the layer connector connecting to a via connection in the semiconductor or solid-state body

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H01L2224/32146

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/32146the layer connector connecting to a via connection in the semiconductor or solid-state body

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package including package seal ring and methods for f...
- Patent number 12,125,761
- Issue date Oct 22, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low pressure sintering powder
- Patent number 12,113,039
- Issue date Oct 8, 2024
- Alpha Assembly Solutions Inc.
- Shamik Ghoshal
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Package structure comprising thermally conductive layer around the...
- Patent number 12,033,963
- Issue date Jul 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor device test circuits and methods of use
- Patent number 11,935,798
- Issue date Mar 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integration of three-dimensional NAND memory devices with multiple...
- Patent number 11,923,339
- Issue date Mar 5, 2024
- Yangtze Memory Technologies Co., Ltd.
- Jun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked integrated circuits with redistribution lines
- Patent number 11,923,338
- Issue date Mar 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Ying Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded assembly including inter-die via structures and methods for...
- Patent number 11,869,877
- Issue date Jan 9, 2024
- SanDisk Technologies LLC
- Lin Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 11,756,934
- Issue date Sep 12, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Liang Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 11,756,920
- Issue date Sep 12, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die orifices containing metallic nanowires
- Patent number 11,728,242
- Issue date Aug 15, 2023
- Texas Instruments Incorporated
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 11,569,149
- Issue date Jan 31, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Chih-Cheng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip interconnection structure, wafer interconnection structure and...
- Patent number 11,164,840
- Issue date Nov 2, 2021
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Hongsheng Yi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures and methods for reliable packages
- Patent number 11,056,390
- Issue date Jul 6, 2021
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integration of three-dimensional NAND memory devices with multiple...
- Patent number 11,031,377
- Issue date Jun 8, 2021
- Yangtze Memory Technologies Co., Ltd.
- Jun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low pressure sintering powder
- Patent number 10,998,284
- Issue date May 4, 2021
- Alpha Assembly Solutions Inc.
- Shamik Ghoshal
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 10,811,382
- Issue date Oct 20, 2020
- NANYA TECHNOLOGY CORPORATION
- Pei-Jhen Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package device for power device
- Patent number 10,777,478
- Issue date Sep 15, 2020
- Advanced Semiconductor Engineering, Inc.
- Bernd Karl Appelt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self healing compute array
- Patent number 10,684,929
- Issue date Jun 16, 2020
- Xcelsis Corporation
- Javier A. Delacruz
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
3D microdisplay device and structure
- Patent number 10,679,977
- Issue date Jun 9, 2020
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated multi-color light-emitting pixel arrays based devices by...
- Patent number 10,636,838
- Issue date Apr 28, 2020
- Shaoher Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked integrated circuits with redistribution lines
- Patent number 10,629,568
- Issue date Apr 21, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Ying Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Advanced through substrate via metallization in three dimensional s...
- Patent number 10,396,013
- Issue date Aug 27, 2019
- International Business Machines Corporation
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Advanced through substrate via metallization in three dimensional s...
- Patent number 10,396,012
- Issue date Aug 27, 2019
- International Business Machines Corporation
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated multi-color light-emitting pixel arrays based devices by...
- Patent number 10,325,894
- Issue date Jun 18, 2019
- Shaoher Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked integrated circuits with redistribution lines
- Patent number 10,269,768
- Issue date Apr 23, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Ying Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device for electrically coupling a plurality of semiconductor devic...
- Patent number 10,257,937
- Issue date Apr 9, 2019
- Infineon Technologies Austria AG
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package device and method of manufacturing the same
- Patent number 10,186,467
- Issue date Jan 22, 2019
- Advanced Semiconductor Engineering, Inc.
- Bernd Karl Appelt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser assisted transfer welding process
- Patent number 10,181,483
- Issue date Jan 15, 2019
- Etienne Menard
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Vertically stacked wafers and methods of forming same
- Patent number 10,163,864
- Issue date Dec 25, 2018
- GLOBALFOUNDRIES Inc.
- Luke G. England
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite wafer semiconductor devices using offset via arrangements...
- Patent number 9,780,136
- Issue date Oct 3, 2017
- Samsung Electronics Co., Ltd.
- Doowon Kwon
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Patents Applicationslast 30 patents

