Claims
- 1. A method of manufacturing a package, the method comprising:
manufacturing a substrate to include at least one layer of LCP material; manufacturing a cover made of LCP material to include a lower lip; and sealing the cover to the substrate by heating the interface between the lower lip and the substrate.
- 2. The method of claim 1 further including disposing susceptor material between the lower lip of the cover and the substrate and wherein sealing includes employing a laser to heat the interface as laser energy is absorbed by the susceptor material.
- 3. The method of claim 2 in which the susceptor material is Clearweld™.
- 4. The method of claim 1 in which the laser is an infrared laser.
- 5. The method of claim 1 further including adding pigmentation to at least the lower lip of the cover and sealing includes directing laser energy through the substrate to be absorbed by the lower lip.
- 6. The method of claim 1 further including adding pigmentation to the substrate and sealing includes directing laser energy through the lower lip to be absorbed by the substrate.
- 7. The method of claim 1 in which the lip includes at least one energy director extending therefrom and sealing includes directing ultrasonic energy to be focused by the energy director to melt the interface.
- 8. The method of claim 7 further including forming a cavity in the substrate which receives the energy director.
- 9. The method of claim 7 in which directing ultrasonic energy includes using a plunge welding ultrasonic welding system.
- 10. The method of claim 9 in which the plunge welding ultrasonic welding system includes a frame shaped horn which engages the lower lip.
- 11. A method of manufacturing a package, the method comprising:
manufacturing a substrate; manufacturing a cover to include a lower lip; disposing a susceptor material between the lower lip of the cover and substrate; and employing a laser to heat the interface between the lower lip and the substrate as laser energy is absorbed by the susceptor material.
- 12. A method of manufacturing a package, the method comprising:
manufacturing a substrate to include at least a top layer of pigmented material; manufacturing a cover to include a lower lip; mating the cover to the substrate; and directing laser energy through the lower lip to be absorbed by the pigmentation in the substrate to seal the cover to the substrate.
- 13. A method of manufacturing a package, the method comprising:
manufacturing a substrate; manufacturing a cover including pigmented material; mating the cover to the substrate; and directing laser energy through the substrate to be absorbed by the pigmented cover material to seal the cover to the substrate.
- 14. A method of manufacturing a package, the method comprising:
manufacturing a substrate; manufacturing a cover to include a lower lip with at least one energy director extending therefrom; mating the cover to the substrate; and directing ultrasonic energy to be focused by the energy director to melt the interface between the cover and the substrate.
- 15. The method of claim 14 further including forming a cavity in the substrate which receives the energy director.
- 16. A method of manufacturing a package, the method comprising:
manufacturing a substrate to include a top layer including a cavity formed therein; manufacturing a cover to include a lower lip with at least one said energy director extending therefrom; mating the cover to the substrate so that the energy director is received in the cavity; and directing ultrasonic energy to be focused by the energy director to melt the interface between the cover and the substrate.
RELATED APPLICATIONS
[0001] This application claims priority from provisional application serial No. 60/390,011 filed Jun. 19, 2002.
Government Interests
[0002] This invention was made with U.S. Government support under Contract No. DAAH01-00-C-R070 awarded by the U.S. Army. The Government may have certain rights in the subject invention.
Provisional Applications (1)
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Number |
Date |
Country |
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60390011 |
Jun 2002 |
US |