the micromechanical device and the control or processing electronics being separate parts in the same package

Industry

CPC
B81B2207/012

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Parent Industries

BPERFORMING OPERATIONS TRANSPORTING B81Micro-structural technology B81BMICRO-STRUCTURAL DEVICES OR SYSTEMS B81B2207/00Micro-structural systems or auxiliary parts thereof

Current Industry

B81B2207/012the micromechanical device and the control or processing electronics being separate parts in the same package

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package and method for manufacturing the same
- Patent number 11,973,048
- Issue date Apr 30, 2024
- Advanced Semiconductor Engineering, Inc.
- An-Nong Wen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Blood pressure detection device
- Patent number 11,944,412
- Issue date Apr 2, 2024
- Microjet Technology Co., Ltd.
- Hao-Jan Mou
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Systems and methods for providing getters in microelectromechanical...
- Patent number 11,945,713
- Issue date Apr 2, 2024
- Invensense, Inc.
- Daesung Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Signal processing circuit for triple-membrane MEMS device
- Patent number 11,932,533
- Issue date Mar 19, 2024
- Infineon Technologies AG
- Marc Fueldner
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Heat dissipation system with microelectromechanical system (MEMS) f...
- Patent number 11,910,568
- Issue date Feb 20, 2024
- Cisco Technology, Inc.
- Joel Richard Goergen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Ovenized MEMS
- Patent number 11,909,354
- Issue date Feb 20, 2024
- SiTime Corporation
- Carl Arft
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Micromechanical sensor device having an ASIC chip integrated into a...
- Patent number 11,906,383
- Issue date Feb 20, 2024
- Robert Bosch GmbH
- Stefan Pinter
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Capless semiconductor package with a micro-electromechanical system...
- Patent number 11,897,763
- Issue date Feb 13, 2024
- STMicroelectronics, Inc.
- Jefferson Sismundo Talledo
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device and method for forming the same
- Patent number 11,897,759
- Issue date Feb 13, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Po Chen Yeh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Robust method for gyroscope drive amplitude measurement
- Patent number 11,867,509
- Issue date Jan 9, 2024
- Invensense, Inc.
- Damiano Milani
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microelectromechanical system (MEMS) sensor packages and methods fo...
- Patent number 11,851,322
- Issue date Dec 26, 2023
- Infineon Technologies AG
- Rainer Markus Schaller
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Heterogenous integration of complementary metal-oxide-semiconductor...
- Patent number 11,845,653
- Issue date Dec 19, 2023
- MERIDIAN INNOVATION PTE LTD
- Wan Chia Ang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Integrated piezoelectric microelectromechanical ultrasound transduc...
- Patent number 11,847,851
- Issue date Dec 19, 2023
- Invensense, Inc.
- Julius Ming-Lin Tsai
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor package with built-in vibration isolation, thermal st...
- Patent number 11,834,328
- Issue date Dec 5, 2023
- Invensense, Inc.
- Hamid Eslampour
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Piezoelectric anti-stiction structure for microelectromechanical sy...
- Patent number 11,834,325
- Issue date Dec 5, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Fan Hu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Support structure for MEMS device with particle filter
- Patent number 11,807,521
- Issue date Nov 7, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Wen Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Sensor
- Patent number 11,810,863
- Issue date Nov 7, 2023
- TDK TAIWAN CORP.
- An-Ping Tseng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS assembly substrates including a bond layer
- Patent number 11,787,690
- Issue date Oct 17, 2023
- Knowles Electronics, LLC
- Sung Bok Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS device with particle filter and method of manufacture
- Patent number 11,787,689
- Issue date Oct 17, 2023
- TDK Corporation
- Wolfgang Pahl
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS stress reduction structure embedded into package
- Patent number 11,760,627
- Issue date Sep 19, 2023
- Invensense, Inc.
- Roberto Brioschi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Integrated ultrasonic transducers
- Patent number 11,730,451
- Issue date Aug 22, 2023
- EXO IMAGING, INC.
- Janusz Bryzek
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor structures
- Patent number 11,736,866
- Issue date Aug 22, 2023
- Cirrus Logic Inc.
- Rkia Achehboune
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Actuator layer patterning with polysilicon and etch stop layer
- Patent number 11,731,871
- Issue date Aug 22, 2023
- Invensense, Inc.
- Ashfaque Uddin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Packaged environmental sensor
- Patent number 11,718,519
- Issue date Aug 8, 2023
- STMicroelectronics S.r.l.
- Marco Omar Ghidoni
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Packaging method and associated packaging structure
- Patent number 11,713,241
- Issue date Aug 1, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chih-Ming Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Manufacturing method of semiconductor structure
- Patent number 11,708,262
- Issue date Jul 25, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Yi-Hsien Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Robust MEMS microphone
- Patent number 11,696,078
- Issue date Jul 4, 2023
- QUALCOMM Incorporated
- Craig Core
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Sensor and package assembly thereof
- Patent number 11,685,646
- Issue date Jun 27, 2023
- Robert Bosch GmbH
- Ken Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Panel transducer scale package and method of manufacturing the same
- Patent number 11,679,975
- Issue date Jun 20, 2023
- Vermon S.A.
- Claire Bantignies
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microphone device with ingress protection
- Patent number 11,671,766
- Issue date Jun 6, 2023
- KNOWLES ELECTRONICS, LLC.
