the bonding area connecting to a bonding area disposed in a recess of the surface of the item

Industry

CPC
H01L2224/08237

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/08237the bonding area connecting to a bonding area disposed in a recess of the surface of the item

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 12,170,259
- Issue date Dec 17, 2024
- Samsung Electronics Co., Ltd.
- Ju Bin Seo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer directly bonded to bonding pads on a plurality of dies
- Patent number 12,165,952
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wen-Shiang Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,119,331
- Issue date Oct 15, 2024
- Samsung Electronics Co., Ltd.
- Ju-Il Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded structures
- Patent number 12,100,684
- Issue date Sep 24, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Liang Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Protective elements for bonded structures
- Patent number 11,848,284
- Issue date Dec 19, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Javier A DeLaCruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having an encapsulant comprising conductive f...
- Patent number 11,842,946
- Issue date Dec 12, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Xinyu Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacturing semiconductor de...
- Patent number 11,742,565
- Issue date Aug 29, 2023
- Amkor Technology Singapore Holding Pte Ltd.
- Kyoung Yeon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Diffusion barrier collar for interconnects
- Patent number 11,694,925
- Issue date Jul 4, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded structures
- Patent number 11,670,615
- Issue date Jun 6, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Liang Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor oxide or glass based connection body with wiring stru...
- Patent number 11,527,468
- Issue date Dec 13, 2022
- Infineon Technologies AG
- Andreas Riegler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for manufacturing an LED-based emissive display device
- Patent number 11,404,401
- Issue date Aug 2, 2022
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Ivan-Christophe Robin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protective elements for bonded structures
- Patent number 11,373,963
- Issue date Jun 28, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Javier A. DeLaCruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacturing semiconductor de...
- Patent number 11,101,540
- Issue date Aug 24, 2021
- Amkor Technology Singapore Holding Pte Ltd.
- Kyoung Yeon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor bonding structure and method of manufacturing the same
- Patent number 11,031,361
- Issue date Jun 8, 2021
- ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- Wen-Long Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Logic drive using standard commodity programmable logic IC chips co...
- Patent number 10,892,011
- Issue date Jan 12, 2021
- iCometrue Company Ltd.
- Mou-Shiung Lin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Bonded structures
- Patent number 10,879,207
- Issue date Dec 29, 2020
- INVENSAS BONDING TECHNOLOGIES, INC.
- Liang Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Increased contact alignment tolerance for direct bonding
- Patent number 10,607,937
- Issue date Mar 31, 2020
- INVENSAS BONDING TECHNOLOGIES, INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and manufacturing method thereof
- Patent number 9,721,911
- Issue date Aug 1, 2017
- Xintec Inc.
- Ho-Yin Yiu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Passive alignment of polymer waveguides
- Patent number 9,671,577
- Issue date Jun 6, 2017
- International Business Machines Corporation
- Roger F. Dangel
- G02 - OPTICS
Information Patent Grant
Small footprint semiconductor package
- Patent number 9,666,557
- Issue date May 30, 2017
- Infineon Technologies AG
- Tian San Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component built-in board and method of manufacturing the same, and...
- Patent number 9,591,767
- Issue date Mar 7, 2017
- Fujikura Ltd.
- Kazuhisa Itoi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for packaging circuits
- Patent number 8,138,617
- Issue date Mar 20, 2012
- Round Rock Research, LLC
- Chia Yong Poo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for packaging circuits
- Patent number 8,115,306
- Issue date Feb 14, 2012
- Round Rock Research, LLC
- Chia Yong Poo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for packaging circuits
- Patent number 7,675,169
- Issue date Mar 9, 2010
- Micron Technology, Inc.
- Chia Yong Poo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating packaged die
- Patent number 7,358,154
- Issue date Apr 15, 2008
- Micron Technology, Inc.
- Chia Yong Poo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for packaging circuits
- Patent number 6,894,386
- Issue date May 17, 2005
- Micron Technology, Inc.
- Chia Yong Poo
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF MAKING
- Publication number 20240379564
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Yi-Chu WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COAXIAL I/O DIE
- Publication number 20240243074
- Publication date Jul 18, 2024
- BAE SYSTEMS INFORMATION AND ELECTRONIC SYSTEMS INTEGRATION INC
- Jeffrey Fitzgerald
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Package With Improved Heat Dissipation Efficienc...
- Publication number 20240222339
- Publication date Jul 4, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuo-Chiang Ting
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURE
- Publication number 20240113056
- Publication date Apr 4, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsing-Kuo Hsia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROTECTIVE ELEMENTS FOR BONDED STRUCTURES
- Publication number 20240096823
- Publication date Mar 21, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Javier A. DeLaCruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP STRUCTURE AND METHOD OF FABRICATING THE SAME
- Publication number 20240088048
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo-Chiang Ting
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240079392
- Publication date Mar 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chuei-Tang WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die Structures and Methods of Forming the Same
- Publication number 20240079391
- Publication date Mar 7, 2024
- Taiwan Semiconductor Mqanufacturing Co., Ltd.
- Chia-Hao Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING AN ENCAPULANT COMPRISING CONDUCTIVE FI...
- Publication number 20240071865
- Publication date Feb 29, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Xinyu Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...
- Publication number 20240047852
- Publication date Feb 8, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Kyoung Yeon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240047443
- Publication date Feb 8, 2024
- Kabushiki Kaisha Toshiba
- Jia LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER CHIP PACKAGE AND POWER MODULE
- Publication number 20240047302
- Publication date Feb 8, 2024
- Ganstronic INC.
- Cheng-Chuan CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE BONDING SYSTEM AND METHOD FOR SUBSTRATE BONDING
- Publication number 20240014153
- Publication date Jan 11, 2024
- TOKYO ELECTRON LIMITED
- Takashi FUJIBAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240006301
- Publication date Jan 4, 2024
- nD-HI Technologies Lab, Inc.
- Ho-Ming TONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING SEMICONDUCTOR PACKAGE
- Publication number 20230361048
- Publication date Nov 9, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Ming Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIFFUSION BARRIER COLLAR FOR INTERCONNECTS
- Publication number 20230360968
- Publication date Nov 9, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED STRUCTURES
- Publication number 20230361072
- Publication date Nov 9, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Liang Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR PACKAGES AND MANUFACTURING METHOD OF THE SAME
- Publication number 20230260872
- Publication date Aug 17, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Shiang Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method
- Publication number 20230260941
- Publication date Aug 17, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Chia Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING THE SAME
- Publication number 20230101002
- Publication date Mar 30, 2023
- KIOXIA Corporation
- Gen TOYOTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR LIGHT-EMITTING ELEMENT TRANSFERRING AND DISPLAY PANEL
- Publication number 20230061742
- Publication date Mar 2, 2023
- CHONGQING KONKA PHOTOELECTRIC TECHNOLOGY RESEARCH INSTITUTE CO., LTD.
- Fei PAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package and Method of Manufacture
- Publication number 20220310480
- Publication date Sep 29, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Xinyu Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROTECTIVE ELEMENTS FOR BONDED STRUCTURES
- Publication number 20220302048
- Publication date Sep 22, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Javier A. DeLaCruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...
- Publication number 20210376451
- Publication date Dec 2, 2021
- Amkor Technology Singapore Holding Pte. Ltd.
- Kyoung Yeon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED STRUCTURES
- Publication number 20210202428
- Publication date Jul 1, 2021
- INVENSAS BONDING TECHNOLOGIES, INC.
- Liang Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...
- Publication number 20210104809
- Publication date Apr 8, 2021
- Amkor Technology Singapore Holding Pte. Ltd.
- Kyoung Yeon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210035933
- Publication date Feb 4, 2021
- Advanced Semiconductor Engineering, Inc.
- Wen-Long LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROTECTIVE ELEMENTS FOR BONDED STRUCTURES
- Publication number 20200328164
- Publication date Oct 15, 2020
- INVENSAS BONDING TECHNOLOGIES, INC.
- Javier A. DeLaCruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS FOR MANUFACTURING AN LED-BASED EMISSIVE DISPLAY DEVICE
- Publication number 20200303359
- Publication date Sep 24, 2020
- Commissariat a I'Energie Atomique et aux Energies Alternatives
- Ivan-Christophe Robin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Oxide or Glass Based Connection Body with Wiring Stru...
- Publication number 20200091058
- Publication date Mar 19, 2020
- INFINEON TECHNOLOGIES AG
- Andreas Riegler
- H01 - BASIC ELECTRIC ELEMENTS

