the second connecting process involving a wire connector

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H01L2224/92247

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/92247the second connecting process involving a wire connector

Industries

Patents Grantslast 30 patents

Information Patent Grant
Low pressure sintering powder
- Patent number 12,113,039
- Issue date Oct 8, 2024
- Alpha Assembly Solutions Inc.
- Shamik Ghoshal
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Semiconductor chip package including lead frame and manufacturing m...
- Patent number 12,113,008
- Issue date Oct 8, 2024
- Diodes Incorporated
- Shiau-Shi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe package with pre-applied filler material
- Patent number 12,094,725
- Issue date Sep 17, 2024
- STMicroelectronics, Inc.
- Jefferson Talledo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
QFN device having a mechanism that enables an inspectable solder jo...
- Patent number 12,087,673
- Issue date Sep 10, 2024
- Texas Instruments Incorporated
- Abram Castro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with different types of semiconductor dies attached to a fl...
- Patent number 12,080,660
- Issue date Sep 3, 2024
- MACOM Technology Solutions Holdings, Inc.
- Xikun Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die attach surface copper layer with protective layer for microelec...
- Patent number 12,074,096
- Issue date Aug 27, 2024
- Texas Instruments Incorporated
- Christopher Daniel Manack
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die stack with cascade and vertical connections
- Patent number 12,068,283
- Issue date Aug 20, 2024
- Intel Corporation
- Min-Tih Ted Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multichip packaged semiconductor device
- Patent number 12,057,377
- Issue date Aug 6, 2024
- MagnaChip Semiconductor, Ltd.
- Hyun Dong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for fabricating silicon die stacks for electron...
- Patent number 12,027,489
- Issue date Jul 2, 2024
- Ukyo Jeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Camera module, and photosensitive component thereof and manufacturi...
- Patent number 12,021,097
- Issue date Jun 25, 2024
- NINGBO SUNNY OPOTECH CO., LTD.
- Mingzhu Wang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Sensor package and manufacturing method thereof
- Patent number 12,002,725
- Issue date Jun 4, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Ji Young Chung
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Power module semiconductor device and inverter equipment, and fabri...
- Patent number 11,973,007
- Issue date Apr 30, 2024
- Rohm Co., Ltd.
- Toshio Hanada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module semiconductor device and inverter equipment, and fabri...
- Patent number 11,967,543
- Issue date Apr 23, 2024
- Rohm Co., Ltd.
- Toshio Hanada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing leadless semiconductor package with wettab...
- Patent number 11,929,259
- Issue date Mar 12, 2024
- STMicroelectronics, Inc.
- Ian Harvey Arellano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Isolated semiconductor package with HV isolator on block
- Patent number 11,929,311
- Issue date Mar 12, 2024
- Texas Instruments Incorporated
- Vivek K Arora
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die attached leveling control by metal stopper bumps
- Patent number 11,923,331
- Issue date Mar 5, 2024
- Wei-Jhih Mao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip package with reinforced isolation
- Patent number 11,908,834
- Issue date Feb 20, 2024
- Texas Instruments Incorporated
- Vivek Arora
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power enhanced stacked chip scale package solution with integrated...
- Patent number 11,894,344
- Issue date Feb 6, 2024
- Intel Corporation
- Zhijun Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with elevated lead and structure extending vertically from...
- Patent number 11,862,582
- Issue date Jan 2, 2024
- Infineon Technologies AG
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electric drive module
- Patent number 11,862,543
- Issue date Jan 2, 2024
- American Axle & Manufacturing, Inc.
- James P. Downs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor die assemblies with support members and assoc...
- Patent number 11,855,065
- Issue date Dec 26, 2023
- Micron Technology, Inc.
- Hong Wan Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having die pad with cooling fins
- Patent number 11,848,256
- Issue date Dec 19, 2023
- STMicroelectronics, Inc.
- Jefferson Talledo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,837,569
- Issue date Dec 5, 2023
- Kioxia Corporation
- Yoshiharu Okada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor die assemblies with die support members and a...
- Patent number 11,824,044
- Issue date Nov 21, 2023
- Micron Technology, Inc.
- Seng Kim Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having conductive wire with increased attachme...
- Patent number 11,804,447
- Issue date Oct 31, 2023
- Amkor Technology Singapore Holding Pte Ltd.
- Jun Ho Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages
- Patent number 11,791,314
- Issue date Oct 17, 2023
- Samsung Electronics Co., Ltd.
- Seoeun Kyung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally enhanced isolated power converter package
- Patent number 11,791,249
- Issue date Oct 17, 2023
- Texas Instruments Incorporated
- Vijaylaxmi Gumaste Khanolkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacking structure, package structure and method of fabricating the...
- Patent number 11,784,163
- Issue date Oct 10, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with frame having arms
- Patent number 11,715,677
- Issue date Aug 1, 2023
- STMicroelectronics, Inc.
- Jefferson Sismundo Talledo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing electronic device
