3889363

Information

• Patent Grant
• 3889363

• References
• Source

• Patent Number

  3,889,363

• Date Filed

  Not available

• Date Issued

  Tuesday, June 17, 1975
  49 years ago

• CPC

  • B29C70/72 - Encapsulating inserts having non-encapsulated projections
  • B29C33/0033 - constructed for making articles provided with holes
  • H05K3/0014 - Shaping of the substrate
  • H05K3/025 - by transfer of thin metal foil formed on a temporary carrier
  • H05K3/045 - by making a conductive layer having a relief pattern, followed by abrading of the raised portions
  • H05K3/20 - by affixing prefabricated conductor pattern
  • B29K2905/06 - Tin
  • B29K2905/10 - Copper
  • B29L2031/3425 - Printed circuits
  • H05K3/107 - by filling grooves in the support with conductive material
  • H05K2201/0305 - Solder used for other purposes than connections between PCB or components
  • H05K2201/0317 - Thin film conductor layer Thin film passive component
  • H05K2201/0355 - Metal foils
  • H05K2201/09118 - Moulded substrate
  • H05K2203/0113 - Female die used for patterning or transferring
  • H05K2203/025 - Abrading
  • Y10T29/49158 - with molding of insulated base

• US Classifications

  • 029 - Metal working
  • 156 - Adhesive bonding and miscellaneous chemical manufacture
  • 174 - Electricity: conductors and insulators
  • 264 - Plastic and nonmetallic article shaping or treating: processes
  • 361 - Electricity: electrical systems and devices