Structure

Industry

CPC
H01L2924/1511

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/1511Structure

Industries

Patents Grantslast 30 patents

Information Patent Grant
Electrical interconnect bridge
- Patent number 12,148,704
- Issue date Nov 19, 2024
- Intel Corporation
- Srinivas V. Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Offset interposers for large-bottom packages and large-die package-...
- Patent number 12,107,082
- Issue date Oct 1, 2024
- Intel Corporation
- Russell K. Mortensen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Offset interposers for large-bottom packages and large-die package-...
- Patent number 11,978,730
- Issue date May 7, 2024
- Intel Corporation
- Russell K. Mortensen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a chip package and chip package
- Patent number 11,862,600
- Issue date Jan 2, 2024
- Infineon Technologies AG
- Thorsten Scharf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Offset interposers for large-bottom packages and large-die package-...
- Patent number 11,798,932
- Issue date Oct 24, 2023
- Intel Corporation
- Russell K. Mortensen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical interconnect bridge
- Patent number 11,791,269
- Issue date Oct 17, 2023
- Intel Corporation
- Srinivas V. Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed wiring board, printed circuit board, and electronic device
- Patent number 10,897,820
- Issue date Jan 19, 2021
- Canon Kabushiki Kaisha
- Koji Noguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Offset interposers for large-bottom packages and large-die package-...
- Patent number 10,607,976
- Issue date Mar 31, 2020
- Intel Corporation
- Russell K. Mortensen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed wiring board, printed circuit board, and electronic device
- Patent number 10,582,615
- Issue date Mar 3, 2020
- Canon Kabushiki Kaisha
- Koji Noguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structures and method of forming the same
- Patent number 10,504,751
- Issue date Dec 10, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multichip modules and methods of fabrication
- Patent number 10,490,520
- Issue date Nov 26, 2019
- Invensas Corporation
- Liang Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of producing a connection support, connection support and op...
- Patent number 10,468,569
- Issue date Nov 5, 2019
- Osram Opto Semiconductor GmbH
- Jörg Erich Sorg
- B32 - LAYERED PRODUCTS
Information Patent Grant
Offset interposers for large-bottom packages and large-die package-...
- Patent number 10,446,530
- Issue date Oct 15, 2019
- Intel Corporation
- Russell K. Mortensen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring structure, semiconductor package structure and semiconductor...
- Patent number 10,424,539
- Issue date Sep 24, 2019
- Advanced Semiconductor Engineering, Inc.
- Wen-Long Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 10,332,826
- Issue date Jun 25, 2019
- Sony Corporation
- Kosuke Hareyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip-stack structure
- Patent number 10,325,873
- Issue date Jun 18, 2019
- United Microelectronics Corp.
- Ming-Tse Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multichip modules and methods of fabrication
- Patent number 10,163,833
- Issue date Dec 25, 2018
- Invensas Corporation
- Liang Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Package structures and method of forming the same
- Patent number 10,032,651
- Issue date Jul 24, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor substrate structure, semiconductor package and method...
- Patent number 10,002,843
- Issue date Jun 19, 2018
- Advanced Semiconductor Engineering, Inc.
- Tien-Szu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded leadframe substrate semiconductor package
- Patent number 9,899,208
- Issue date Feb 20, 2018
- UTAC Thai Limited
- Somchai Nondhasitthichai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with Pillar-Top-Interconnection (PTI) configu...
- Patent number 9,825,005
- Issue date Nov 21, 2017
- Powertech Technology Inc.
- Yun-Hsin Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit substrate and package structure
- Patent number 9,786,588
- Issue date Oct 10, 2017
- VIA ALLIANCE SEMICONDUCTOR CO., LTD.
- Chen-Yueh Kung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with sidewall-protected RDL interposer
- Patent number 9,786,514
- Issue date Oct 10, 2017
- Micron Technology, Inc.
- Shing-Yih Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged device with additive substrate surface modification
- Patent number 9,780,017
- Issue date Oct 3, 2017
- Texas Instruments Incorporated
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip cavity package
- Patent number 9,761,435
- Issue date Sep 12, 2017
- UTAC Thai Limited
- Saravuth Sirinorakul
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package with corner supports
- Patent number 9,721,906
- Issue date Aug 1, 2017
- Intel Corporation
- Manish Dubey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded leadframe substrate semiconductor package
- Patent number 9,711,343
- Issue date Jul 18, 2017
- UTAC THAI LIMITED
- Somchai Nondhasitthichai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of transferring and electrically joining a high density mult...
- Patent number 9,691,698
- Issue date Jun 27, 2017
- Harris Corporation
- Michael Raymond Weatherspoon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multichip modules and methods of fabrication
- Patent number 9,666,559
- Issue date May 30, 2017
- Invensas Corporation
- Liang Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device
- Patent number 9,659,906
- Issue date May 23, 2017
- Renesas Electronics Corporation
- Youichi Abe
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING
- Publication number 20240387184
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yan-Yu CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED INTERCONNECT BRIDGE WITH INDUCTOR FOR POWER DELIVERY
- Publication number 20240339412
- Publication date Oct 10, 2024
- Intel Corporation
- Cary KULIASHA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OFFSET INTERPOSERS FOR LARGE-BOTTOM PACKAGES AND LARGE-DIE PACKAGE-...
- Publication number 20240222350
- Publication date Jul 4, 2024
- Intel Corporation
- Russell K. MORTENSEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR ELECTROLESS SURFACE FINISHING ON GLASS
- Publication number 20240194548
- Publication date Jun 13, 2024
- Intel Corporation
- Kristof Darmawikarta
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
HYBRID BONDING OF A THIN SEMICONDUCTOR DIE
- Publication number 20240170442
- Publication date May 23, 2024
- ASMPT Singapore Pte. Ltd.
- Yiu Ming CHEUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240170437
- Publication date May 23, 2024
- Advanced Semiconductor Engineering, Inc.
- Chun Fu KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDISTRIBUTION LAYERS IN A DIELECTRIC CAVITY TO ENABLE AN EMBEDDED...
- Publication number 20240170351
- Publication date May 23, 2024
- Intel Corporation
- Jeremy D. Ecton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONFORMABLE DIE BOND FILM (DBF) IN GLASS CAVITY
- Publication number 20240063127
- Publication date Feb 22, 2024
- Intel Corporation
- Jeremy D. ECTON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH A POROUS AIR VENT
- Publication number 20240063067
- Publication date Feb 22, 2024
- Micron Technology, Inc.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OFFSET INTERPOSERS FOR LARGE-BOTTOM PACKAGES AND LARGE-DIE PACKAGE-...
- Publication number 20240006401
- Publication date Jan 4, 2024
- Intel Corporation
- Russell K. MORTENSEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING REINFORCING BLOCKS
- Publication number 20230402361
- Publication date Dec 14, 2023
- Western Digital Technologies, Inc.
- Shenghua Huang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
COMPUTING DEVICE AND ELECTRONIC DEVICE GUARANTEEING BANDWIDTH PER C...
- Publication number 20230369171
- Publication date Nov 16, 2023
- Samsung Electronics Co., Ltd.
- Young Jun HONG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ELECTRICAL INTERCONNECT BRIDGE
- Publication number 20230361043
- Publication date Nov 9, 2023
- Intel Corporation
- Srinivas V. Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-BANDWIDTH PACKAGE-ON-PACKAGE STRUCTURE
- Publication number 20230282626
- Publication date Sep 7, 2023
- MEDIATEK INC.
- Tai-Yu CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20230260866
- Publication date Aug 17, 2023
- MEDIATEK INC.
- Yin-Fa CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230260887
- Publication date Aug 17, 2023
- Samsung Electronics Co., Ltd.
- Se-Ho YOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPUTING DEVICE AND ELECTRONIC DEVICE GUARANTEEING BANDWIDTH PER C...
- Publication number 20230253294
- Publication date Aug 10, 2023
- Samsung Electronics Co., Ltd.
- Wonyong LEE
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20230215816
- Publication date Jul 6, 2023
- Advanced Semiconductor Engineering, Inc.
- Cheng-Yuan KUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR COMPRISING REDISTRIBUTION STRUCTURE, AND METHOD FOR M...
- Publication number 20230128862
- Publication date Apr 27, 2023
- NEPES CO., LTD.
- Yong Tae KWON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OFFSET INTERPOSERS FOR LARGE-BOTTOM PACKAGES AND LARGE-DIE PACKAGE-...
- Publication number 20220344318
- Publication date Oct 27, 2022
- Intel Corporation
- Russell K. MORTENSEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGING STRUCTURE, METHOD, DEVICE AND ELECTRONIC PR...
- Publication number 20220320028
- Publication date Oct 6, 2022
- Yibu Semiconductor Co., Ltd.
- Weiping LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED BRIDGE ARCHITECTURE WITH THINNED SURFACE
- Publication number 20220310518
- Publication date Sep 29, 2022
- Intel Corporation
- Haobo CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEMPORARY BONDING AND DEBONDING PROCESS TO PREVENT DEFORMATION OF M...
- Publication number 20220262755
- Publication date Aug 18, 2022
- Brewer Science, Inc.
- Chia-Hsin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OFFSET INTERPOSERS FOR LARGE-BOTTOM PACKAGES AND LARGE-DIE PACKAGE-...
- Publication number 20220157799
- Publication date May 19, 2022
- Intel Corporation
- Russell K. MORTENSEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A CHIP PACKAGE AND CHIP PACKAGE
- Publication number 20220108974
- Publication date Apr 7, 2022
- Thorsten Scharf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP-STACK STRUCTURE
- Publication number 20210057368
- Publication date Feb 25, 2021
- United Microelectronics Corp.
- Ming-Tse Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL INTERCONNECT BRIDGE
- Publication number 20200350251
- Publication date Nov 5, 2020
- Intel Corporation
- Srinivas V. Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OFFSET INTERPOSERS FOR LARGE-BOTTOM PACKAGES AND LARGE-DIE PACKAGE-...
- Publication number 20200251462
- Publication date Aug 6, 2020
- Intel Corporation
- Russell Mortensen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD, PRINTED CIRCUIT BOARD, AND ELECTRONIC DEVICE
- Publication number 20200163213
- Publication date May 21, 2020
- Canon Kabushiki Kaisha
- Koji Noguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTICHIP MODULES AND METHODS OF FABRICATION
- Publication number 20190088607
- Publication date Mar 21, 2019
- Invensas Corporation
- Liang Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electrical interconnect bridge