Information Patent Application
Decoupling Capacitor Structures And Assemblies
- Publication number 20240429157
- Publication date Dec 26, 2024
- KYOCERA AVX Components Corporation
- Laurent Desclos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW PRESSURE SINTERING POWDER
- Publication number 20240413117
- Publication date Dec 12, 2024
- Alpha Assembly Solutions Inc.
- Shamik Ghoshal
- B22 - CASTING POWDER METALLURGY
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20240413026
- Publication date Dec 12, 2024
- Samsung Electronics Co., Ltd.
- Yeongbeom KO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE WITH SUBSTRATES AND METHOD FOR FORMING THE SAME
- Publication number 20240355771
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chuei-Tang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED PACKAGE DEVICE, FABRICATION METHOD THEREOF AND MEMORY SY...
- Publication number 20240332152
- Publication date Oct 3, 2024
- Yangtze Memory Technologies Co., Ltd.
- Xinru Zeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE POWER
- Publication number 20240321702
- Publication date Sep 26, 2024
- ADVANCED MICRO DEVICES, INC.
- Yan Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240321673
- Publication date Sep 26, 2024
- Samsung Electronics Co., Ltd.
- Sunggu KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240321786
- Publication date Sep 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURES AND METHOD FOR MANUFACTURING A SEMICONDUCT...
- Publication number 20240312874
- Publication date Sep 19, 2024
- SERIPHY TECHNOLOGY CORPORATION
- TZU-WEI CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-WAFER BONDING FOR NAND SCALING
- Publication number 20240250007
- Publication date Jul 25, 2024
- SANDISK TECHNOLOGIES LLC
- Hiroki Yabe
- G11 - INFORMATION STORAGE
Information Patent Application
CAPACITOR COMPONENT AND SEMICONDUCTOR PACKAGE INCLUDING CAPACITOR C...
- Publication number 20240222263
- Publication date Jul 4, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Jae Hoon KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240222330
- Publication date Jul 4, 2024
- Samsung Electronics Co., Ltd.
- Youngjun YOON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER AMPLIFICATION HIGH-FREQUENCY CIRCUIT DEVICE
- Publication number 20240213189
- Publication date Jun 27, 2024
- Mitsubishi Electric Corporation
- Yuta SUGIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240203854
- Publication date Jun 20, 2024
- Samsung Electronics Co., Ltd.
- Hyeon Jeong HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS FOR FABRICATING THE SAME
- Publication number 20240203855
- Publication date Jun 20, 2024
- Samsung Electronics Co., Ltd.
- Jaemok JUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20240178114
- Publication date May 30, 2024
- Samsung Electronics Co., Ltd.
- KYOUNG LIM SUK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR DEVICE TEST CIRCUITS AND METHODS OF USE
- Publication number 20240178078
- Publication date May 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jen-Yuan CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20240170361
- Publication date May 23, 2024
- ABSOLICS INC.
- Sungjin KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED INTEGRATED CIRCUITS WITH REDISTRIBUTION LINES
- Publication number 20240170457
- Publication date May 23, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Cheng-Ying Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240153855
- Publication date May 9, 2024
- Samsung Electronics Co., Ltd.
- Choongbin Yim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL MODULE AND METHOD OF MANUFACTURING AN ELECTRICAL MODULE
- Publication number 20240145323
- Publication date May 2, 2024
- ROLLS-ROYCE DEUTSCHLAND LTD & CO KG
- Uwe Waltrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIGNAL TRANSMISSION DEVICE
- Publication number 20240128309
- Publication date Apr 18, 2024
- DENSO CORPORATION
- Shuji ASANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND A METHOD FOR MAKING THE SAME
- Publication number 20240120289
- Publication date Apr 11, 2024
- JCET STATS ChipPAC Korea Limited
- SeungHyun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240096851
- Publication date Mar 21, 2024
- Samsung Electronics Co., Ltd.
- Unbyoung Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240079340
- Publication date Mar 7, 2024
- Samsung Electronics Co., Ltd.
- Hyunsoo CHUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240071882
- Publication date Feb 29, 2024
- Samsung Electronics Co., Ltd.
- Seongho SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240055311
- Publication date Feb 15, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yueh-Ting Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240055339
- Publication date Feb 15, 2024
- Samsung Electronics Co., Ltd.
- Hwanjoo Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240055338
- Publication date Feb 15, 2024
- Samsung Electronics Co., Ltd.
- Byungho KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D PACKAGING WITH SILICON DIE AS THERMAL SINK FOR HIGH-POWER LOW TH...
- Publication number 20240047295
- Publication date Feb 8, 2024
- Qorvo US, Inc.
- George Maxim
- H01 - BASIC ELECTRIC ELEMENTS

