the bump connector not being orthogonal to the surface

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H01L2224/16108

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/16108the bump connector not being orthogonal to the surface

Industries

Patents Grantslast 30 patents

Information Patent Grant
Structures and methods for electrically connecting printed components
- Patent number 11,527,691
- Issue date Dec 13, 2022
- X Display Company Technology Limited
- Christopher Andrew Bower
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip stack arrangement and semiconductor chip for pro...
- Patent number 11,367,709
- Issue date Jun 21, 2022
- PAC Tech-Packaging Technologies GmbH
- Matthias Fettke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and device for producing and filling containers
- Patent number 11,345,073
- Issue date May 31, 2022
- KHS GmbH
- Ludwig Clüsserath
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Structures and methods for electrically connecting printed components
- Patent number 11,101,417
- Issue date Aug 24, 2021
- X Display Company Technology Limited
- Christopher Andrew Bower
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photodetector-arrays and methods of fabrication thereof
- Patent number 10,644,061
- Issue date May 5, 2020
- Semi-Conductor Devices-An Elbit Systems-Rafael Partnership
- Yoram Karni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic element with bond elements to encapsulation surface
- Patent number 10,008,477
- Issue date Jun 26, 2018
- Invensas Corporation
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor substrate and semiconductor package structure having...
- Patent number 9,978,705
- Issue date May 22, 2018
- Advanced Semiconductor Engineering, Inc.
- Guo-Cheng Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip assembly and method for manufacturing the same
- Patent number 9,685,423
- Issue date Jun 20, 2017
- PAC Tech-Packaging Technologies GmbH
- Ghassem Azdasht
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated circuit packaging system with chip stacking and method o...
- Patent number 9,530,753
- Issue date Dec 27, 2016
- STATS ChipPAC Pte. Ltd.
- DaeSup Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Submount, encapsulated semiconductor element, and methods of manufa...
- Patent number 9,263,411
- Issue date Feb 16, 2016
- Advanced Photonics, Inc.
- Xueliang Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection and assembly of three-dimensional chip packages
- Patent number 8,772,920
- Issue date Jul 8, 2014
- Oracle International Corporation
- Hiren D. Thacker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip-stacked semiconductor package
- Patent number 8,698,300
- Issue date Apr 15, 2014
- Samsung Electronics Co., Ltd.
- Ji-Han Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of interconnecting electronic wafers
- Patent number 8,136,237
- Issue date Mar 20, 2012
- 3D Plus
- Christian Val
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor package including connector disposed in troughhole
- Patent number 7,745,907
- Issue date Jun 29, 2010
- Samsung Electronics Co., Ltd.
- Jong-Ho Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 7,649,250
- Issue date Jan 19, 2010
- Samsung Electronics Co., Ltd.
- Tae-Sung Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component and semiconductor wafer, and method for produc...
- Patent number 7,420,262
- Issue date Sep 2, 2008
- Infineon Technologies AG
- Michael Bauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting electronic components
- Patent number 7,063,797
- Issue date Jun 20, 2006
- STMicroelectronics Ltd.
- Brian Laffoley
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of mounting an electrical component to a support
- Patent number 6,722,029
- Issue date Apr 20, 2004
- STMicroelectronics Ltd.
- Brian Laffoley
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for producing a sealing and mechanical strength ring betwee...
- Patent number 6,238,951
- Issue date May 29, 2001
- Commissariat a l'Energie Atomique
- Patrice Caillat
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin seal semiconductor package and manufacturing method of the same
- Patent number 6,191,493
- Issue date Feb 20, 2001
- Mitsubishi Denki Kabushiki Kaisha
- Masatoshi Yasunaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor chip package having external terminal pads an...
- Patent number 6,188,129
- Issue date Feb 13, 2001
- Hyundai Electronics Industries Co., Ltd.
- Kyung Wook Paik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic packaging using arched solder columns
- Patent number 5,963,793
- Issue date Oct 5, 1999
- MCNC
- Glenn A. Rinne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin seal semiconductor package and manufacturing method of the same
- Patent number 5,920,770
- Issue date Jul 6, 1999
- Mitsubishi Denki Kabushiki Kaisha
- Masatoshi Yasunaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic packaging using arched solder columns
- Patent number 5,793,116
- Issue date Aug 11, 1998
- MCNC
- Glenn A. Rinne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin seal semiconductor package
- Patent number 5,753,973
- Issue date May 19, 1998
- Mitsubishi Denki Kabushiki Kaisha
- Masatoshi Yasunaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin seal semiconductor package
- Patent number 5,656,863
- Issue date Aug 12, 1997
- Mitsubishi Denki Kabushiki Kaisha
- Masatoshi Yasunaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of bonding wafers having vias including conductive material
- Patent number 5,646,067
- Issue date Jul 8, 1997
- Harris Corporation
- Stephen Joseph Gaul
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device
- Patent number 5,533,664
- Issue date Jul 9, 1996
- Kabushiki Kaisha Toshiba
- Mamoru Sasaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High density memory module
- Patent number 5,313,097
- Issue date May 17, 1994
- International Business Machines, Corp.
- Javad Haj-Ali-Ahmadi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20240047446
- Publication date Feb 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Mao-Yen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURES AND METHODS FOR ELECTRICALLY CONNECTING PRINTED COMPONENTS
- Publication number 20210336114
- Publication date Oct 28, 2021
- X Display Company Technology Limited
- Christopher Andrew Bower
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP STACK ARRANGEMENT AND SEMICONDUCTOR CHIP FOR PRO...
- Publication number 20210193619
- Publication date Jun 24, 2021
- Pac Tech - Packaging Technologies GmbH
- Matthias Fettke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Chip Assembly and Method for Manufacturing the Same
- Publication number 20150364446
- Publication date Dec 17, 2015
- Pac Tech - Packaging Technologies GmbH
- Ghassem Azdasht
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-LEVEL DEVICE PACKAGING
- Publication number 20140021596
- Publication date Jan 23, 2014
- Hong Kong Applied Science and Technology Research Institute Company Limited
- Yat Kit Tsui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH CHIP STACKING AND METHOD O...
- Publication number 20130075915
- Publication date Mar 28, 2013
- DaeSup Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTION AND ASSEMBLY OF THREE-DIMENSIONAL CHIP PACKAGES
- Publication number 20130015578
- Publication date Jan 17, 2013
- Oracle International Corporation
- Hiren D. Thacker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP-STACKED SEMICONDUCTOR PACKAGE
- Publication number 20130009304
- Publication date Jan 10, 2013
- Samsung Electronics Co., Ltd.
- Ji-han Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20120319289
- Publication date Dec 20, 2012
- Shinko Electric Industries Co., Ltd.
- Kenichi MORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING FOR INTERCONNECTION BETWEEN INTERPOSER AND FLIP CHIP DIE
- Publication number 20120199960
- Publication date Aug 9, 2012
- TEXAS INSTRUMENTS INCORPORATED
- GLENN ENRICK CALDERON COSUE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Composite Underfill and Semiconductor Package
- Publication number 20100295173
- Publication date Nov 25, 2010
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hui-Lin Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF INTERCONNECTING ELECTRONIC WAFERS
- Publication number 20100276081
- Publication date Nov 4, 2010
- 3D PLUS
- Christian Val
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE
- Publication number 20100136747
- Publication date Jun 3, 2010
- SAMSUNG ELECTRONICS CO., LTD.
- Tae-Sung PARK
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20080111229
- Publication date May 15, 2008
- Samsung Electronics Co., Ltd.
- Tae-Sung PARK
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BGA SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20070296067
- Publication date Dec 27, 2007
- Samsung Electronics Co., Ltd.
- Jong-Ho LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Three-dimensional integrated circuit with integrated heat sinks
- Publication number 20050104027
- Publication date May 19, 2005
- Pavel I. Lazarev
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic component and semiconductor wafer, and method for produc...
- Publication number 20040207049
- Publication date Oct 21, 2004
- Infineon Technologies AG
- Michael Bauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Mounting electronic components
- Publication number 20040203237
- Publication date Oct 14, 2004
- STMICROELECTRONICS LTD.
- Brian Laffoley
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Mounting electronic components
- Publication number 20020040810
- Publication date Apr 11, 2002
- STMicroelectronics Ltd
- Brian Laffoley
- H01 - BASIC ELECTRIC ELEMENTS

