Stacked arrangements of devices

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H01L25/117

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof

Current Industry

H01L25/117Stacked arrangements of devices

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device structures and methods of manufacturing the same
- Patent number 12,166,114
- Issue date Dec 10, 2024
- INNOSCIENCE (SUZHOU) SEMICONDUCTOR CO., LTD.
- Jingyu Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and manufacturing method thereof
- Patent number 12,159,821
- Issue date Dec 3, 2024
- Siliconware Precision Industries Co., Ltd.
- Ting-Yang Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package and package-on-package structure having elliptical columns...
- Patent number 12,051,634
- Issue date Jul 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sheng-Huan Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cooling apparatus
- Patent number 12,033,918
- Issue date Jul 9, 2024
- LG Electronics Inc.
- Myeon Gyu Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package dielectric substrate including a trench
- Patent number 11,961,796
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yueh-Ting Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Module with high peak bandwidth I/O channels
- Patent number 11,901,956
- Issue date Feb 13, 2024
- L. Pierre de Rochemont
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inverter
- Patent number 11,837,523
- Issue date Dec 5, 2023
- Tesla, Inc.
- Wenjun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming package structure
- Patent number 11,817,437
- Issue date Nov 14, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and method of forming same
- Patent number 11,810,831
- Issue date Nov 7, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three dimensional circuit implementing machine trained network
- Patent number 11,790,219
- Issue date Oct 17, 2023
- Adeia Semiconductor Inc.
- Steven L. Teig
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 11,764,126
- Issue date Sep 19, 2023
- Mitsubishi Electric Corporation
- Hideo Komo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded multi-die interconnect bridge packages with lithographical...
- Patent number 11,764,158
- Issue date Sep 19, 2023
- Intel Corporation
- Amruthavalli Pallavi Alur
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package and package-on-package structure having elliptical columns...
- Patent number 11,756,849
- Issue date Sep 12, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sheng-Huan Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally conductive material in the recess of an encapsulant and s...
- Patent number 11,756,802
- Issue date Sep 12, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device packages including redistribution layers with carbon-based c...
- Patent number 11,749,608
- Issue date Sep 5, 2023
- Eiichi Nakano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked chips comprising interconnects
- Patent number 11,594,521
- Issue date Feb 28, 2023
- Kioxia Corporation
- Masaru Koyanagi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 11,508,671
- Issue date Nov 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Yuan Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Underfill between a first package and a second package
- Patent number 11,488,843
- Issue date Nov 1, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inverter
- Patent number 11,476,179
- Issue date Oct 18, 2022
- Tesla, Inc.
- Wenjun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and method of forming same
- Patent number 11,424,173
- Issue date Aug 23, 2022
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package and package-on-package structure having elliptical columns...
- Patent number 11,404,341
- Issue date Aug 2, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sheng-Huan Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a heat dissipation structure connected...
- Patent number 11,282,791
- Issue date Mar 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Yuan Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component module, and manufacturing method for electroni...
- Patent number 11,257,730
- Issue date Feb 22, 2022
- Murata Manufacturing Co., Ltd.
- Takashi Iwamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Microelectronic devices, stacked microelectronic devices, and metho...
- Patent number 11,239,128
- Issue date Feb 1, 2022
- Micron Technology, Inc.
- Seng Kim Dalson Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked modules
- Patent number 11,239,170
- Issue date Feb 1, 2022
- Snaptrack, Inc.
- Andreas Franz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Module with high peak bandwidth I/O channels
- Patent number 11,239,922
- Issue date Feb 1, 2022
- L. Pierre de Rochemont
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mechanisms for forming bonding structures
- Patent number 11,233,032
- Issue date Jan 25, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yeong-Jyh Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of forming the same
- Patent number 11,217,518
- Issue date Jan 4, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tzung-Hui Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
First wafer, fabricating method thereof and wafer stack
- Patent number 11,211,348
- Issue date Dec 28, 2021
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Xing Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electric power conversion apparatus
- Patent number 11,191,192
- Issue date Nov 30, 2021
- Denso Corporation
- Kazuya Takeuchi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
STACKED INTEGRATED CIRCUIT DEVICES INCLUDING STAGGERED GATE STRUCTU...
- Publication number 20240355879
- Publication date Oct 24, 2024
- Samsung Electronics Co., Ltd.
- SEUNG MIN SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF INTEGRATING POWER MODULE WITH IN...
- Publication number 20240304603
- Publication date Sep 12, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jinchang ZHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER TRANSISTOR CHIP PACKAGE
- Publication number 20240304528
- Publication date Sep 12, 2024
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULE WITH HIGH PEAK BANDWIDTH I/O CHANNELS
- Publication number 20240223283
- Publication date Jul 4, 2024
- L. Pierre de Rochemont
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF INTEGRATING POWER MODULE WITH IN...
- Publication number 20240072008
- Publication date Feb 29, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jinchang ZHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240014192
- Publication date Jan 11, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jing-Cheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE PACKAGES INCLUDING REDISTRIBUTION LAYERS WITH CARBON-BASED C...
- Publication number 20230411299
- Publication date Dec 21, 2023
- Lodestar Licensing Group, LLC
- Eiichi Nakano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSISTOR STACKS HAVING SPACERS, AND RELATED FABRICATION METHODS
- Publication number 20230395659
- Publication date Dec 7, 2023
- Samsung Electronics Co., Ltd.
- Keumseok Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOUBLE-SIDED COOLING PACKAGE FOR DOUBLE-SIDED, BI-DIRECTIONAL JUNCT...
- Publication number 20230386987
- Publication date Nov 30, 2023
- IDEAL POWER INC.
- Jiankang BU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE DIELECTRIC SUSBTRATE INCLUDING A TRENCH
- Publication number 20230386989
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yueh-Ting Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D-STACKED SEMICONDUCTOR DEVICE HAVING DIFFERENT CHANNEL LAYER INTE...
- Publication number 20230352529
- Publication date Nov 2, 2023
- Samsung Electronics Co., Ltd.
- Gunho JO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CROSS-COUPLING CONNECTIONS FOR STACKED FIELD EFFECT TRANSISTORS
- Publication number 20230343821
- Publication date Oct 26, 2023
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D-STACKED SEMICONDUCTOR DEVICE INCLUDING GATE STRUCTURE FORMED OF...
- Publication number 20230343824
- Publication date Oct 26, 2023
- Samsung Electronics Co., Ltd.
- Seungchan YUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE DIELECTRIC SUSBTRATE INCLUDING A TRENCH
- Publication number 20230068082
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yueh-Ting Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dicing Process in Packages Comprising Organic Interposers
- Publication number 20230023268
- Publication date Jan 26, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chipta Priya Laksana
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURES AND METHODS OF MANUFACTURING THE SAME
- Publication number 20220384628
- Publication date Dec 1, 2022
- INNOSCIENCE (SUZHOU) SEMICONDUCTOR CO., LTD.
- Jingyu SHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Underfill Between a First Package and a Second Package
- Publication number 20220367212
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing Co, LTD.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULE WITH HIGH PEAK BANDWIDTH I/O CHANNELS
- Publication number 20220209871
- Publication date Jun 30, 2022
- L. Pierre de Rochemont
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Three Dimensional Circuit Implementing Machine Trained Network
- Publication number 20220108161
- Publication date Apr 7, 2022
- Xcelsis Corporation
- Steven L. Teig
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD OF FORMING PACKAGE STRUCTURE
- Publication number 20220059515
- Publication date Feb 24, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jing-Cheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-EMITTING DEVICE, AND METHOD FOR PRODUCING SAME
- Publication number 20210351228
- Publication date Nov 11, 2021
- OSRAM OLED GmbH
- Meik WECKBECKER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20210343623
- Publication date Nov 4, 2021
- Mitsubishi Electric Corporation
- Hideo KOMO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COOLING APPARATUS
- Publication number 20210280498
- Publication date Sep 9, 2021
- LG ELECTRONICS INC.
- Myeon Gyu KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED TRANSISTOR ASSEMBLY WITH DUAL MIDDLE MOUNTING CLIPS
- Publication number 20210111106
- Publication date Apr 15, 2021
- Semiconductor Components Industries, LLC
- Jeffrey Peter GAMBINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP-STACK STRUCTURE
- Publication number 20210057368
- Publication date Feb 25, 2021
- United Microelectronics Corp.
- Ming-Tse Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE PACKAGES INCLUDING REDISTRIBUTION LAYERS WITH CARBON-BASED C...
- Publication number 20210057342
- Publication date Feb 25, 2021
- Micron Technology, Inc.
- Eiichi Nakano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Release Film as Isolation Film in Package
- Publication number 20200402816
- Publication date Dec 24, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20200402927
- Publication date Dec 24, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Yuan Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM-IN-PACKAGE INCLUDING OPPOSING CIRCUIT BOARDS
- Publication number 20200375033
- Publication date Nov 26, 2020
- Apple Inc.
- Yanfeng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20200321290
- Publication date Oct 8, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Po-Yuan Teng
- H01 - BASIC ELECTRIC ELEMENTS