the layer connector connecting to a via connection in the semiconductor or solid-state body

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor package including package seal ring and methods for f...

Low pressure sintering powder

Package structure comprising thermally conductive layer around the...

Stacked semiconductor device test circuits and methods of use

Integration of three-dimensional NAND memory devices with multiple...

Stacked integrated circuits with redistribution lines

Bonded assembly including inter-die via structures and methods for...

Semiconductor structure and manufacturing method thereof

Semiconductor structure and manufacturing method thereof

Semiconductor die orifices containing metallic nanowires

Semiconductor structure and manufacturing method thereof

Chip interconnection structure, wafer interconnection structure and...

Structures and methods for reliable packages

Integration of three-dimensional NAND memory devices with multiple...

Low pressure sintering powder

Method of manufacturing semiconductor device

Semiconductor package device for power device

Self healing compute array

3D microdisplay device and structure

Integrated multi-color light-emitting pixel arrays based devices by...

Stacked integrated circuits with redistribution lines

Advanced through substrate via metallization in three dimensional s...

Advanced through substrate via metallization in three dimensional s...

Integrated multi-color light-emitting pixel arrays based devices by...

Stacked integrated circuits with redistribution lines

Device for electrically coupling a plurality of semiconductor devic...

Semiconductor package device and method of manufacturing the same

Laser assisted transfer welding process

Vertically stacked wafers and methods of forming same

Composite wafer semiconductor devices using offset via arrangements...

Patents Applicationslast 30 patents

Decoupling Capacitor Structures And Assemblies

LOW PRESSURE SINTERING POWDER

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

CHIP PACKAGE STRUCTURE WITH SUBSTRATES AND METHOD FOR FORMING THE SAME

INTEGRATED PACKAGE DEVICE, FABRICATION METHOD THEREOF AND MEMORY SY...

BACKSIDE POWER

SEMICONDUCTOR PACKAGE

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR STRUCTURES AND METHOD FOR MANUFACTURING A SEMICONDUCT...

MULTI-WAFER BONDING FOR NAND SCALING

CAPACITOR COMPONENT AND SEMICONDUCTOR PACKAGE INCLUDING CAPACITOR C...

SEMICONDUCTOR PACKAGE

POWER AMPLIFICATION HIGH-FREQUENCY CIRCUIT DEVICE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGES AND METHODS FOR FABRICATING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

STACKED SEMICONDUCTOR DEVICE TEST CIRCUITS AND METHODS OF USE

PACKAGING SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

STACKED INTEGRATED CIRCUITS WITH REDISTRIBUTION LINES

SEMICONDUCTOR PACKAGE

ELECTRICAL MODULE AND METHOD OF MANUFACTURING AN ELECTRICAL MODULE

SIGNAL TRANSMISSION DEVICE

ELECTRONIC PACKAGE AND A METHOD FOR MAKING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

3D PACKAGING WITH SILICON DIE AS THERMAL SINK FOR HIGH-POWER LOW TH...