
Selective electroless plating for electronic substrates
- Patent number 8,017,022
- Issue date Sep 13, 2011
- Intel Corporation
- Houssam Jomaa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Transparent electrically conductive film and process for producing...
- Patent number 7,883,837
- Issue date Feb 8, 2011
- Seiren Co., Ltd.
- Kohei Yamada
- B32 - LAYERED PRODUCTS
Information Patent Grant
Multi-layer printed circuit board and method for fabricating the same
- Patent number 7,834,274
- Issue date Nov 16, 2010
- Industrial Technology Research Institute
- Ming-Huan Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing patterned porous molded product or nonwove...
- Patent number 7,586,047
- Issue date Sep 8, 2009
- Sumitomo Electric Industries, Ltd.
- Fumihiro Hayashi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for manufacturing wiring substrate
- Patent number 7,521,361
- Issue date Apr 21, 2009
- Seiko Epson Corporation
- Satoshi Kimura
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of manufacturing interconnect substrate
- Patent number 7,488,678
- Issue date Feb 10, 2009
- Seiko Epson Corporation
- Satoshi Kimura
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for the manufacture of printed circuit boards with integral...
- Patent number 6,767,445
- Issue date Jul 27, 2004
- Peter Kukanskis
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Process for the electroless deposition of metal on a substrate
- Patent number 6,524,645
- Issue date Feb 25, 2003
- Agere Systems Inc.
- Michael D. Evans
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
ELECTROLESS METAL-DEFINED THIN PAD FIRST LEVEL INTERCONNECTS FOR LI...
- Publication number 20220084927
- Publication date Mar 17, 2022
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROLESS METAL-DEFINED THIN PAD FIRST LEVEL INTERCONNECTS FOR LI...
- Publication number 20200258827
- Publication date Aug 13, 2020
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PATTERNING OF ELECTROLESS METALS BY SELECTIVE DEACTIVATION OF CATAL...
- Publication number 20180332713
- Publication date Nov 15, 2018
- Averatek Corporation
- Mihir Reddy
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PATTERNING OF ELECTROLESS METALS BY SELECTIVE DEACTIVATION OF CATAL...
- Publication number 20170354040
- Publication date Dec 7, 2017
- Averatek Corporation
- Mihir Reddy
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
RESIN COMPOSITION AND METHOD FOR PRODUCING CIRCUIT BOARD
- Publication number 20130337188
- Publication date Dec 19, 2013
- PANASONIC CORPORATION
- Yuko Konno
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
METHOD OF PRODUCING CIRCUIT BOARD BY ADDITIVE METHOD, AND CIRCUIT B...
- Publication number 20120292083
- Publication date Nov 22, 2012
- PANASONIC CORPORATION
- Shingo YOSHIOKA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF PRODUCING CIRCUIT BOARD BY ADDITIVE METHOD, AND CIRCUIT B...
- Publication number 20120285736
- Publication date Nov 15, 2012
- PANASONIC CORPORATION
- Shingo YOSHIOKA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
VIA STUB ELIMINATION
- Publication number 20120211273
- Publication date Aug 23, 2012
- International Business Machines Corporation
- Joseph Kuczynski
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD, AND SEMICONDUCTOR DEVICE HAVING COMPONENT MOUNTED ON...
- Publication number 20120206891
- Publication date Aug 16, 2012
- Shingo Yoshioka
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
METHOD OF PRODUCING CIRCUIT BOARD, AND CIRCUIT BOARD OBTAINED USING...
- Publication number 20110247860
- Publication date Oct 13, 2011
- Panasonic Electric Works Co., Ltd.
- Shingo YOSHIOKA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER PAD STRUCTURE FOR PRINTED CIRCUIT BOARDS AND FABRICATION MET...
- Publication number 20110091697
- Publication date Apr 21, 2011
- Tzyy-Jang Tseng
- B32 - LAYERED PRODUCTS
Information Patent Application
MULTI-LAYERED PRINTED CIRCUIT BOARD AND METHOD FOR FABRICATING THE...
- Publication number 20110023297
- Publication date Feb 3, 2011
- Industrial Technology Research Institute and Unimicron Technology Corp.
- Ming-Huan Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PREPARING A PATTERNED ELECTRIC CIRCUIT
- Publication number 20110017495
- Publication date Jan 27, 2011
- Roland Anthony Tacken
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Horizontally Split Vias
- Publication number 20100044096
- Publication date Feb 25, 2010
- International Business Machines Corporation
- Joseph Kuczynski
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Via Stub Elimination
- Publication number 20100044095
- Publication date Feb 25, 2010
- International Business Machines Corporation
- Joseph Kuczynski
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF PRODUCING CIRCUIT BOARD BY ADDITIVE METHOD, AND CIRCUIT B...
- Publication number 20090272562
- Publication date Nov 5, 2009
- Panasonic Electric Works Co., Ltd.
- Shingo YOSHIOKA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF PRODUCING CIRCUIT BOARD BY ADDITIVE METHOD, AND CIRCUIT B...
- Publication number 20090272564
- Publication date Nov 5, 2009
- Panasonic Electric Works Co., Ltd.
- Shingo YOSHIOKA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SELECTIVE ELECTROLESS PLATING FOR ELECTRONIC SUBSTRATES
- Publication number 20090166320
- Publication date Jul 2, 2009
- Houssam Jomaa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Molded circuit component and process for producing the same
- Publication number 20090123702
- Publication date May 14, 2009
- Norio Yoshizawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Transparent electrically conductive film and process for producing...
- Publication number 20090042150
- Publication date Feb 12, 2009
- Kohei Yamada
- B32 - LAYERED PRODUCTS
Information Patent Application
METHOD OF FORMING METAL PATTERN, PATTERNED METAL STRUCTURE, AND THI...
- Publication number 20080314628
- Publication date Dec 25, 2008
- Samsung Electronics Co., Ltd.
- Ki Yong SONG
- G02 - OPTICS
Information Patent Application
Method of manufacturing interconnect substrate
- Publication number 20070218193
- Publication date Sep 20, 2007
- Seiko Epson Corporation
- Satoshi Kimura
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR MANUFACTURING WIRING SUBSTRATE
- Publication number 20070218191
- Publication date Sep 20, 2007
- SEIKO EPSON CORPORATION
- Hidemichi FURIHATA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method of manufacturing interconnect substrate
- Publication number 20070218192
- Publication date Sep 20, 2007
- Seiko Epson Corporation
- Satoshi Kimura
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method of manufacturing interconnect substrate
- Publication number 20070212871
- Publication date Sep 13, 2007
- Seiko Epson Corporation
- Satoshi Kimura
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR MANUFACTURING WIRING SUBSTRATE
- Publication number 20070212876
- Publication date Sep 13, 2007
- SEIKO EPSON CORPORATION
- Satoshi KIMURA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method for manufacturing patterned porous molded product or nonwove...
- Publication number 20070160810
- Publication date Jul 12, 2007
- Fumihiro Hayashi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Multi-Layer Printed Circuit Board and Method for Fabricating the Same
- Publication number 20070153488
- Publication date Jul 5, 2007
- Industrial Technology Research Institute
- Ming-Huan Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Drilled porous resin base material, and method of manufacturing por...
- Publication number 20060141159
- Publication date Jun 29, 2006
- Yasuhiro Okuda
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Method for the manufacture of printed circuit boards with integral...
- Publication number 20040076743
- Publication date Apr 22, 2004
- Peter Kukanskis
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Resist used only for applying catalyst, not for plating itself

