The present disclosure relates generally to plasma processing and, more particularly, to plasma processing chambers and electrode assemblies used therein. Plasma processing apparatuses can be used to process substrates by a variety of techniques including, but not limited to, etching, physical vapor deposition, chemical vapor deposition, ion implantation, resist removal, etc. For example, and not by way of limitation, one type of plasma processing chamber contains an upper electrode, commonly referred to as a showerhead electrode, and a bottom electrode. An electric field is established between the electrodes to excite a process gas into the plasma state to process substrates in the reaction chamber.
According to one embodiment of the present disclosure, a silicon-based showerhead electrode is provided where backside inserts are positioned in backside recesses formed along the backside of the electrode. The backside inserts comprise a threaded outside diameter, a threaded inside diameter, and a tool engaging portion formed in the threaded inside diameter. The tool engaging portion is formed such that the backside insert further comprises one or more lateral shielding portions between the tool engaging portion and the threaded outside diameter to prevent a tool engaged with the tool engaging portion of the backside insert from extending beyond the threaded outside diameter of the insert.
In another embodiment, the tool engaging portion of the backside insert comprises a plurality of torque-receiving slots arranged about the axis of rotation of the backside insert. The torque-receiving slots are arranged to avoid on-axis rotation of the backside insert via opposing pairs of torque receiving slots.
Additional embodiments relate to plasma processing chambers comprising silicon bases showerhead electrodes fabricated in the manner disclosed herein.
The following detailed description of specific embodiments of the present disclosure can be best understood when read in conjunction with the following drawings, where like structure is indicated with like reference numerals and in which:
The various aspects of the present disclosure can be illustrated in the context of a plasma processing chamber 10, which is merely illustrated schematically in
Referring to
The silicon-based showerhead electrode 80 comprises a backside 82, a frontside 84, and a plurality of showerhead passages 86 extending from the backside 82 of the silicon-based showerhead electrode 80 to the frontside 84 of the silicon-based showerhead electrode 80. The silicon-based showerhead electrode 80 further comprises a plurality of backside recesses 88 formed in the backside 82 of the electrode 80. As is illustrated in
Referring to
Referring to
In addition to the process gas passages 76, the thermal control plate 70 comprises securing hardware passages 78 that are configured to permit securing hardware 60 to access the backside inserts 90 positioned in the backside recesses 88 along the backside 82 of the silicon-based showerhead electrode 80. The thermal control plate 70 and the silicon-based showerhead electrode 80 can be engaged using the securing hardware 60 and the backside inserts 90. In the engaged state, the frontside 74 of the thermal control plate 70 faces the backside 82 of the silicon-based showerhead electrode 80 and the showerhead passages 86 in the silicon-based showerhead electrode 80 are aligned with the process gas passages 76 in the thermal control plate 70. In addition, the securing hardware passages 78 are aligned with the backside inserts 90 positioned in the backside recesses 88 along the backside 82 of the electrode 80. As a result, the securing hardware 60 may extend through the securing hardware passages 78 in the thermal control plate 70 and engage the backside inserts 90, which are positioned in the backside recesses 88 along the backside 82 of the electrode 80.
The securing hardware 60 and the backside inserts 90 are configured to maintain engagement of the thermal control plate 70 and the silicon-based showerhead electrode 80. In addition, the securing hardware 60 and the backside inserts 90 are configured to permit disengagement of the thermal control plate 80 and the showerhead electrode 80. In the embodiment illustrated in
Although a variety of materials may be selected to form the backside inserts 90, including thermoplastics or other kinds of plastics, synthetic rubbers, ceramics, metals, or inserts with composite layers of materials, according to some embodiments of the present disclosure, the backside inserts comprise significant amounts of polyetheretherketone (PEEK) formulated and manufactured such that the hardness of the backside inserts 90 does not exceed the hardness of the silicon-based electrode material. Additional candidate materials include, but are not limited to Delrin® or other acetal resin engineering plastics formulated as filled or unfilled homopolymers or copolymers, nylon, polytetrafluoroethylene (PTFE), or combinations thereof.
