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ELECTRONIC COMPONENT
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Publication number 20250210530
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Publication date Jun 26, 2025
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Murata Manufacturing Co., Ltd.
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Kimmo KAIJA
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H01 - BASIC ELECTRIC ELEMENTS
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METHOD FOR FORMING PACKAGE STRUCTURE
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Publication number 20250087648
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Publication date Mar 13, 2025
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Taiwan Semiconductor Manufacturing Co., Ltd.
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Jing-Cheng LIN
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H01 - BASIC ELECTRIC ELEMENTS
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POWER TRANSISTOR CHIP PACKAGE
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Publication number 20240304528
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Publication date Sep 12, 2024
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Infineon Technologies Austria AG
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Ralf Otremba
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H01 - BASIC ELECTRIC ELEMENTS
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PACKAGE STRUCTURE
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Publication number 20240014192
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Publication date Jan 11, 2024
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Taiwan Semiconductor Manufacturing Co., Ltd.
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Jing-Cheng LIN
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H01 - BASIC ELECTRIC ELEMENTS
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METHOD OF FORMING PACKAGE STRUCTURE
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Publication number 20220059515
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Publication date Feb 24, 2022
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Taiwan Semiconductor Manufacturing Co., Ltd.
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Jing-Cheng LIN
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H01 - BASIC ELECTRIC ELEMENTS
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COOLING APPARATUS
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Publication number 20210280498
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Publication date Sep 9, 2021
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LG ELECTRONICS INC.
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Myeon Gyu KANG
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H01 - BASIC ELECTRIC ELEMENTS
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