the bump connector not being orthogonal to the surface

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Structures and methods for electrically connecting printed components

Semiconductor chip stack arrangement and semiconductor chip for pro...

Method and device for producing and filling containers

Structures and methods for electrically connecting printed components

Photodetector-arrays and methods of fabrication thereof

Microelectronic element with bond elements to encapsulation surface

Semiconductor substrate and semiconductor package structure having...

Semiconductor chip assembly and method for manufacturing the same

Integrated circuit packaging system with chip stacking and method o...

Submount, encapsulated semiconductor element, and methods of manufa...

Interconnection and assembly of three-dimensional chip packages

Chip-stacked semiconductor package

Method of interconnecting electronic wafers

Semiconductor package including connector disposed in troughhole

Semiconductor package

Electronic component and semiconductor wafer, and method for produc...

Mounting electronic components

Method of mounting an electrical component to a support

Process for producing a sealing and mechanical strength ring betwee...

Resin seal semiconductor package and manufacturing method of the same

Stacked semiconductor chip package having external terminal pads an...

Microelectronic packaging using arched solder columns

Resin seal semiconductor package and manufacturing method of the same

Microelectronic packaging using arched solder columns

Resin seal semiconductor package

Resin seal semiconductor package

Method of bonding wafers having vias including conductive material

Method of manufacturing a semiconductor device

High density memory module

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD OF THE SAME

STRUCTURES AND METHODS FOR ELECTRICALLY CONNECTING PRINTED COMPONENTS

SEMICONDUCTOR CHIP STACK ARRANGEMENT AND SEMICONDUCTOR CHIP FOR PRO...

Semiconductor Chip Assembly and Method for Manufacturing the Same

WAFER-LEVEL DEVICE PACKAGING

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH CHIP STACKING AND METHOD O...

INTERCONNECTION AND ASSEMBLY OF THREE-DIMENSIONAL CHIP PACKAGES

CHIP-STACKED SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

WIRE BONDING FOR INTERCONNECTION BETWEEN INTERPOSER AND FLIP CHIP DIE

Composite Underfill and Semiconductor Package

METHOD OF INTERCONNECTING ELECTRONIC WAFERS

METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

BGA SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

Three-dimensional integrated circuit with integrated heat sinks

Electronic component and semiconductor wafer, and method for produc...

Mounting electronic components

Mounting electronic components