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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/1015Shape

Industries

Patents Grantslast 30 patents

Information Patent Grant
Encapsulated light emitting diodes for selective fluidic assembly
- Patent number 12,119,432
- Issue date Oct 15, 2024
- eLux, Inc.
- Kenji Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure of micro light-emitting device and method of transferring...
- Patent number 12,113,150
- Issue date Oct 8, 2024
- Korea University Research and Business Foundation
- In Hwan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having an antenna arranged over an active main...
- Patent number 12,094,842
- Issue date Sep 17, 2024
- Infineon Technologies AG
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including non-conductive film and method for...
- Patent number 12,015,005
- Issue date Jun 18, 2024
- Samsung Electronics Co., Ltd.
- Yeongbeom Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
SSD wafer device and method of manufacturing same
- Patent number 12,009,354
- Issue date Jun 11, 2024
- Western Digital Technologies, Inc.
- Ken Funaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for packing optimization of semiconductor devices
- Patent number 11,916,033
- Issue date Feb 27, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Glenn Rinne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal interface material having different thicknesses in packages
- Patent number 11,916,023
- Issue date Feb 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sung-Hui Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of transferring micro-light emitting diode for LED display
- Patent number 11,869,880
- Issue date Jan 9, 2024
- Samsung Electronics Co., Ltd.
- Kyungwook Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radar package with optical lens for radar waves
- Patent number 11,823,970
- Issue date Nov 21, 2023
- Infineon Technologies AG
- Bernhard Rieder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming protective layer around...
- Patent number 11,804,416
- Issue date Oct 31, 2023
- UTAC HEADQUARTERS PTE. LTD.
- Saravuth Sirinorakul
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 11,798,860
- Issue date Oct 24, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Pei-Haw Tsao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting diode (LED) components and methods
- Patent number 11,769,757
- Issue date Sep 26, 2023
- CreeLED, Inc.
- Jesse Colin Reiherzer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Elastic wave device
- Patent number 11,764,752
- Issue date Sep 19, 2023
- Murata Manufacturing Co., Ltd.
- Masatoshi Nakagawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device and fluidic manufacture thereof
- Patent number 11,721,792
- Issue date Aug 8, 2023
- eLux Inc.
- Kenji Alexander Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and method of manufacturing the same
- Patent number 11,694,990
- Issue date Jul 4, 2023
- Samsung Display Co., Ltd.
- Chan-Jae Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,664,330
- Issue date May 30, 2023
- Samsung Electronics Co., Ltd.
- Kyong Soon Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sawing underfill in packaging processes
- Patent number 11,637,086
- Issue date Apr 25, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Szu-Wei Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sawing underfill in packaging processes
- Patent number 11,631,654
- Issue date Apr 18, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Szu-Wei Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 11,626,352
- Issue date Apr 11, 2023
- Rohm Co., Ltd.
- Motoharu Haga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Imaging element, imaging device, electronic device, and method of m...
- Patent number 11,605,662
- Issue date Mar 14, 2023
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Hitoshi Shibue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,581,257
- Issue date Feb 14, 2023
- Samsung Electronics Co., Ltd.
- Hyuek Jae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device
- Patent number 11,508,701
- Issue date Nov 22, 2022
- Nichia Corporation
- Masaki Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High reliability semiconductor devices and methods of fabricating t...
- Patent number 11,488,923
- Issue date Nov 1, 2022
- Wolfspeed, Inc.
- Sung Chul Joo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming embedded wafer level chi...
- Patent number 11,488,933
- Issue date Nov 1, 2022
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-die package with bridge layer
- Patent number 11,476,125
- Issue date Oct 18, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei Sen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems, methods, and apparatuses for implementing reduced height s...
- Patent number 11,469,213
- Issue date Oct 11, 2022
- Intel Corporation
- Georg Seidemann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and method of manufacturing the same
- Patent number 11,410,967
- Issue date Aug 9, 2022
- Samsung Display Co., Ltd.
- Chan-Jae Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal airflow sensor
- Patent number 11,391,611
- Issue date Jul 19, 2022
- Hitachi Astemo, Ltd.
- Ryosuke Doi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor die singulation and structures formed thereby
- Patent number 11,367,658
- Issue date Jun 21, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Fu-Chen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component and device
- Patent number 11,348,888
- Issue date May 31, 2022
- Canon Kabushiki Kaisha
- Hidemasa Oshige
