Claims
- 1. A method of inspecting bump junctions of flip chips in which a semiconductor chip is mounted reversely on a substrate through bumps, comprising:
- a first step of irradiating said semiconductor chip with heat rays so as to heat the same;
- a second step of detecting radiation heat radiated from said semiconductor chip;
- a third step of controlling a temperature of the substrate so that it remains constant, and generating a temperature distribution on the surface of said semiconductor chip from the detected radiation heat; and
- a fourth step of deciding the quality of a bump junction portion based on arrangement information of said bumps in said temperature distribution of said semiconductor chip.
- 2. A method of inspecting bump junction of flip chips according to claim 1, wherein the third step includes a fifth step of generating temperature distribution of only the temperature on the surface of a semiconductor chip at a bump junction portion or temperature distribution of only the temperature on the surface of the semiconductor chip at a bump junction portion and an intermediate portion between bump junction portions.
- 3. A method of inspecting bump junction of flip chips according to claim 1, wherein the third step includes a sixth step of acquiring temperature distribution in a transient condition of temperature rise of a semiconductor chip from the start of irradiation with heat rays onto the surface of said semiconductor chip.
- 4. A method of inspecting bump junction of flip chips according to claim 1, wherein the third step includes a step of measuring the temperature of said substrate, thereby to obtain relative temperature distribution between the semiconductor chip surface and the substrate as said temperature distribution.
- 5. A method if inspecting bump junctions of flip chips according to claim 1, further comprising a seventh step of acquiring a reference temperature distribution on the surface of a reference semiconductor chip of a semiconductor device of known excellent quality under the same conditions as the acquisition of the temperature distribution of the third step as reference arrangement information of bumps of said reference semiconductor chip.
- 6. A method of inspecting bump junctions of a production semiconductor chip comprising the steps of:
- providing a production semiconductor chip with the chip mounted reversely on a substrate through bumps;
- positioning a surface of the substrate of the production semiconductor chip on a stage in vertical registration with a Peltier element so that a surface of the semiconductor chip is exposed in opposition to the substrate surface;
- operating said Peltier element to maintain the substrate at a constant temperature;
- irradiating the surface of the semiconductor chip with a heat ray so as to heat the semiconductor chip;
- detecting radiation heat radiated from said semiconductor chip;
- generating a temperature distribution of the surface of the semiconductor chip from the detected radiation heat; and
- determining the quality of bump junctions based on arrangement information of the bumps in the temperature distribution of the semiconductor chip.
Priority Claims (1)
Number |
Date |
Country |
Kind |
7-328452 |
Dec 1995 |
JPX |
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CROSS-REFERENCE TO RELATED APPLICATIONS
This application is a division of copending application Ser. No. 08/764,996, filed Dec. 16, 1996.
US Referenced Citations (4)
Number |
Name |
Date |
Kind |
5052816 |
Nakamura et al. |
Oct 1991 |
|
5111048 |
Devitt et al. |
May 1992 |
|
5250809 |
Nakata et al. |
Oct 1993 |
|
5473259 |
Takeda |
Dec 1995 |
|
Foreign Referenced Citations (1)
Number |
Date |
Country |
4-359447 |
Dec 1992 |
JPX |
Divisions (1)
|
Number |
Date |
Country |
Parent |
764996 |
Dec 1996 |
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