the bonding area connecting to a bonding area disposed in a recess of the surface of the item

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor package and method of fabricating the same

Interposer directly bonded to bonding pads on a plurality of dies

Semiconductor package

Bonded structures

Protective elements for bonded structures

Semiconductor package having an encapsulant comprising conductive f...

Semiconductor devices and methods of manufacturing semiconductor de...

Diffusion barrier collar for interconnects

Bonded structures

Semiconductor oxide or glass based connection body with wiring stru...

Process for manufacturing an LED-based emissive display device

Protective elements for bonded structures

Semiconductor devices and methods of manufacturing semiconductor de...

Semiconductor bonding structure and method of manufacturing the same

Logic drive using standard commodity programmable logic IC chips co...

Bonded structures

Increased contact alignment tolerance for direct bonding

Chip package and manufacturing method thereof

Passive alignment of polymer waveguides

Small footprint semiconductor package

Component built-in board and method of manufacturing the same, and...

Apparatus and method for packaging circuits

Apparatus and method for packaging circuits

Apparatus and method for packaging circuits

Method for fabricating packaged die

Apparatus and method for packaging circuits

Patents Applicationslast 30 patents

SEMICONDUCTOR STRUCTURE AND METHOD OF MAKING

COAXIAL I/O DIE

Integrated Circuit Package With Improved Heat Dissipation Efficienc...

SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURE

PROTECTIVE ELEMENTS FOR BONDED STRUCTURES

CHIP STRUCTURE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

Die Structures and Methods of Forming the Same

SEMICONDUCTOR PACKAGE HAVING AN ENCAPULANT COMPRISING CONDUCTIVE FI...

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...

SEMICONDUCTOR DEVICE

POWER CHIP PACKAGE AND POWER MODULE

SUBSTRATE BONDING SYSTEM AND METHOD FOR SUBSTRATE BONDING

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING SEMICONDUCTOR PACKAGE

DIFFUSION BARRIER COLLAR FOR INTERCONNECTS

BONDED STRUCTURES

SEMICONDUCTOR PACKAGES AND MANUFACTURING METHOD OF THE SAME

Semiconductor Device and Method

SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING THE SAME

METHOD FOR LIGHT-EMITTING ELEMENT TRANSFERRING AND DISPLAY PANEL

Semiconductor Package and Method of Manufacture

PROTECTIVE ELEMENTS FOR BONDED STRUCTURES

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...

BONDED STRUCTURES

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...

SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME

PROTECTIVE ELEMENTS FOR BONDED STRUCTURES

PROCESS FOR MANUFACTURING AN LED-BASED EMISSIVE DISPLAY DEVICE

Semiconductor Oxide or Glass Based Connection Body with Wiring Stru...