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240421020
- Publication date Dec 19, 2024
- Samsung Electronics Co., Ltd.
- YOUNG KWAN SEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON CARBIDE CHIP, SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTU...
- Publication number 20240404883
- Publication date Dec 5, 2024
- INFINEON TECHNOLOGIES AG
- Franz-Josef Pichler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Packages and Methods
- Publication number 20240387304
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Bo-Huan Hsin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING SEMICONDUC...
- Publication number 20240379489
- Publication date Nov 14, 2024
- SHUNSIN TECHNOLOGY (ZHONG SHAN) LIMITED
- SHUN-HSING LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SSD WAFER DEVICE AND METHOD OF MANUFACTURING SAME
- Publication number 20240332276
- Publication date Oct 3, 2024
- Western Digital Technologies, Inc.
- Ken Funaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240297045
- Publication date Sep 5, 2024
- KIOXIA Corporation
- Yoshio MIZUTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING NON-CONDUCTIVE FILM AND METHOD FOR...
- Publication number 20240297141
- Publication date Sep 5, 2024
- Samsung Electronics Co., Ltd.
- Yeongbeom KO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR DEVICES HAVING NON-RECTANGULAR SEMICONDUCTOR DI...
- Publication number 20240274660
- Publication date Aug 15, 2024
- Wolfspeed, Inc.
- Edward Robert Van Brunt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT AND PACKAGE INCLUDING STRESS RELEASE STRUCTURE...
- Publication number 20240258372
- Publication date Aug 1, 2024
- INFINEON TECHNOLOGIES AG
- Sebastian POLSTER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES AND METHODS
- Publication number 20240234210
- Publication date Jul 11, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jen-Chun Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL INTERFACE MATERIAL HAVING DIFFERENT THICKNESSES IN PACKAGES
- Publication number 20240162166
- Publication date May 16, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Sung-Hui Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE HAVING A STACKED SEMICONDUCTOR DIES WITH WAVY SID...
- Publication number 20240153821
- Publication date May 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Shien CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES, ASSEMBLIES, AND ASSOCIATED METHODS
- Publication number 20240072002
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Raj K. Bansal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240063160
- Publication date Feb 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hsin Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NESTED SEMICONDUCTOR ASSEMBLIES AND METHODS FOR MAKING THE SAME
- Publication number 20240047423
- Publication date Feb 8, 2024
- Micron Technology, Inc.
- Seng Kim Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT RADIATION STRUCTURE AND ELECTRONIC APPARATUS
- Publication number 20240038710
- Publication date Feb 1, 2024
- LENOVO (SINGAPORE) PTE. LTD.
- Junki Hashiba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE ASSEMBLY HAVING A POLYGONAL LINKING DIE
- Publication number 20240006374
- Publication date Jan 4, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF TRANSFERRING MICRO-LIGHT EMITTING DIODE FOR LED DISPLAY
- Publication number 20230395575
- Publication date Dec 7, 2023
- Samsung Electronics Co., Ltd.
- Kyungwook HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20230317657
- Publication date Oct 5, 2023
- Samsung Electronics Co., Ltd.
- Wonil SEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Limiting Failures Caused by Dendrite Growth on Semiconductor Chips
- Publication number 20230215833
- Publication date Jul 6, 2023
- Wolfspeed, Inc.
- Dan Namishia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
- Publication number 20230207392
- Publication date Jun 29, 2023
- Rohm Co., Ltd.
- Shingo OTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230207432
- Publication date Jun 29, 2023
- ROHM CO., LTD.
- Motoharu Haga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SSD WAFER DEVICE AND METHOD OF MANUFACTURING SAME
- Publication number 20230187430
- Publication date Jun 15, 2023
- Western Digital Technologies, Inc.
- Ken Funaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE, ELECTRONIC DEVICE, AND MANUFACTURE METHOD...
- Publication number 20230163043
- Publication date May 25, 2023
- Huawei Technologies Co., Ltd
- Ran HE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20230089399
- Publication date Mar 23, 2023
- Samsung Electronics Co., Ltd.
- Solji SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230075665
- Publication date Mar 9, 2023
- Samsung Electronics Co., Ltd.
- Wonkyun Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH RELIABILITY SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING T...
- Publication number 20230019230
- Publication date Jan 19, 2023
- Wolfspeed, Inc.
- Sung Chul Joo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Embedded Wafer Level Chi...
- Publication number 20230012958
- Publication date Jan 19, 2023
- STATS ChipPAC Pte Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING NON-CONDUCTIVE FILM AND METHOD FOR...
- Publication number 20220415842
- Publication date Dec 29, 2022
- Samsung Electronics Co., Ltd.
- Yeongbeom KO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20220328451
- Publication date Oct 13, 2022
- SAMSUNG DISPLAY CO., LTD.
- Chan-Jae Park
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Encapsulated light emitting diodes for selective fluidic assembly