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Single-layer circuit board, multi-layer circuit board, and manufact...

Electroless metal-defined thin pad first level interconnects for li...

Single-layer circuit board, multi-layer circuit board, and manufact...

Electroless metal-defined thin pad first level interconnects for li...

Single-layer circuit board, multi-layer circuit board, and manufact...

Single-layer circuit board, multi-layer circuit board, and manufact...

Patterning of electroless metals by selective deactivation of catal...

Patterning of electroless metals by selective deactivation of catal...

Circuit board, and semiconductor device having component mounted on...

Method of producing multilayer circuit board

Circuit board

Resin composition and method for producing circuit board

Method for preparing a patterned electric circuit

Circuit board, and semiconductor device having component mounted on...

Resin composition and method for producing circuit board

Method of producing circuit board, and circuit board obtained using...

Method of producing circuit board

Method of producing a circuit board

Method for via stub elimination

Perforated porous resin base material and production process of por...

Method of forming a substrate having a plurality of insulator layers

Method of fabricating a solder pad structure

Selective electroless plating for electronic substrates

Transparent electrically conductive film and process for producing...

Multi-layer printed circuit board and method for fabricating the same

Method for manufacturing patterned porous molded product or nonwove...

Method for manufacturing wiring substrate

Method of manufacturing interconnect substrate

Method for the manufacture of printed circuit boards with integral...

Process for the electroless deposition of metal on a substrate

Patents Applicationslast 30 patents

ELECTROLESS METAL-DEFINED THIN PAD FIRST LEVEL INTERCONNECTS FOR LI...

ELECTROLESS METAL-DEFINED THIN PAD FIRST LEVEL INTERCONNECTS FOR LI...

PATTERNING OF ELECTROLESS METALS BY SELECTIVE DEACTIVATION OF CATAL...

PATTERNING OF ELECTROLESS METALS BY SELECTIVE DEACTIVATION OF CATAL...

RESIN COMPOSITION AND METHOD FOR PRODUCING CIRCUIT BOARD

METHOD OF PRODUCING CIRCUIT BOARD BY ADDITIVE METHOD, AND CIRCUIT B...

METHOD OF PRODUCING CIRCUIT BOARD BY ADDITIVE METHOD, AND CIRCUIT B...

VIA STUB ELIMINATION

CIRCUIT BOARD, AND SEMICONDUCTOR DEVICE HAVING COMPONENT MOUNTED ON...

METHOD OF PRODUCING CIRCUIT BOARD, AND CIRCUIT BOARD OBTAINED USING...

SOLDER PAD STRUCTURE FOR PRINTED CIRCUIT BOARDS AND FABRICATION MET...

MULTI-LAYERED PRINTED CIRCUIT BOARD AND METHOD FOR FABRICATING THE...

METHOD FOR PREPARING A PATTERNED ELECTRIC CIRCUIT

Horizontally Split Vias

Via Stub Elimination

METHOD OF PRODUCING CIRCUIT BOARD BY ADDITIVE METHOD, AND CIRCUIT B...

METHOD OF PRODUCING CIRCUIT BOARD BY ADDITIVE METHOD, AND CIRCUIT B...

SELECTIVE ELECTROLESS PLATING FOR ELECTRONIC SUBSTRATES

Molded circuit component and process for producing the same

Transparent electrically conductive film and process for producing...

METHOD OF FORMING METAL PATTERN, PATTERNED METAL STRUCTURE, AND THI...

Method of manufacturing interconnect substrate

METHOD FOR MANUFACTURING WIRING SUBSTRATE

Method of manufacturing interconnect substrate

Method of manufacturing interconnect substrate

METHOD FOR MANUFACTURING WIRING SUBSTRATE

Method for manufacturing patterned porous molded product or nonwove...

Multi-Layer Printed Circuit Board and Method for Fabricating the Same

Drilled porous resin base material, and method of manufacturing por...

Method for the manufacture of printed circuit boards with integral...