the external layer being disposed on a via connection of the semiconductor or solid-state body

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/0557the external layer being disposed on a via connection of the semiconductor or solid-state body

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Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing die stack structure
- Patent number 12,322,728
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ching-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electroplated indium bump stacks for cryogenic electronics
- Patent number 12,315,834
- Issue date May 27, 2025
- Microsoft Technology Licensing, LLC
- Christopher Cantaloube
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-insulator-metal capacitor within metallization structure
- Patent number 12,315,791
- Issue date May 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chi-Han Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Via structure for semiconductor dies
- Patent number 12,308,331
- Issue date May 20, 2025
- Cirrus Logic Inc.
- Yaoyu Pang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside contact for thermal displacement in a multi-wafer stacked...
- Patent number 12,300,669
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ping-Tzu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid bond pad structure
- Patent number 12,300,670
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sin-Yao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connector and method for forming the same
- Patent number 12,300,645
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 12,300,667
- Issue date May 13, 2025
- Samsung Electronics Co., Ltd.
- YeongBeom Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Moat coverage with dielectric film for device passivation and singu...
- Patent number 12,300,548
- Issue date May 13, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Mark Anand Thomas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display panel and manufacturing method thereof, and electronic term...
- Patent number 12,300,705
- Issue date May 13, 2025
- SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD.
- Zhuhui Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for protecting an optoelectronic device against electrostati...
- Patent number 12,300,521
- Issue date May 13, 2025
- Aledia
- Frédéric Mayer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of forming same
- Patent number 12,293,991
- Issue date May 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D chip sharing data bus
- Patent number 12,293,993
- Issue date May 6, 2025
- Adeia Semiconductor Inc.
- Javier A. Delacruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display panel including driving backplane
- Patent number 12,295,172
- Issue date May 6, 2025
- WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD.
- Can Huang
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Display device
- Patent number 12,295,225
- Issue date May 6, 2025
- Samsung Display Co., Ltd.
- Chungi You
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display panel
- Patent number 12,289,921
- Issue date Apr 29, 2025
- Au Optronics Corporation
- I-Peng Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polyimide profile control
- Patent number 12,288,758
- Issue date Apr 29, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Chi Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including re-distribution pads disposed at dif...
- Patent number 12,288,761
- Issue date Apr 29, 2025
- SK Hynix Inc.
- Jun Yong Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device
- Patent number 12,288,777
- Issue date Apr 29, 2025
- Japan Display Inc.
- Yoshinori Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages
- Patent number 12,283,555
- Issue date Apr 22, 2025
- Analog Devices International Unlimited Company
- Bilge Bayrakci
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device and manufacturing method therefor
- Patent number 12,278,320
- Issue date Apr 15, 2025
- Stanley Electric Co., Ltd.
- Yoshiaki Yasuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices including recognition marks
- Patent number 12,278,193
- Issue date Apr 15, 2025
- SK hynix Inc.
- Hyun Chul Seo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive bump of a semiconductor device and fabricating method th...
- Patent number 12,278,199
- Issue date Apr 15, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chang-Pin Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device
- Patent number 12,272,676
- Issue date Apr 8, 2025
- Kioxia Corporation
- Masayoshi Tagami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device
- Patent number 12,272,296
- Issue date Apr 8, 2025
- Samsung Display Co., Ltd.
- Hyun Joon Kim
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Thermal structure for semiconductor device and method of forming th...
- Patent number 12,272,613
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wei-Ming Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Top hat structure for isolation capacitors
- Patent number 12,272,633
- Issue date Apr 8, 2025
- Skyworks Solutions, Inc.
- Thomas C. Fowler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate bonding method
- Patent number 12,266,623
- Issue date Apr 1, 2025
- SHENZHEN XIUYUAN ELECTRONIC TECHNOLOGY CO., LTD
- Yunzhi Ling
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display panel, method of manufacturing display panel, and display d...
- Patent number 12,266,621
- Issue date Apr 1, 2025
- TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Jinming Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating semiconductor package
- Patent number 12,266,639
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hao-Yi Tsai
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Die Connection System and Method
- Publication number 20250174591
- Publication date May 29, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250174584
- Publication date May 29, 2025
- Samsung Electronics Co., Ltd.
- Youngja KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked Semiconductor Device Assembly in Computer System
- Publication number 20250165420
- Publication date May 22, 2025
- Rambus Inc.
- Scott C. Best
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
VIAS WITH SELECTED GRAIN DISTRIBUTION
- Publication number 20250167046
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Pang Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICE OBTAINED BY 3D INTEGRATION AND CORRESPONDING...
- Publication number 20250167157
- Publication date May 22, 2025
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Pablo RENAUD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250167090
- Publication date May 22, 2025
- Samsung Electronics Co., Ltd.
- Duckgyu KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250157958
- Publication date May 15, 2025
- Samsung Electronics Co., Ltd.
- Jongkook KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PAD OVER ACTIVE SENSOR CELLS INTEGRATED IN A CHIP PACKAGE
- Publication number 20250160219
- Publication date May 15, 2025
- INFINEON TECHNOLOGIES AG
- Walter HARTNER
- G01 - MEASURING TESTING
Information Patent Application
MICROELECTRONIC ASSEMBLIES HAVING TOPSIDE POWER DELIVERY STRUCTURES
- Publication number 20250157941
- Publication date May 15, 2025
- Intel Corporation
- Bernd Waidhas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHIELD STRUCTURE FOR BACKSIDE THROUGH SUBSTRATE VIAS (TSVS)
- Publication number 20250149407
- Publication date May 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY SUBSTRATE, TILED DISPLAY PANEL AND DISPLAY DEVICE
- Publication number 20250149522
- Publication date May 8, 2025
- BOE TECHNOLOGY GROUP CO., LTD.
- Wei Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGES WITH ISOLATED DIES
- Publication number 20250140624
- Publication date May 1, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Hau NGUYEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20250132224
- Publication date Apr 24, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Jung Chul GONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20250132278
- Publication date Apr 24, 2025
- Advanced Semiconductor Engineering, Inc.
- Chih-Jing HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250132294
- Publication date Apr 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250132276
- Publication date Apr 24, 2025
- KIOXIA Corporation
- Masayoshi TAGAMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE
- Publication number 20250132260
- Publication date Apr 24, 2025
- Ping-Jung Yang
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
SACRIFICIAL TEST PAD
- Publication number 20250132208
- Publication date Apr 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Ting Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D CHIP PACKAGE BASED ON VERTICAL-THROUGH-VIA CONNECTOR
- Publication number 20250125241
- Publication date Apr 17, 2025
- iCometrue Company Ltd.
- Ping-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE FOR SEMICONDUCTOR PACKAGE COMPRISING CONNECTING STRUCURE AND...
- Publication number 20250125290
- Publication date Apr 17, 2025
- Samsung Electronics Co., Ltd.
- HYUNSU HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Including Via Structure And Method For Manufac...
- Publication number 20250125225
- Publication date Apr 17, 2025
- Samsung Electronics Co., Ltd.
- Yeonjin LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED STRUCTURES WITH INTEGRATED PASSIVE COMPONENT
- Publication number 20250125248
- Publication date Apr 17, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250118714
- Publication date Apr 10, 2025
- Samsung Electronics Co., Ltd.
- Keumhee Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20250118612
- Publication date Apr 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIELECTRIC STRUCTURE FOR HIGH SPEED INTERCONNECT AND RELIABILITY EN...
- Publication number 20250118690
- Publication date Apr 10, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wen-Yi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUPERHYDROPHOBIC SURFACES FOR LIQUID CONTAINMENT IN SELF-ALIGNMENT...
- Publication number 20250112185
- Publication date Apr 3, 2025
- Intel Corporation
- Thomas Sounart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FINE-GRAIN INTEGRATION OF RADIO FREQUENCY ANTENNAS, INTERCONNECTS,...
- Publication number 20250112188
- Publication date Apr 3, 2025
- Intel Corporation
- Georgios C. Dogiamis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT DIE-TWO-DIE CONNECTION THROUGH AN INTERPOSER WITHOUT VIAS
- Publication number 20250112191
- Publication date Apr 3, 2025
- Intel Corporation
- Thomas WAGNER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE AND METHODS OF FORMATION
- Publication number 20250112183
- Publication date Apr 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- CHERN-YOW HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH SUBSTRATE VIA STRUCTURES AND PROCESSES
- Publication number 20250112123
- Publication date Apr 3, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS

the external layer being disposed on a via connection of the semiconductor or solid-state body

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method of manufacturing die stack structure

Electroplated indium bump stacks for cryogenic electronics

Metal-insulator-metal capacitor within metallization structure

Via structure for semiconductor dies

Backside contact for thermal displacement in a multi-wafer stacked...

Hybrid bond pad structure

Connector and method for forming the same

Semiconductor package and method of fabricating the same

Moat coverage with dielectric film for device passivation and singu...

Display panel and manufacturing method thereof, and electronic term...

Method for protecting an optoelectronic device against electrostati...

Semiconductor packages and methods of forming same

3D chip sharing data bus

Display panel including driving backplane

Display device

Display panel

Polyimide profile control

Semiconductor device including re-distribution pads disposed at dif...

Display device

Semiconductor packages

Light emitting device and manufacturing method therefor

Semiconductor devices including recognition marks

Conductive bump of a semiconductor device and fabricating method th...

Memory device

Display device

Thermal structure for semiconductor device and method of forming th...

Top hat structure for isolation capacitors

Substrate bonding method

Display panel, method of manufacturing display panel, and display d...

Method of fabricating semiconductor package

Patents Applicationslast 30 patents

Semiconductor Die Connection System and Method

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

Stacked Semiconductor Device Assembly in Computer System

VIAS WITH SELECTED GRAIN DISTRIBUTION

MICROELECTRONIC DEVICE OBTAINED BY 3D INTEGRATION AND CORRESPONDING...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

PAD OVER ACTIVE SENSOR CELLS INTEGRATED IN A CHIP PACKAGE

MICROELECTRONIC ASSEMBLIES HAVING TOPSIDE POWER DELIVERY STRUCTURES

SHIELD STRUCTURE FOR BACKSIDE THROUGH SUBSTRATE VIAS (TSVS)

DISPLAY SUBSTRATE, TILED DISPLAY PANEL AND DISPLAY DEVICE

PACKAGES WITH ISOLATED DIES

PRINTED CIRCUIT BOARD

ELECTRONIC DEVICE

PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE

CHIP PACKAGE

SACRIFICIAL TEST PAD

3D CHIP PACKAGE BASED ON VERTICAL-THROUGH-VIA CONNECTOR

DEVICE FOR SEMICONDUCTOR PACKAGE COMPRISING CONNECTING STRUCURE AND...

Semiconductor Device Including Via Structure And Method For Manufac...

BONDED STRUCTURES WITH INTEGRATED PASSIVE COMPONENT

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

DIELECTRIC STRUCTURE FOR HIGH SPEED INTERCONNECT AND RELIABILITY EN...

SUPERHYDROPHOBIC SURFACES FOR LIQUID CONTAINMENT IN SELF-ALIGNMENT...

FINE-GRAIN INTEGRATION OF RADIO FREQUENCY ANTENNAS, INTERCONNECTS,...

DIRECT DIE-TWO-DIE CONNECTION THROUGH AN INTERPOSER WITHOUT VIAS

SEMICONDUCTOR DIE AND METHODS OF FORMATION

THROUGH SUBSTRATE VIA STRUCTURES AND PROCESSES