Multi-Layer Printed Circuit Board and Method for Fabricating the Same

Abstract

A method for fabricating a double-sided or multi-layer printed circuit board (PCB) by ink-jet printing that includes providing a substrate, forming a first self-assembly membrane (SAM) on at least one side of the substrate, forming a non-adhesive membrane on the first SAM, forming at least one microhole in the substrate, forming a second SAM on a surface of the microhole, providing catalyst particles on the at least one side of the substrate and on the surface of the microhole, and forming a catalyst circuit pattern on the substrate.

Description

BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWINGS

Reference will now be made in detail to the present embodiments of the invention, examples of which are illustrated in the accompanying drawings. Wherever possible, the same reference numbers are used throughout the drawings to refer to the same or like parts.

FIGS. 1A to 1B are cross-sectional views of a method for fabricating a double-sided printed circuit board (PCB) by ink-jet printing according to one embodiment of the present invention; and

FIGS. 2A to 2B are cross-sectional views of a method for fabricating a multi-layer printed circuit board by ink-jet printing according to another embodiment of the present invention.

Claims

1. A method for fabricating a printed circuit board (PCB), comprising: providing a substrate;forming a first self-assembly membrane (SAM) on at least one side of the substrate;forming a non-adhesive membrane on the first SAM;forming at least one microhole in the substrate;forming a second SAM on a surface of the microhole;providing catalyst particles on the at least one side of the substrate and on the surface of the microhole; andforming a catalyst circuit pattern on the substrate.

2. The method of claim 1, further comprising immersing the substrate into an electrolyte to form a metal circuit on the substrate and a metal membrane in the microhole.

3. The method of claim 1, further comprising immersing the substrate in an accelerator solution.

4. The method of claim 1, wherein the step of forming the self-assembly membrane (SAM) comprises: immersing the substrate into a first polyelectrolyte solution;immersing the substrate into a second polyelectrolyte solution having an opposite charge from the first polyelectrolyte solution; andimmersing the substrate into a third polyelectrolyte solution having a same charge as the first polyelectrolyte solution.

5. The method of claim 1, wherein the step of forming the microhole comprises drilling the substrate to form the microhole.

6. A method for fabricating a multi-layer printed circuit board (PCB), comprising: providing a substrate;forming a self-assembly membrane (SAM) at each side of the substrate;forming a non-adhesive membrane on the SAM;forming at least one microhole in the substrate;forming the SAM on a surface of the microhole;applying catalyst particles on at least one side of the substrate and on the surface of the microhole;forming a catalyst circuit pattern on the substrate through catalyst micro-dispensing and accelerator solution immersing; andimmersing the substrate into an electrolyte to form a metal circuit on the substrate and a metal membrane in the microhole.

7. The method of claim 6, further comprising: adhering an insulating layer on at least one side of the double-sided PCB; andrepeating the step of forming the double-sided PCB once to form a multi-layer PCB.

8. The method for fabricating a multi-layer PCB as claimed in claim 6, wherein the step of forming a microhole comprises drilling the substrate to form the microhole.

9. The method for fabricating a multi-layer PCB as claimed in claim 8, wherein the drilling step forms a buried hole, a blind hole, or a through hole of the multi-layer PCB.

10. The method for fabricating a multi-layer PCB as claimed in claim 6, wherein the step of forming the self-assembly membrane (SAM) comprises a conducting surface treatment process that includes immersing the substrate in a first polyelectrolyte solution;immersing the substrate in a second polyelectrolyte solution having an opposite charge from the first polyelectrolyte solution; andimmersing the substrate in a third polyelectrolyte solution having the same charge as the first polyelectrolyte solution.

11. The method for fabricating a multi-layer PCB as claimed in claim 6, wherein the catalyst comprises a palladium salt catalyst or a platinum salt catalyst.

12. A double-sided printed circuit board, comprising: a substrate having at least one microhole;a self-assembly membrane (SAM) formed on at least one side of the substrate;a catalyst layer formed on a surface of the microhole on the substrate;a metal membrane formed on the surface of the microhole with the catalyst layer; anda first circuit formed on the SAM.

13. The double-sided printed circuit board as claimed in claim 12, wherein the SAM further comprises layers formed by anionic and cationic polyelectrolyte solutions.

14. The double-sided printed circuit board as claimed in claim 13, wherein the anionic polyelectrolyte solution is selected from group consisting of polyacrylic acid (PAA), polymethacrylic acid (PMA), poly(styrene sulfonate) (PSS), poly(3-thiopheneacetic acid) (PTAA), or any combination thereof.

15. The double-sided printed circuit board as claimed in claim 13, wherein the cationic polyelectrolyte solution is selected from a group consisting of polyallylamine hydrochloride (PAH), polyvinylalcohol (PVA), polyvinylimidazole (PVI+), poly(vinylpyrrolidone) (PVP+), polyaniline (PAN), or any combination thereof.

16. The double-sided printed circuit board as claimed in claim 12, wherein the catalyst comprises a metal-salt containing catalyst.

17. The double-sided printed circuit board as claimed in claim 12, further comprising an electrostatic absorption film on the first circuit.

18. The double-sided printed circuit board as claimed in claim 12, wherein the first circuit comprises a catalyst circuit.

19. A multi-layer printed circuit board (PCB), comprising: a first substrate having at least one microhole;a first self-assembly membrane (SAM) formed at each side of the first substrate;a first catalyst layer formed on a surface of the microhole on the first substrate;a first metal membrane formed on the surface of the microhole with the first catalyst layer therebetween;a first circuit formed at one side of the first substrate with the first SAM therebetween; anda second circuit formed on another side of the first substrate with the first SAM therebetween.

20. The multi-layer printed circuit board (PCB) of claim 19, further comprising a second substrate adhered on one side of the first substrate, the second substrate having at least one microhole;a second self-assembly membrane (SAM) formed on one side of the second substrate;a second layer formed catalyst formed on a surface of the microhole on the second substrate; anda second metal membrane formed on the surface of the microhole on the second substrate.

21. The multi-layer printed circuit board (PCB) as claimed in claim 20, further comprising a third circuit formed at the side of the second substrate with the second SAM therebetween.

22. The multi-layer printed circuit board (PCB) as claimed in claim 20, wherein each of the first and the second SAM further comprises layers formed with anionic and cationic polyelectrolyte solutions.

23. The multi-layer printed circuit board (PCB) as claimed in claim 19, wherein the microhole is a buried hole.

24. The multi-layer printed circuit board (PCB) as claimed in claim 19, wherein the microhole is a blind hole.

25. The multi-layer printed circuit board (PCB) as claimed in claim 19, wherein the microhole is a through hole.