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3443914
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Information
Patent Grant
3443914
References
Source
Patent Number
3,443,914
Date Filed
Not available
Date Issued
Tuesday, May 13, 1969
55 years ago
CPC
H01L23/49582 - Metallic layers on lead frames
B23K35/004 - at least one of the workpieces being of a metal of the iron group
B23K35/0238 - layered
B23K35/0272 - with more than one layer of coating or sheathing material
B23K35/30 - with the principal constituent melting at less than 1550 degrees C
C03C27/046 - of metals, metal oxides or metal salts only
H01L23/4924 - characterised by the materials
H01L24/48 - of an individual wire connector
H01L2224/45014 - Ribbon connectors
H01L2224/45015 - being circular
H01L2224/45144 - Gold (Au) as principal constituent
H01L2224/45155 - Nickel (Ni) as principal constituent
H01L2224/4516 - Iron (Fe) as principal constituent
H01L2224/45572 - Two-layer stack coating
H01L2224/45611 - Tin (Sn) as principal constituent
H01L2224/45639 - Silver (Ag) as principal constituent
H01L2224/45644 - Gold (Au) as principal constituent
H01L2224/45647 - Copper (Cu) as principal constituent
H01L2224/45664 - Palladium (Pd) as principal constituent
H01L2224/48247 - connecting the wire to a bond pad of the item
H01L2224/48664 - Palladium (Pd) as principal constituent
H01L2224/85464 - Palladium (Pd) as principal constituent
H01L2924/01004 - Beryllium [Be]
H01L2924/01046 - Palladium [Pd]
H01L2924/01078 - Platinum [Pt]
H01L2924/01079 - Gold [Au]
H01L2924/01322 - Eutectic Alloys
H01L2924/09701 - Low temperature co-fired ceramic [LTCC]
Y10S428/926 - Thickness of individual layer specified
Y10T428/12722 - Next to Group VIII metal-base component
Y10T428/12875 - Platinum group metal-base component
Y10T428/12882 - Cu-base component alternative to Ag-, Au-, or Ni-base component
US Classifications
428 - Stock material or miscellaneous articles
174 - Electricity: conductors and insulators
257 - Active solid-state devices
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