Although the thermal control plate 70 and the silicon-based showerhead electrode 80 can be engaged in a variety of ways consistent with the concepts of the present disclosure, in the embodiments illustrated in
Referring to
In any of the embodiments disclosed herein employing one or more backside inserts 90, it will often be advantageous to ensure that the securing hardware 60, the backside inserts 90, and the backside recess 88 are configured such that, during thermal loading, with the securing hardware 60 and backside insert 90 in an engaged state, the backside insert is able to move with the securing hardware within the backside recess without dislodging from the recess. For example, referring to the embodiment of the present disclosure illustrated in
In the embodiment of
The present inventors have recognized that any abrasive contact with the electrode material in the vicinity of the recesses 88 can create a source of potential contamination in the plasma processing chamber 10. Accordingly, where a backside insert 90 according to the present disclosure is configured for installation or removal with a screwdriver or other potentially abrasive tool, as is the case in the embodiment of
A variety of spring-loaded configurations can be utilized to reduce any tendency of the securing hardware 60 to become disengaged as a result of stress induced as a result of thermal loading induced during plasma processing. For example, one configuration for providing a spring-loaded engagement of the thermal control plate 70 and the silicon-based showerhead electrode 80 is illustrated in
As is illustrated in
Although
As is illustrated in
To further protect against contamination arising from contact between the removal tool and the backside insert 110, it is contemplated that the torque receiving slots 120 can be designed such that the side walls 118 that extend parallel to the axis of rotation 130 are apex-free side walls. More specifically, the side walls 118 are free of the abrupt geometrical discontinuities that are typically formed when two linear wall segments connect. These geometrical discontinuities, and the complementary counterparts in the matching installation removal tool, can be a significant source of contamination because they typically form relatively fragile or potentially damaging apexes that can either break upon contact or dislodge contaminants from a mating surface in the mechanical engagement context. As is illustrated in
Although the various concepts of the present invention have been described herein in the context of silicon-based electrode materials such as single crystal silicon, polysilicon, silicon nitride, and silicon carbide, it is noted that the present invention has utility in a variety of contexts, including those where the silicon-based electrode material comprises boron carbide, aluminum nitride, aluminum oxide, or combinations thereof. In addition, it is contemplated that the silicon-based showerhead electrode 80 may be presented in a variety of configurations without departing from the scope of the present disclosure including, but not limited to, a single-piece, circular showerhead configurations or multi-component, circular showerhead configurations comprising a circular central electrode and one or more peripheral electrodes arranged about the circumference of the central electrode.
It is noted that recitations herein of a component of the present disclosure being “configured” to embody a particular property or function in a particular manner are structural recitations as opposed to recitations of intended use. More specifically, the references herein to the manner in which a component is “configured” denotes an existing physical condition of the component and, as such, is to be taken as a definite recitation of the structural characteristics of the component.
It is noted that terms like “preferably,” “commonly,” and “typically,” when utilized herein, are not utilized to limit the scope of the claimed invention or to imply that certain features are critical, essential, or even important to the structure or function of the claimed invention. Rather, these terms are merely intended to identify particular aspects of an embodiment of the present disclosure or to emphasize alternative or additional features that may or may not be utilized in a particular embodiment of the present disclosure.
For the purposes of describing and defining the present invention it is noted that the term “approximately” is utilized herein to represent the inherent degree of uncertainty that may be attributed to any quantitative comparison, value, measurement, or other representation. The term is also utilized herein to represent the degree by which a quantitative representation may vary from a stated reference without resulting in a change in the basic function of the subject matter at issue.
Having described the invention in detail and by reference to specific embodiments thereof, it will be apparent that modifications and variations are possible without departing from the scope of the invention defined in the appended claims. More specifically, although some aspects of the present invention are identified herein as preferred or particularly advantageous, it is contemplated that the present invention is not necessarily limited to these preferred aspects of the invention.
It is noted that one or more of the following claims utilize the term “wherein” as a transitional phrase. For the purposes of defining the present invention, it is noted that this term is introduced in the claims as an open-ended transitional phrase that is used to introduce a recitation of a series of characteristics of the structure and should be interpreted in like manner as the open-ended preamble term “comprising.”
The present application is a continuation-in-part of U.S. patent application Ser. No. 11/871,586 filed Oct. 12, 2007 (LAR P1694 PA).
Number | Name | Date | Kind |
---|---|---|---|
3783173 | Twomey | Jan 1974 | A |
4595484 | Giammarco et al. | Jun 1986 | A |
4654754 | Daszkowski | Mar 1987 | A |
4782893 | Thomas | Nov 1988 | A |
4792378 | Rose et al. | Dec 1988 | A |
4820371 | Rose | Apr 1989 | A |
4960488 | Law et al. | Oct 1990 | A |
5518758 | Tiburtius et al. | May 1996 | A |
5534751 | Lenz et al. | Jul 1996 | A |
5545473 | Ameen et al. | Aug 1996 | A |
5660917 | Fujimori et al. | Aug 1997 | A |
5679457 | Bergerson | Oct 1997 | A |
5932007 | Li | Aug 1999 | A |
6036782 | Tanaka et al. | Mar 2000 | A |
6050216 | Szapucki et al. | Apr 2000 | A |
6073577 | Lilleland et al. | Jun 2000 | A |
6096414 | Young | Aug 2000 | A |
6131646 | Kelley | Oct 2000 | A |
6165612 | Misra | Dec 2000 | A |
6170432 | Szapucki et al. | Jan 2001 | B1 |
6200415 | Maraschin | Mar 2001 | B1 |
6220607 | Schneider et al. | Apr 2001 | B1 |
6331349 | Kalinoski et al. | Dec 2001 | B1 |
6343647 | Kim et al. | Feb 2002 | B2 |
6365063 | Collins et al. | Apr 2002 | B2 |
6376385 | Lilleland et al. | Apr 2002 | B2 |
6379491 | Lee et al. | Apr 2002 | B1 |
6412437 | Campbell et al. | Jul 2002 | B1 |
6432831 | Dhindsa et al. | Aug 2002 | B2 |
6468925 | Campbell et al. | Oct 2002 | B2 |
6475933 | Brown et al. | Nov 2002 | B1 |
6491784 | Yamaguchi et al. | Dec 2002 | B2 |
6496373 | Chung | Dec 2002 | B1 |
6651736 | Chiu et al. | Nov 2003 | B2 |
6733015 | Forry et al. | May 2004 | B2 |
6786175 | Dhindsa et al. | Sep 2004 | B2 |
6818097 | Yamaguchi et al. | Nov 2004 | B2 |
6824627 | Dhindsa et al. | Nov 2004 | B2 |
6855377 | Yajima et al. | Feb 2005 | B2 |
6983892 | Norbakhsh et al. | Jan 2006 | B2 |
7017269 | White et al. | Mar 2006 | B2 |
7018506 | Hongoh et al. | Mar 2006 | B2 |
7094315 | Chen et al. | Aug 2006 | B2 |
7137444 | Faybishenko et al. | Nov 2006 | B2 |
7159537 | Wickramanayaka et al. | Jan 2007 | B2 |
7205050 | Haas | Apr 2007 | B2 |
7208192 | Bunyan et al. | Apr 2007 | B2 |
7220937 | Hofman et al. | May 2007 | B2 |
20010033059 | Forry et al. | Oct 2001 | A1 |
20020106610 | Hurson | Aug 2002 | A1 |
20020123230 | Hubacek | Sep 2002 | A1 |
20030106644 | Sirkis et al. | Jun 2003 | A1 |
20040187792 | Parks | Sep 2004 | A1 |
20050028935 | Wickramanayaka et al. | Feb 2005 | A1 |
20050133160 | Kennedy et al. | Jun 2005 | A1 |
20050145336 | Matsushima et al. | Jul 2005 | A1 |
20050241765 | Dhindsa et al. | Nov 2005 | A1 |
20050241766 | Dhindsa et al. | Nov 2005 | A1 |
20060054280 | Jang | Mar 2006 | A1 |
20060060138 | Keller et al. | Mar 2006 | A1 |
20060137607 | Seo et al. | Jun 2006 | A1 |
20060207502 | Dhindsa et al. | Sep 2006 | A1 |
20060253942 | Barrera et al. | Nov 2006 | A1 |
20060266852 | Choi | Nov 2006 | A1 |
20070068629 | Shih et al. | Mar 2007 | A1 |
20070187038 | Ren et al. | Aug 2007 | A1 |
20080081114 | Johanson et al. | Apr 2008 | A1 |
20080090417 | De La Llera et al. | Apr 2008 | A1 |
20080255294 | Yerushalmi-Rozen | Oct 2008 | A1 |
20090066035 | Hurlbert et al. | Mar 2009 | A1 |
Number | Date | Country |
---|---|---|
2006324400 | Nov 2006 | JP |
2007123796 | May 2007 | JP |
2008103589 | May 2008 | JP |
20040007301 | Jan 2004 | KR |
20050043829 | Oct 2006 | KR |
1020070015599 | Feb 2007 | KR |
2005065186 | Jul 2005 | WO |
Number | Date | Country | |
---|---|---|---|
20100038033 A1 | Feb 2010 | US |
Number | Date | Country | |
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Parent | 11871586 | Oct 2007 | US |
Child | 12409984 | US |