Structure of micro light-emitting device and method of transferring...

Semiconductor device having an antenna arranged over an active main...

Semiconductor package including non-conductive film and method for...

SSD wafer device and method of manufacturing same

Method and system for packing optimization of semiconductor devices

Thermal interface material having different thicknesses in packages

Method of transferring micro-light emitting diode for LED display

Radar package with optical lens for radar waves

Semiconductor device and method of forming protective layer around...

Semiconductor structure and manufacturing method thereof

Light emitting diode (LED) components and methods

Elastic wave device

Light emitting device and fluidic manufacture thereof

Display device and method of manufacturing the same

Semiconductor package

Sawing underfill in packaging processes

Sawing underfill in packaging processes

Semiconductor device and method for manufacturing the same

Imaging element, imaging device, electronic device, and method of m...

Semiconductor package

Light emitting device

High reliability semiconductor devices and methods of fabricating t...

Semiconductor device and method of forming embedded wafer level chi...

Multi-die package with bridge layer

Systems, methods, and apparatuses for implementing reduced height s...

Display device and method of manufacturing the same

Thermal airflow sensor

Semiconductor die singulation and structures formed thereby

Electronic component and device

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE

SILICON CARBIDE CHIP, SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTU...

Integrated Circuit Packages and Methods

SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING SEMICONDUC...

SSD WAFER DEVICE AND METHOD OF MANUFACTURING SAME

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE INCLUDING NON-CONDUCTIVE FILM AND METHOD FOR...

POWER SEMICONDUCTOR DEVICES HAVING NON-RECTANGULAR SEMICONDUCTOR DI...

ELECTRONIC COMPONENT AND PACKAGE INCLUDING STRESS RELEASE STRUCTURE...

INTEGRATED CIRCUIT PACKAGES AND METHODS

THERMAL INTERFACE MATERIAL HAVING DIFFERENT THICKNESSES IN PACKAGES

PACKAGE STRUCTURE HAVING A STACKED SEMICONDUCTOR DIES WITH WAVY SID...

SEMICONDUCTOR DEVICES, ASSEMBLIES, AND ASSOCIATED METHODS

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

NESTED SEMICONDUCTOR ASSEMBLIES AND METHODS FOR MAKING THE SAME

HEAT RADIATION STRUCTURE AND ELECTRONIC APPARATUS

SEMICONDUCTOR DIE ASSEMBLY HAVING A POLYGONAL LINKING DIE

METHOD OF TRANSFERRING MICRO-LIGHT EMITTING DIODE FOR LED DISPLAY

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

Limiting Failures Caused by Dendrite Growth on Semiconductor Chips

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

SSD WAFER DEVICE AND METHOD OF MANUFACTURING SAME

SEMICONDUCTOR STRUCTURE, ELECTRONIC DEVICE, AND MANUFACTURE METHOD...

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

HIGH RELIABILITY SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING T...

Semiconductor Device and Method of Forming Embedded Wafer Level Chi...

SEMICONDUCTOR PACKAGE INCLUDING NON-CONDUCTIVE FILM AND METHOD FOR...

DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME