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3602983
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Information
Patent Grant
3602983
References
Source
Patent Number
3,602,983
Date Filed
Not available
Date Issued
Tuesday, September 7, 1971
52 years ago
CPC
H01L23/49562 - for devices being provided for in H01L29/00
H01L24/49 - of a plurality of wire connectors
H02J7/248 - characterised by the mechanical construction
H01L24/48 - of an individual wire connector
H01L2224/48091 - Arched
H01L2224/48247 - connecting the wire to a bond pad of the item
H01L2224/48472 - the other connecting portion not on the bonding area also being a wedge bond
H01L2224/49175 - Parallel arrangements
H01L2924/00014 - the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
H01L2924/01004 - Beryllium [Be]
H01L2924/01005 - Boron [B]
H01L2924/01006 - Carbon [C]
H01L2924/01015 - Phosphorus [P]
H01L2924/01019 - Potassium [K]
H01L2924/01082 - Lead [Pb]
H01L2924/12035 - Zener diode
H01L2924/19041 - being a capacitor
H01L2924/19043 - being a resistor
Y10T29/4913 - Assembling to base an electrical component, e.g., capacitor, etc.
US Classifications
029 - Metal working
257 - Active solid-state devices
438 - Semiconductor device manufacturing: process
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