- Patent number 11,710,719
- Issue date Jul 25, 2023
- Sumitomo Electric Device Innovations, Inc.
- Taketo Kawano
- G02 - OPTICS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC DEVICE WITH IMPROVED LEADFRAME TRIMMING PROCESS
- Publication number 20240379506
- Publication date Nov 14, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Lau Chun Lek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR FABRICATING SILICON DIE STACKS FOR ELECTRON...
- Publication number 20240371819
- Publication date Nov 7, 2024
- NANO-X IMAGING LTD.
- Ukyo JEONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE ISOLATION WITH CONFORMAL COATING
- Publication number 20240363465
- Publication date Oct 31, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Anindya Poddar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE, METHOD OF MANUFACTURING A SEMICONDUCTOR DEVI...
- Publication number 20240321695
- Publication date Sep 26, 2024
- NXP USA, Inc.
- Jian Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240321658
- Publication date Sep 26, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Ji Young Chung
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Upside-Down DRAM Package Structure
- Publication number 20240315054
- Publication date Sep 19, 2024
- Apple Inc.
- Jiongxin Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROMECHANICAL COMPONENT
- Publication number 20240300807
- Publication date Sep 12, 2024
- ROBERT BOSCH GmbH
- Jan Stiedl
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
POWER MODULE SEMICONDUCTOR DEVICE AND INVERTER EQUIPMENT, AND FABRI...
- Publication number 20240282675
- Publication date Aug 22, 2024
- ROHM CO., LTD.
- Toshio HANADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH DIE SUPPORT MEMBERS AND A...
- Publication number 20240274583
- Publication date Aug 15, 2024
- Micron Technology, Inc.
- Seng Kim Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE SUBSTRATE WITH A SMOOTH GROOVE STRADDLING TOP...
- Publication number 20240258210
- Publication date Aug 1, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Bob Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED MODULE PACKAGE WITH AN EMI SHIELDING BARRIER
- Publication number 20240258245
- Publication date Aug 1, 2024
- TEXAS INSTRUMENTS INCORPORATED
- KWANG-SOO KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED POWER MODULE PACKAGE OPENING WITH EXPOSED COMPONENT
- Publication number 20240250075
- Publication date Jul 25, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Makoto Shibuya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20240234373
- Publication date Jul 11, 2024
- Samsung Electronics Co., Ltd.
- AENEE JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE AND METHOD FOR PRODUCING THE SAME
- Publication number 20240234166
- Publication date Jul 11, 2024
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- LI-CHUN HUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ISOLATED SEMICONDUCTOR PACKAGE WITH HV ISOLATOR ON BLOCK
- Publication number 20240222237
- Publication date Jul 4, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Vivek K. Arora
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240203900
- Publication date Jun 20, 2024
- Siliconware Precision Industries Co., Ltd.
- Chih-Hsien CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HALF BRIDGE CERAMIC HERMETIC PACKAGE STRUCTURE
- Publication number 20240194546
- Publication date Jun 13, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Kwang-Soo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Making a Semiconductor Package w...
- Publication number 20240194629
- Publication date Jun 13, 2024
- STATS ChipPAC Pte Ltd.
- YongMoo Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDED SEMICONDUCTOR DEVICE PACKAGE
- Publication number 20240178125
- Publication date May 30, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Masamitsu Matsuura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADLESS SEMICONDUCTOR PACKAGE WITH WETTABLE FLANKS AND METHOD FOR...
- Publication number 20240178006
- Publication date May 30, 2024
- STMICROELECTRONICS, INC.
- Ian Harvey ARELLANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE ATTACHED LEVELING CONTROL BY METAL STOPPER BUMPS
- Publication number 20240162183
- Publication date May 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Jhih Mao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOAD SWITCH MOUNTING FOR A SEMICONDUCTOR PACKAGE
- Publication number 20240162206
- Publication date May 16, 2024
- Micron Technology, Inc.
- Seng Kim YE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20240136327
- Publication date Apr 25, 2024
- Samsung Electronics Co., Ltd.
- AENEE JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE AND METHOD FOR PRODUCING THE SAME
- Publication number 20240136202
- Publication date Apr 25, 2024
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- LI-CHUN HUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH SUPPORT MEMBERS AND ASSOC...
- Publication number 20240128254
- Publication date Apr 18, 2024
- Micron Technology, Inc.
- Hong Wan Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240120354
- Publication date Apr 11, 2024
- SAMSUNG ELECTRONICS CO,. LTD.
- Kyong Soon CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH RESIN BLEED CONTROL STRUCTURE AND METHOD...
- Publication number 20240112989
- Publication date Apr 4, 2024
- NXP USA, Inc.
- Trent Uehling
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240105561
- Publication date Mar 28, 2024
- Kabushiki Kaisha Toshiba
- Fumiyoshi KAWASHIRO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOCUMENT STRUCTURE FORMATION
- Publication number 20240105669
- Publication date Mar 28, 2024
- INFINEON TECHNOLOGIES AG
- Jens Pohl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240072227
- Publication date Feb 29, 2024
- Rohm Co., Ltd.
- Kazuya MASUYAMA
- H01 - BASIC ELECTRIC ELEMENTS

