2939204

Information

• Patent Grant
• 2939204

• References
• Source

• Patent Number

  2,939,204

• Date Filed

  Not available

• Date Issued

  Tuesday, June 7, 1960
  64 years ago

• CPC

  • H01L24/01 - Means for bonding being attached to, or being formed on, the surface to be connected
  • B23K20/00 - Non-electric welding by applying impact or other pressure, with or without the application of heat
  • H01J5/28 - between conductive parts of vessel
  • H01J5/42 - using intermediate part
  • H01L21/00 - Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/50 - Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326
  • H01L23/16 - Fillings or auxiliary members in containers or encapsulations
  • H01L29/00 - Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier
  • H01J2893/0034 - Lamp bases
  • H01J2893/0044 - Direct connection between two metal elements, in particular via material a connecting material
  • H01L2924/01005 - Boron [B]
  • H01L2924/01006 - Carbon [C]
  • H01L2924/01015 - Phosphorus [P]
  • H01L2924/01019 - Potassium [K]
  • H01L2924/01027 - Cobalt [Co]
  • H01L2924/01029 - Copper [Cu]
  • H01L2924/01032 - Germanium [Ge]
  • H01L2924/01033 - Arsenic [As]
  • H01L2924/01039 - Yttrium [Y]
  • H01L2924/01049 - Indium [In]
  • H01L2924/01052 - Tellurium [Te]
  • H01L2924/01057 - Lanthanum [La]
  • H01L2924/01074 - Tungsten [W]
  • H01L2924/01082 - Lead [Pb]
  • H01L2924/12033 - Gunn diode
  • H01L2924/12036 - PN diode
  • Y10S228/904 - Wire bonding
  • Y10T29/49169 - Assembling electrical component directly to terminal or elongated conductor

• US Classifications

  • 029 - Metal working
  • 228 - Metal fusion bonding
  • 257 - Active solid-state devices
  • 438 - Semiconductor device manufacturing: process