- Sung Bok Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME
- Publication number 20240140782
- Publication date May 2, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- PO CHEN YEH
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR MANUFACTURING A DEVICE COMPRISING TWO SEMICONDUCTOR DICE...
- Publication number 20240140783
- Publication date May 2, 2024
- STMicroelectronics S.r.l.
- Mark Andrew SHAW
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DECOUPLING METHOD FOR SEMICONDUCTOR DEVICE
- Publication number 20240132340
- Publication date Apr 25, 2024
- STMicroelectronics (Malta) Ltd.
- Roseanne DUCA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROMECHANICAL DEVICE COMPRISING A HYDROGEN DRAINAGE LAYER
- Publication number 20240124296
- Publication date Apr 18, 2024
- ROBERT BOSCH GmbH
- Johannes Boy
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CAPLESS SEMICONDUCTOR PACKAGE WITH A MICRO-ELECTROMECHANICAL SYSTEM...
- Publication number 20240124300
- Publication date Apr 18, 2024
- STMICROELECTRONICS, INC.
- Jefferson Sismundo TALLEDO
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SENSOR DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240109768
- Publication date Apr 4, 2024
- Advanced Semiconductor Engineering, Inc.
- Chieh-An YEH
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Support Device for One or More MEMS Components
- Publication number 20240101412
- Publication date Mar 28, 2024
- ROBERT BOSCH GmbH
- Joachim Friedl
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INTEGRATED MEMS ELECTROSTATIC MICRO-SPEAKER DEVICE AND METHOD
- Publication number 20240092629
- Publication date Mar 21, 2024
- Vibrant Microsystems Inc.
- Steven NASIRI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Haptic Device with Multiple Fluidically-Controlled Voids
- Publication number 20240019934
- Publication date Jan 18, 2024
- Meta Platforms Technologies, LLC
- Sean Jason Keller
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS PRESSURE SENSOR
- Publication number 20230417614
- Publication date Dec 28, 2023
- MEI Micro, Inc.
- Robert Mark Boysel
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME
- Publication number 20230399225
- Publication date Dec 14, 2023
- Taiwan Semiconductor Manufacturing company Ltd.
- PO CHEN YEH
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INTEGRATED ULTRASONIC TRANSDUCERS
- Publication number 20230389897
- Publication date Dec 7, 2023
- Exo Imaging, Inc.
- Janusz Bryzek
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PIEZOELECTRIC ANTI-STICTION STRUCTURE FOR MICROELECTROMECHANICAL SY...
- Publication number 20230373780
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Fan Hu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PACKAGING METHOD AND ASSOCIATED PACKAGING STRUCTURE
- Publication number 20230357002
- Publication date Nov 9, 2023
- Taiwan Semiconductor Manufacturing company Ltd.
- Chih-Ming Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICRO-ELECTRO-MECHANICAL SYSTEM (MEMS) DEVICE and fabrication metho...
- Publication number 20230348259
- Publication date Nov 2, 2023
- Vanguard International Semiconductor Corporation
- WAI MUN CHONG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PACKAGE WITH INTEGRATED DEVICE DIE AT LEAST DISPOSED WITHIN CARRIER
- Publication number 20230345182
- Publication date Oct 26, 2023
- Skyworks Solutions, Inc.
- Takanori Yasuda
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICRO-ELECTRO-MECHANICAL SYSTEM MICROPHONE PACKAGE
- Publication number 20230345184
- Publication date Oct 26, 2023
- Fortemedia, Inc.
- Yen-Son Paul HUANG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Microphone
- Publication number 20230339744
- Publication date Oct 26, 2023
- AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD
- Siewseong Tan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHODS AND SYSTEMS FOR FABRICATION OF ULTRASOUND TRANSDUCER DEVICES
- Publication number 20230303389
- Publication date Sep 28, 2023
- eXo Imaging, Inc.
- Liang WANG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CMUT-on-CMOS Ultrasonic Transducer by Bonding Active Wafers and Man...
- Publication number 20230302495
- Publication date Sep 28, 2023
- Feng Yin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INTEGRATED SHOWERHEAD
- Publication number 20230298862
- Publication date Sep 21, 2023
- Applied Materials, Inc.
- Alexander BERGER
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR PACKAGE USING A POLYMER SUBSTRATE
- Publication number 20230257257
- Publication date Aug 17, 2023
- Amkor Technology Singapore Holding Pte. Ltd.
- Yung Woo Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
COMPACT, EASY-TO-PRODUCE MEMS PACKAGE WITH IMPROVED PROTECTIVE PROP...
- Publication number 20230242394
- Publication date Aug 3, 2023
- HAHN-SCHICKARD-GESELLSCHAFT FUR ANGEWANDTE FORSCHUNG E.V.
- Achim Bittner
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PRESSURE SENSOR CHIP AND PRESSURE SENSOR
- Publication number 20230228639
- Publication date Jul 20, 2023
- Murata Manufacturing Co., Ltd.
- Daiki TSUJI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ACTUATOR LAYER PATTERNING WITH TOPOGRAPHY
- Publication number 20230202835
- Publication date Jun 29, 2023
- InvenSense, Inc.
- Daesung Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
STACKED DIE PACKAGE AND METHODS OF FORMING THE SAME
- Publication number 20230163103
- Publication date May 25, 2023
- Qorvo US, Inc.
- Julio C. Costa
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Attachment of Stress Sensitive Integrated Circuit Dies
- Publication number 20230126598
- Publication date Apr 27, 2023
- Sciosense B.V.
- Casper Van Der Avoort
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INERTIAL MEASUREMENT UNIT
- Publication number 20230125187
- Publication date Apr 27, 2023
- SEIKO EPSON CORPORATION
- Shinji Nishio
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD OF MANUFACTURING ELECTRONIC DEVICES AND CORRESPONDING ELECTR...
- Publication number 20230110259
- Publication date Apr 13, 2023
- STMicroelectronics (Malta) Ltd.
- Kevin FORMOSA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PROTECTIVE BONDLINE CONTROL STRUCTURE
- Publication number 20230064645
- Publication date Mar 2, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Ganapathy Subramaniam Sivakumar
- B81 - MICRO-STRUCTURAL TECHNOLOGY

the micromechanical device and the control or processing electronics being separate parts in the same package

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor package and method for manufacturing the same

Blood pressure detection device

Systems and methods for providing getters in microelectromechanical...

Signal processing circuit for triple-membrane MEMS device

Heat dissipation system with microelectromechanical system (MEMS) f...

Ovenized MEMS

Micromechanical sensor device having an ASIC chip integrated into a...

Capless semiconductor package with a micro-electromechanical system...

Semiconductor device and method for forming the same

Robust method for gyroscope drive amplitude measurement

Microelectromechanical system (MEMS) sensor packages and methods fo...

Heterogenous integration of complementary metal-oxide-semiconductor...

Integrated piezoelectric microelectromechanical ultrasound transduc...

Semiconductor package with built-in vibration isolation, thermal st...

Piezoelectric anti-stiction structure for microelectromechanical sy...

Support structure for MEMS device with particle filter

Sensor

MEMS assembly substrates including a bond layer

MEMS device with particle filter and method of manufacture

MEMS stress reduction structure embedded into package

Integrated ultrasonic transducers

Semiconductor structures

Actuator layer patterning with polysilicon and etch stop layer

Packaged environmental sensor

Packaging method and associated packaging structure

Manufacturing method of semiconductor structure

Robust MEMS microphone

Sensor and package assembly thereof

Panel transducer scale package and method of manufacturing the same

Microphone device with ingress protection

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME

METHOD FOR MANUFACTURING A DEVICE COMPRISING TWO SEMICONDUCTOR DICE...

DECOUPLING METHOD FOR SEMICONDUCTOR DEVICE

MICROMECHANICAL DEVICE COMPRISING A HYDROGEN DRAINAGE LAYER

CAPLESS SEMICONDUCTOR PACKAGE WITH A MICRO-ELECTROMECHANICAL SYSTEM...

SENSOR DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME

Support Device for One or More MEMS Components

INTEGRATED MEMS ELECTROSTATIC MICRO-SPEAKER DEVICE AND METHOD

Haptic Device with Multiple Fluidically-Controlled Voids

MEMS PRESSURE SENSOR

SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME

INTEGRATED ULTRASONIC TRANSDUCERS

PIEZOELECTRIC ANTI-STICTION STRUCTURE FOR MICROELECTROMECHANICAL SY...

PACKAGING METHOD AND ASSOCIATED PACKAGING STRUCTURE

MICRO-ELECTRO-MECHANICAL SYSTEM (MEMS) DEVICE and fabrication metho...

PACKAGE WITH INTEGRATED DEVICE DIE AT LEAST DISPOSED WITHIN CARRIER

MICRO-ELECTRO-MECHANICAL SYSTEM MICROPHONE PACKAGE

Microphone

METHODS AND SYSTEMS FOR FABRICATION OF ULTRASOUND TRANSDUCER DEVICES

CMUT-on-CMOS Ultrasonic Transducer by Bonding Active Wafers and Man...

INTEGRATED SHOWERHEAD

SEMICONDUCTOR PACKAGE USING A POLYMER SUBSTRATE

COMPACT, EASY-TO-PRODUCE MEMS PACKAGE WITH IMPROVED PROTECTIVE PROP...

PRESSURE SENSOR CHIP AND PRESSURE SENSOR

ACTUATOR LAYER PATTERNING WITH TOPOGRAPHY

STACKED DIE PACKAGE AND METHODS OF FORMING THE SAME

Attachment of Stress Sensitive Integrated Circuit Dies

INERTIAL MEASUREMENT UNIT

METHOD OF MANUFACTURING ELECTRONIC DEVICES AND CORRESPONDING ELECTR...

PROTECTIVE BONDLINE CONTROL STRUCTURE