the second connecting process involving a wire connector

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Low pressure sintering powder

Semiconductor chip package including lead frame and manufacturing m...

Leadframe package with pre-applied filler material

QFN device having a mechanism that enables an inspectable solder jo...

Package with different types of semiconductor dies attached to a fl...

Die attach surface copper layer with protective layer for microelec...

Die stack with cascade and vertical connections

Multichip packaged semiconductor device

Systems and methods for fabricating silicon die stacks for electron...

Camera module, and photosensitive component thereof and manufacturi...

Sensor package and manufacturing method thereof

Power module semiconductor device and inverter equipment, and fabri...

Power module semiconductor device and inverter equipment, and fabri...

Method for manufacturing leadless semiconductor package with wettab...

Isolated semiconductor package with HV isolator on block

Die attached leveling control by metal stopper bumps

Multi-chip package with reinforced isolation

Power enhanced stacked chip scale package solution with integrated...

Package with elevated lead and structure extending vertically from...

Electric drive module

Stacked semiconductor die assemblies with support members and assoc...

Semiconductor package having die pad with cooling fins

Semiconductor device and manufacturing method thereof

Stacked semiconductor die assemblies with die support members and a...

Semiconductor device having conductive wire with increased attachme...

Semiconductor packages

Thermally enhanced isolated power converter package

Stacking structure, package structure and method of fabricating the...

Semiconductor device with frame having arms

Method for manufacturing electronic device

Patents Applicationslast 30 patents

ELECTRONIC DEVICE WITH IMPROVED LEADFRAME TRIMMING PROCESS

SYSTEMS AND METHODS FOR FABRICATING SILICON DIE STACKS FOR ELECTRON...

DIE ISOLATION WITH CONFORMAL COATING

SEMICONDUCTOR PACKAGE, METHOD OF MANUFACTURING A SEMICONDUCTOR DEVI...

SENSOR PACKAGE AND MANUFACTURING METHOD THEREOF

Upside-Down DRAM Package Structure

MICROMECHANICAL COMPONENT

POWER MODULE SEMICONDUCTOR DEVICE AND INVERTER EQUIPMENT, AND FABRI...

STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH DIE SUPPORT MEMBERS AND A...

SEMICONDUCTOR PACKAGE SUBSTRATE WITH A SMOOTH GROOVE STRADDLING TOP...

MOLDED MODULE PACKAGE WITH AN EMI SHIELDING BARRIER

INTEGRATED POWER MODULE PACKAGE OPENING WITH EXPOSED COMPONENT

MEMORY DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

CHIP PACKAGE STRUCTURE AND METHOD FOR PRODUCING THE SAME

ISOLATED SEMICONDUCTOR PACKAGE WITH HV ISOLATOR ON BLOCK

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

HALF BRIDGE CERAMIC HERMETIC PACKAGE STRUCTURE

Semiconductor Device and Method of Making a Semiconductor Package w...

WIRE BONDED SEMICONDUCTOR DEVICE PACKAGE

LEADLESS SEMICONDUCTOR PACKAGE WITH WETTABLE FLANKS AND METHOD FOR...

DIE ATTACHED LEVELING CONTROL BY METAL STOPPER BUMPS

LOAD SWITCH MOUNTING FOR A SEMICONDUCTOR PACKAGE

MEMORY DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

CHIP PACKAGE STRUCTURE AND METHOD FOR PRODUCING THE SAME

STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH SUPPORT MEMBERS AND ASSOC...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE WITH RESIN BLEED CONTROL STRUCTURE AND METHOD...

SEMICONDUCTOR DEVICE

DOCUMENT STRUCTURE FORMATION

SEMICONDUCTOR DEVICE