Offset interposers for large-bottom packages and large-die package-...

Offset interposers for large-bottom packages and large-die package-...

Method of forming a chip package and chip package

Offset interposers for large-bottom packages and large-die package-...

Electrical interconnect bridge

Printed wiring board, printed circuit board, and electronic device

Offset interposers for large-bottom packages and large-die package-...

Printed wiring board, printed circuit board, and electronic device

Package structures and method of forming the same

Multichip modules and methods of fabrication

Method of producing a connection support, connection support and op...

Offset interposers for large-bottom packages and large-die package-...

Wiring structure, semiconductor package structure and semiconductor...

Semiconductor device and method of manufacturing semiconductor device

Chip-stack structure

Multichip modules and methods of fabrication

Package structures and method of forming the same

Semiconductor substrate structure, semiconductor package and method...

Molded leadframe substrate semiconductor package

Semiconductor package with Pillar-Top-Interconnection (PTI) configu...

Circuit substrate and package structure

Semiconductor package with sidewall-protected RDL interposer

Packaged device with additive substrate surface modification

Flip chip cavity package

Electronic package with corner supports

Molded leadframe substrate semiconductor package

Method of transferring and electrically joining a high density mult...

Multichip modules and methods of fabrication

Semiconductor device

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING

EMBEDDED INTERCONNECT BRIDGE WITH INDUCTOR FOR POWER DELIVERY

OFFSET INTERPOSERS FOR LARGE-BOTTOM PACKAGES AND LARGE-DIE PACKAGE-...

APPARATUS AND METHOD FOR ELECTROLESS SURFACE FINISHING ON GLASS

HYBRID BONDING OF A THIN SEMICONDUCTOR DIE

PACKAGE STRUCTURE

REDISTRIBUTION LAYERS IN A DIELECTRIC CAVITY TO ENABLE AN EMBEDDED...

CONFORMABLE DIE BOND FILM (DBF) IN GLASS CAVITY

SEMICONDUCTOR DEVICE WITH A POROUS AIR VENT

OFFSET INTERPOSERS FOR LARGE-BOTTOM PACKAGES AND LARGE-DIE PACKAGE-...

SEMICONDUCTOR DEVICE INCLUDING REINFORCING BLOCKS

COMPUTING DEVICE AND ELECTRONIC DEVICE GUARANTEEING BANDWIDTH PER C...

ELECTRICAL INTERCONNECT BRIDGE

HIGH-BANDWIDTH PACKAGE-ON-PACKAGE STRUCTURE

SEMICONDUCTOR PACKAGE STRUCTURE

SEMICONDUCTOR PACKAGE

COMPUTING DEVICE AND ELECTRONIC DEVICE GUARANTEEING BANDWIDTH PER C...

PACKAGE STRUCTURE

SEMICONDUCTOR COMPRISING REDISTRIBUTION STRUCTURE, AND METHOD FOR M...

OFFSET INTERPOSERS FOR LARGE-BOTTOM PACKAGES AND LARGE-DIE PACKAGE-...

SEMICONDUCTOR PACKAGING STRUCTURE, METHOD, DEVICE AND ELECTRONIC PR...

EMBEDDED BRIDGE ARCHITECTURE WITH THINNED SURFACE

TEMPORARY BONDING AND DEBONDING PROCESS TO PREVENT DEFORMATION OF M...

OFFSET INTERPOSERS FOR LARGE-BOTTOM PACKAGES AND LARGE-DIE PACKAGE-...

METHOD OF FORMING A CHIP PACKAGE AND CHIP PACKAGE

CHIP-STACK STRUCTURE

ELECTRICAL INTERCONNECT BRIDGE

OFFSET INTERPOSERS FOR LARGE-BOTTOM PACKAGES AND LARGE-DIE PACKAGE-...

PRINTED WIRING BOARD, PRINTED CIRCUIT BOARD, AND ELECTRONIC DEVICE

MULTICHIP MODULES AND METHODS OF FABRICATION