3640811

Information

• Patent Grant
• 3640811

• References
• Source

• Patent Number

  3,640,811

• Date Filed

  Not available

• Date Issued

  Tuesday, February 8, 1972
  53 years ago

• CPC

  • H01L21/00 - Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • C23C14/32 - by explosion by evaporation and subsequent ionisation of the vapours
  • H01J37/36 - for cleaning surfaces while plating with ions of materials introduced into the discharge
  • H01L23/485 - consisting of layered constructions comprising conductive layers and insulating layers
  • H01L2924/0002 - Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
  • H01L2924/3011 - Impedance
  • Y10S148/017 - Clean surfaces
  • Y10S148/02 - Contacts, special
  • Y10S148/045 - Electric field
  • Y10S148/05 - Etch and refill
  • Y10S148/158 - Sputtering
  • Y10S148/169 - Vacuum deposition

• US Classifications

  • 204 - Chemistry: electrical and wave energy
  • 148 - Metal treatment