Number | Name | Date | Kind |
---|---|---|---|
3757175 | Kim et al. | Sep 1973 | |
4221067 | Marken et al. | Sep 1980 | |
4239312 | Myer | Dec 1989 | |
4275410 | Grinberg et al. | Jun 1981 | |
4507726 | Grinberg et al. | Mar 1985 | |
4541035 | Carlson et al. | Sep 1985 | |
4707859 | Nudd et al. | Nov 1987 | |
4783695 | Eichelberger et al. | Nov 1988 | |
4901136 | Neugebauer et al. | Feb 1990 |
Number | Date | Country |
---|---|---|
3233195 | Mar 1983 | DEX |
Entry |
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R. O. Carlson et al, "A High Density Copper/Polyimide Overlay Interconnection", Eighth International Electronics Packaging Conference, Nov. 7-10, 1988. |
"GE Method overcomes previous wafer-scale integration problems", E. J. Lerner, Research & Development Magazine, 10/85, pp. 51-52. |
"High Density Overlay for Bare Chip Interconnect", J. E. Kohl, 1988 GOMAC Proceedings, pp. 445-448. |