Claims
- 1. An adhesive tape for tape automated bonding (TAB) having an organic insulating film, an adhesive layer formed on the organic insulating film and a protective layer formed on the adhesive layer, said adhesive layer being a layer containing an epoxy resin comprising at least one epoxy group and having a main chain wholly formed of a linear siloxane structure.
- 2. An adhesive tape for TAB according to claim 1, wherein the adhesive layer further contains 5 to 700 parts by weight, per 100 parts by weight of the epoxy resin, of a polyamide resin.
- 3. An adhesive tape for TAB according to claim 1, wherein the adhesive layer further contains 0.03 to 10 parts by weight, per 100 parts by weight of the epoxy resin, of an imidazole compound.
- 4. An adhesive tape for TAB according to claim 1, wherein the adhesive layer further contains 5 to 700 parts by weight, per 100 parts by weight of the epoxy resin, of a phenolic resin.
Priority Claims (4)
Number |
Date |
Country |
Kind |
3-206115 |
Jul 1991 |
JPX |
|
3-206116 |
Jul 1991 |
JPX |
|
4-86552 |
Mar 1992 |
JPX |
|
4-116670 |
Apr 1992 |
JPX |
|
Parent Case Info
This application is a division of application Ser. No. 08/216,432, filed Mar. 23, 1994 (now U.S. Pat. No. 5,523,137), which application is a division of now abandoned application Ser. No. 07/917,345, filed Jul. 23, 1992.
US Referenced Citations (8)
Foreign Referenced Citations (3)
Number |
Date |
Country |
53-134365 |
Nov 1978 |
JPX |
56-152832 |
Nov 1981 |
JPX |
2-15644 |
Jul 1988 |
JPX |
Divisions (2)
|
Number |
Date |
Country |
Parent |
216432 |
Mar 1994 |
|
Parent |
917345 |
Jul 1992 |
|