2728693

Information

• Patent Grant
• 2728693

• References
• Source

• Patent Number

  2,728,693

• Date Filed

  Not available

• Date Issued

  Tuesday, December 27, 1955
  68 years ago

• CPC

  • H05K3/048 - using a lift-off resist pattern or a release layer pattern
  • H05K3/04 - the conductive material being removed mechanically
  • H05K3/108 - by semi-additive methods; masks therefor
  • H05K3/184 - using masks
  • H05K2201/0344 - Electroless sublayer
  • H05K2203/025 - Abrading
  • H05K2203/054 - Continuous temporary metal layer over resist
  • H05K2203/0743 - Mechanical agitation of fluid
  • Y10T29/49155 - Manufacturing circuit on or in base

• US Classifications

  • 216 - Etching a substrate: processes
  • 029 - Metal working
  • 205 - Electrolysis: processes, compositions used therein, and methods of preparing the compositions
  • 257 - Active solid-state devices
  • 427 - Coating processes
  • 439 - Electrical connectors