Claims
- 1. A reactor for sputtering a magnetic material, comprising:
a target comprising the magnetic material disposed in a chamber; a pedestal disposed in the chamber for supporting a substrate having a diameter at a position separated from the target by a throw distance of at least 50% of the diameter; a magnetron positioned adjacent the target opposite the pedestal; and a grounded collimator positioned between the pedestal and the target, wherein the collimator comprises an outer ring and at least two inner rings.
- 2. The reactor of claim 1, wherein the collimator is supported on and electrically connected to a shield.
- 3. The reactor of claim 2, wherein a side of the collimator facing the target is separated from the substrate by no more than 40% of the throw distance.
- 4. The reactor of claim 1, wherein the at least two inner rings are concentrically disposed within the outer ring.
- 5. The reactor of claim 4, wherein the at least two inner rings are positioned to direct the magnetic material towards the substrate containing high-aspect ratio apertures.
- 6. The reactor of claim 5, wherein the at least two inner rings independently have an inner ring length greater than a length of the outer ring.
- 7. The reactor of claim 5, wherein at least one inner strut is positioned between the at least two inner rings.
- 8. The reactor of claim 7, wherein at least one outer strut is positioned between the outer ring and the at least two inner rings.
- 9. A plasma sputter reactor, comprising:
a pedestal disposed in a chamber for supporting a substrate to be sputter coated; a target disposed in the chamber between a magnetron and the pedestal; a grounded shield disposed in the chamber; and a collimator positioned between the pedestal and the target and supported and electrically fixed to the grounded shield, wherein the collimator comprises an outer ring and at least two inner rings.
- 10. The reactor of claim 9, wherein the grounded shield comprises a tubular upper portion generally of a first diameter and a tubular lower portion generally of a second diameter less than the first diameter and connected by a radially extending ledge on which the collimator is supported.
- 11. The reactor of claim 9, wherein a side of the collimator facing the target is separated from the substrate by no more than 40% of a throw distance.
- 12. The reactor of claim 9, wherein the at least two inner rings are concentrically disposed within the outer ring.
- 13. The reactor of claim 12, wherein the at least two inner rings are positioned to direct the sputtered material towards the substrate containing high-aspect ratio apertures.
- 14. The reactor of claim 13, wherein the at least two inner rings independently have an inner ring length greater than a length of the outer ring.
- 15. The reactor of claim 13, wherein at least one inner strut is positioned between the at least two inner rings.
- 16. The reactor of claim 15, wherein at least one outer strut is positioned between the outer ring and the at least two inner rings.
- 17. A ring collimator used to collimate sputtered material in a plasma reaction chamber, comprising:
an outer ring having a surface for electrically grounding to the plasma reaction chamber; at least two inner rings concentrically disposed within the outer ring; at least three inner struts positioned between the at least two inner rings; and at least three outer struts positioned between the outer ring and the at least two inner rings.
- 18. The ring collimator of claim 17, wherein each inner strut and each outer strut is located on a diameter of the ring collimator and the inner strut and the outer strut are not on the same radius of the ring collimator.
- 19. The ring collimator of claim 17, further comprising a cylindrical shield having a surface for receiving the surface of the outer ring.
- 20. The ring collimator of claim 18, wherein the first and second inner rings independently have an inner ring length greater than a length of the outer ring.
RELATED APPLICATIONS
[0001] This application is a continuation of co-pending U.S. patent application Ser. No. 10/044,412, filed on Jan. 9, 2002, which is a continuation-in-part of co-pending U.S. patent application Ser. No. 09/916,234, which was filed on Jul. 25, 2001, and which are both herein incorporated by reference.
Continuations (1)
|
Number |
Date |
Country |
Parent |
10044412 |
Jan 2002 |
US |
Child |
10845970 |
May 2004 |
US |
Continuation in Parts (1)
|
Number |
Date |
Country |
Parent |
09916234 |
Jul 2001 |
US |
Child |
10044412 |
Jan 2002 |
US |