Stacked arrangements of devices

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device structures and methods of manufacturing the same

Electronic package and manufacturing method thereof

Package and package-on-package structure having elliptical columns...

Cooling apparatus

Semiconductor package dielectric substrate including a trench

Module with high peak bandwidth I/O channels

Inverter

Method of forming package structure

Integrated circuit package and method of forming same

Three dimensional circuit implementing machine trained network

Semiconductor device and method of manufacturing semiconductor device

Embedded multi-die interconnect bridge packages with lithographical...

Package and package-on-package structure having elliptical columns...

Thermally conductive material in the recess of an encapsulant and s...

Device packages including redistribution layers with carbon-based c...

Stacked chips comprising interconnects

Semiconductor package and manufacturing method thereof

Underfill between a first package and a second package

Inverter

Integrated circuit package and method of forming same

Package and package-on-package structure having elliptical columns...

Semiconductor device having a heat dissipation structure connected...

Electronic component module, and manufacturing method for electroni...

Microelectronic devices, stacked microelectronic devices, and metho...

Stacked modules

Module with high peak bandwidth I/O channels

Mechanisms for forming bonding structures

Package structure and method of forming the same

First wafer, fabricating method thereof and wafer stack

Electric power conversion apparatus

Patents Applicationslast 30 patents

STACKED INTEGRATED CIRCUIT DEVICES INCLUDING STAGGERED GATE STRUCTU...

SEMICONDUCTOR DEVICE AND METHOD OF INTEGRATING POWER MODULE WITH IN...

POWER TRANSISTOR CHIP PACKAGE

MODULE WITH HIGH PEAK BANDWIDTH I/O CHANNELS

SEMICONDUCTOR DEVICE AND METHOD OF INTEGRATING POWER MODULE WITH IN...

PACKAGE STRUCTURE

DEVICE PACKAGES INCLUDING REDISTRIBUTION LAYERS WITH CARBON-BASED C...

TRANSISTOR STACKS HAVING SPACERS, AND RELATED FABRICATION METHODS

DOUBLE-SIDED COOLING PACKAGE FOR DOUBLE-SIDED, BI-DIRECTIONAL JUNCT...

SEMICONDUCTOR PACKAGE DIELECTRIC SUSBTRATE INCLUDING A TRENCH

3D-STACKED SEMICONDUCTOR DEVICE HAVING DIFFERENT CHANNEL LAYER INTE...

CROSS-COUPLING CONNECTIONS FOR STACKED FIELD EFFECT TRANSISTORS

3D-STACKED SEMICONDUCTOR DEVICE INCLUDING GATE STRUCTURE FORMED OF...

SEMICONDUCTOR PACKAGE DIELECTRIC SUSBTRATE INCLUDING A TRENCH

Dicing Process in Packages Comprising Organic Interposers

SEMICONDUCTOR DEVICE STRUCTURES AND METHODS OF MANUFACTURING THE SAME

Underfill Between a First Package and a Second Package

MODULE WITH HIGH PEAK BANDWIDTH I/O CHANNELS

Three Dimensional Circuit Implementing Machine Trained Network

METHOD OF FORMING PACKAGE STRUCTURE

LIGHT-EMITTING DEVICE, AND METHOD FOR PRODUCING SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

COOLING APPARATUS

STACKED TRANSISTOR ASSEMBLY WITH DUAL MIDDLE MOUNTING CLIPS

CHIP-STACK STRUCTURE

DEVICE PACKAGES INCLUDING REDISTRIBUTION LAYERS WITH CARBON-BASED C...

Release Film as Isolation Film in Package

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SYSTEM-IN-PACKAGE INCLUDING OPPOSING CIRCUIT BOARDS

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF