Device switching using layered device structure

Abstract

A resistive switching device. The device includes a first electrode comprising a first metal material overlying the first dielectric material and a switching material comprising an amorphous silicon material. The device includes a second electrode comprising at least a second metal material. In a specific embodiment, the device includes a buffer material disposed between the first electrode and the switching material. The buffer material provides a blocking region between the switching material and the first electrode so that the blocking region is substantially free from metal particles from the second metal material when a first voltage is applied to the second electrode.

Description

BACKGROUND

The present invention is related to switching devices. More particularly, the present invention provides a structure for a resistive switching memory device. The resistive switching memory device has a reduced on state current to provide improved switching and endurance properties, among others.

The success of semiconductor devices has been mainly driven by an intensive transistor down-scaling process. However, as field effect transistors (FET) approach sizes less than 100 nm, problems such as short channel effect start to prevent proper device operation. Moreover, such sub 100 nm device size can lead to sub-threshold slope non-scaling and also increases power dissipation. It is generally believed that transistor based memories such as those commonly known as Flash may approach an end to scaling within a decade. Flash memory is one type of non-volatile memory device.

Other non-volatile random access memory (RAM) devices such as ferroelectric RAM (Fe RAM), magneto-resistive RAM (MRAM), organic RAM (ORAM), and phase change RAM (PCRAM), among others, have been explored as next generation memory devices. These devices often require new materials and device structures to couple with silicon based devices to form a memory cell, which lack one or more key attributes. For example, Fe-RAM and MRAM devices have fast switching characteristics and good programming endurance, but their fabrication is not CMOS compatible and size is usually large. Switching for a PCRAM device uses Joules heating, which inherently has high power consumption. Organic RAM or ORAM is incompatible with large volume silicon based fabrication and device reliability is usually poor.

From the above, an improved semiconductor memory device and techniques are therefore desirable

BRIEF SUMMARY OF THE PRESENT INVENTION

The present invention is related to switching devices. More particularly, the present invention provides a structure for a resistive switching memory device. The resistive switching memory device has a reduced on state current for improved switching and endurance properties, among others.

In a specific embodiment, a switching device structure is provided. The switching device includes a substrate having a surface region and a first dielectric material overlying the surface region. A first electrode overlies the first dielectric material. In a specific embodiment, the first electrode includes at least a metal material. The switching device includes a switching element and a buffer material disposed between the first electrode and the switching element. In a specific embodiment, the buffer material provides a blocking region between the switching material and the first electrode. The switching device includes a second electrode overlying the switching material. The second electrode includes at least a second metal material in a specific embodiment. In a specific embodiment, the blocking region is substantially free of metal particles formed from the second metal material when a first voltage (for example, a write voltage) is applied to the second electrode. In a specific embodiment, the buffer material prevents a high defect region to form between the switching material and the first electrode.

Many benefits are achieved by ways of present invention over conventional techniques. For example, the present resistive switching device can be fabricated using conventional equipment and processes. In addition, the present device uses a layer structure to reduce an on state current as well as power consumption. The layer structure further prevents an electrical connection between the electrodes and improves device endurance and reliability. Depending on the embodiment, one or more of these benefits may be realized. One skilled in the art would recognize other variations, modifications and alternatives.

SUMMARY OF THE DRAWINGS

FIG. 1 is a simplified diagram illustrating a conventional resistive switching device

FIG. 2 is a simplified diagram illustrating a resistive switching device according to an embodiment of the present invention

FIG. 3 is a simplified diagram illustrating an off state of the resistive switching device according to an embodiment of the present invention.

FIG. 4 is a simplified diagram illustrating an on state of the resistive switching device according to an embodiment of the present invention.

FIGS. 5a and 5b are simplified current versus voltage (I-V) plots of resistance device according to embodiments of the present invention.

FIG. 6 is a simplified I-V plot of a switching device according to an embodiment of the present invention.

FIG. 7 is a simplified plot of a conventional switching device.

DETAILED DESCRIPTION OF THE PRESENT INVENTION

The present invention is related to switching devices. More particularly, the present invention provides a structure for a resistive switching memory device. The resistive switching memory device is characterized by a reduced on state current for improved switching and endurance properties, among others.

Resistive switching memory device using a non-crystalline silicon such as amorphous silicon, amorphous-polysilicon and microcrystalline silicon as a switching material and metal electrodes has shown promises in a new class of high density memory devices for fast switching. As merely for illustration, amorphous silicon is used to describe non-crystalline silicon. The on/off behavior of the device depends on metal particles formed in defect sites within the amorphous silicon material. Due to mismatch of materials, defect level in an interface region formed from the amorphous silicon material and a metal electrode is high. As metal particles are formed in the defect sites of amorphous silicon material, these devices usually have a high on state current. Upon repeated cycling, the high on state current leads to shorting of the electrodes and device reliability and endurance are compromised, usually less than a few thousand on/off cycles. Embodiments according to the present invention provide a method and a structure to optimize on state current and improve endurance to more than 10⁶ on/off cycles, well suitable to be used in current and next generation memory devices.

FIG. 1 is a simplified diagram illustrating a conventional resistive switching device 100. As shown, the conventional resistive switching device includes a first metal electrode 102, a second metal electrode 106, and a switching material 104 sandwiched between the first metal electrode and the second metal electrode. For example, the second metal electrode can include at least a noble metal such as silver, gold, palladium, platinum or other suitable metals depending on the application. The first metal material can include common metals used in semiconductor processing such as tungsten, copper, or aluminum. The switching material used is usually a non-conductive material having defect sites or grain boundaries or non-stoichiometric sites allowing a plurality of metal particles from the second metal electrode to form a metal region 108 when a voltage is applied to the second electrode or the first electrode. The metal region further includes a metal filament structure extending towards the first electrode and preferably not in contact with the first electrode. The metal filament extends in a write or read cycle and retracts during an erase cycle. As shown in FIG. 1, as the number of defect sites is high in an interface region 110 formed from the first metal electrode and the switching material, a high concentration of metal particles has the propensity to form in the interface region. This leads to a large on state current and a low on-state resistance. As the device is cycled through a number of on/off cycles, the metal regions initially formed in a portion of the amorphous silicon material may expand too close to the first metal electrode. The metal filament near the first metal electrode may not retract during erase cycles. The metal particles may even coalesce if the defect density is too high and the electrodes are shorted; resulting in a failed device.

The terms “second” or “first” throughout the present application are for description and illustration only and should not be construed as the physical arrangement of the electrodes.

FIG. 2 is a simplified diagram of a resistive switching device 200 according to an embodiment of the present invention. The resistance switching device is formed overlying a substrate in a specific embodiment. The substrate can be a semiconductor substrate having one or more CMOS devices formed thereon. The one or more CMOS devices are operably coupled to the resistive switching device providing controlling circuitry for the memory device in a specific embodiment. As shown, the resistive switching device includes a first metal electrode 202, a second metal electrode 204, a switching layer 206, and a buffer layer 208. As shown, the buffer layer is disposed between the switching, layer and the first electrode in a specific embodiment.

In a specific embodiment, the first metal electrode can be formed from metal material such as copper, aluminum, or tungsten depending on the application. In a specific embodiment, the first metal electrode can further include one or more adhesion layer or barrier layer to prevent metal from the first electrode to diffusion into other parts of the device or an adhesion layer to prevent the metal material to delaminate from, for example, the dielectric layer, depending on the embodiment.

Referring to FIG. 2, the resistive switching device includes switching layer 206. In a specific embodiment, the switching layer comprises an amorphous silicon material. The amorphous silicon material is undoped or having a semiconductor characteristic in a specific embodiment. In a specific embodiment, the amorphous silicon material includes a plurality of defect sites. The plurality of defect sites can arise from silicon dangling bonds, or atomic dislocations, or crystal plane dislocation, or molecular dislocation, or grain boundaries between silicon crystals depending on the process condition.

Resistive switching device 200 includes second metal electrode 204 overlying the switching layer. The second metal electrode includes a metal material, which has a high diffusivity in the switching material in a specific embodiment. The metal material can be silver, copper, aluminum, or other suitable metal materials, including alloy or a combination. In a specific embodiment, the metal material can be silver for an amorphous silicon material as the switching layer. As silver is not commonly used in silicon processing, the silver material forms just a portion of a wiring structure for the switching device, while other portions of the wiring structure comprises convention conducting material such as tungsten, copper or aluminum in a specific embodiment. In a specific embodiment, the silver material is in contact with the amorphous silicon material.

As described, due to material mismatch between the amorphous silicon material and the first electrode, the defect density at the interface region formed from the first metal electrode and the amorphous silicon material in a conventional structure is high. The silver particles in the filament structure are close to each other resulting in a high on state current. After certain number of on/off cycles, the silver particles may coalesce and the silver particles may not be able to retract in an off cycle forming a short between the second electrode and the first electrode, and the device becomes defective. In a specific embodiment, buffer layer 208 is disposed between the first metal electrode and the switching layer. The buffer layer is provided to prevent an interface region to form from the amorphous silicon material and the first electrode and to control defect density of amorphous silicon and metal particles near the first electrode. The buffer layer is selected to have a good and reliable adhesion with the first electrode as well as the amorphous silicon layer. Additionally, an interface region formed from the amorphous silicon material and the buffer layer should have a small defect density for reliable switching and good endurance. The buffer layer is engineered, for example, by adjusting buffer layer resistance, to provide a suitable on state resistance and power consumption during programming.

Referring to FIG. 3, when a first positive voltage 304 is applied to the second electrode of an as fabricated device, a local electric field is generated and silver particles in various forms, including atoms, ions, or clusters are formed in the amorphous silicon material in a specific embodiment More specifically, silver particles are formed and trapped in detect sites of the amorphous silicon material. The local electric field enhances silver diffusion in the amorphous silicon material and forms a metal region 302 comprises of the silver particles in a specific embodiment. This first positive voltage can be in the range of 4 volts to about 6 volts depending on the process condition of the amorphous silicon material. As shown the metal region is formed in vicinity of the second electrode surface region, and not in contact with the first electrode. In a specific embodiment, the first positive voltage is a forming voltage or electroforming voltage for the switching device. The switching device is in now in an off state.

Referring to FIG. 4, when a second voltage 404 is applied to the second electrode, a filament structure 402 extending from the metal region is formed. As shown, the buffer layer functions as a blocking layer such that the filament structure would not extend to be in contact with the first electrode in a specific embodiment. The second voltage can be, for example, a write voltage for the switching device in a specific embodiment. The switching device is in an on state and an on state current flow s between the second electrode and the first electrode. The on state current is controlled by the length of the filament structure in a specific embodiment. In a specific embodiment, the on state current can range from a few nano amperes to micro amperes, much less than that of a conventional switching device absent of the buffer layer.

In a specific embodiment, for a proper function of a resistive switching device, the buffer layer should have good contact with the first electrode to allow a low contact resistance (or forming an ohmic contact) in a contact region formed from the buffer layer and the first electrode. The low contact resistance avoids excess voltage drop across the contact region in a specific embodiment. FIG. 5(a) illustrates a switching characteristic of a first switching device having a non-ohmic contact (that is, high contact resistance) between the buffer layer and the first electrode. The high contact resistance between the buffer layer and the first electrode suppresses current flow at small bias and certain read operation at low voltage cannot be performed properly. The first switching device is further characterized by a high programming voltage (>5 volts) and may cause an early device failure and high leakage current, among others. FIG. 5(b) illustrates a switching characteristic of a second switching device having a good ohmic contact between the buffer layer and the first electrode or the contact resistance is low. The second switching device exhibits desirable switching characteristic, for example, low programming voltage, between 1-2 volts.

In certain embodiments, the buffer layer can include an insulating layer. The insulating layer should be thin, for example less than about 2 nm, so that electrons can tunnel across the thin insulating buffer layer from a conducting metal region, for example, silver particles in the switching layer and the first electrode. Electron tunneling allows for the device to be in an on state when a suitable voltage is applied to the electrodes. Electron tunneling also allows for proper read operation of the device when a small bias voltage is applied. The contact resistance between such buffer layer and the first electrode may not be as critical in a specific embodiment.

In a specific embodiment, the buffer layer can include a material having a higher density than the amorphous silicon material to prevent silver particles from being injected into the buffer layer and forming conducting filament in the buffer layer. In an alternative embodiment, the buffer layer can be conductive having a large thickness (for example, about 20 nm or greater). Of course one skilled in the art would recognize other variations, modifications, and alternatives.

It has been observed that resistive switching devices using amorphous silicon as the switching material and silver as the second electrode can have vastly different switching characteristics depending on the deposition process of amorphous silicon material. When the amorphous silicon material is formed using a sputtering process, a high voltage, greater than about 8 volts is required to read, to write or to erase. This suggests that silver particles do not form easily in the sputtered amorphous silicon at normal device operation voltage. Sputtered amorphous silicon contains an insignificant amount of hydrogen and tends to have a high density. Hence a thin (preferably less than 5 nm) sputtered amorphous silicon can be used as the buffer layer in a specific embodiment.

For amorphous silicon formed using a plasma enhanced chemical vapor deposition (PECVD) or a low pressure chemical vapor deposition (LPCVD) process and silane as a silicon source, switching voltages are usually lower, ranging from one to four volts, depending on the process conditions. Amorphous silicon material formed by a CVD process using slime contains hydrogen, which can diffuse or migrate in and out of the silicon matrix, leaving void sites in the material. Silver particles can occupy these void sites or defect sites and allow to migrate upon application of a voltage. It has also been observed that devices merely uses a metal/amorphous silicon/metal configuration have a low on/off endurance, that is such device fails after at most a few thousand on/off cycles.

As merely an example, the buffer layer can include a polysilicon material. The polysilicon material is preferably p+ doped and having an impurity concentration ranging from about 10¹⁸ to about 10²² atoms per cm³. As shown in FIG. 6, a current versus voltage (I-V) plot 600 of a third switching device is provided. The third switching device has a silver/amorphous silicon/p+ polysilicon device structure. The amorphous silicon material in the third switching device is deposited using a low pressure chemical vapor deposition process at a deposition temperature of about 510 Degree Celsius using silane as a silicon source.

FIG. 7 illustrates an I-V plot 700 measured from a fourth switching device having a conventional silver/amorphous silicon/nickel device structure. The amorphous silicon in the second switching device is deposited using a plasma enhanced chemical vapor deposition process at a deposition temperature of about 370 Degree Celsius. Both the third switching device and the fourth switching device have a cell size of about 60 nm by 60 nm. Typically, amorphous silicon material deposited at 370 Degree Celsius by a CVD method has a much lower defect density than one deposited at 510 Degree Celsius. The fourth device is thus expected to have a lower on state current than that of the third switching device. However, as the defect density is higher at the interface region formed by the amorphous silicon and the first metal material, nickel in this case, the on state current of the fourth device (plot 700) is much higher, in mA range, than that of the third device (plot 600). High current is not desirable as it results in an unreliable device operation. The polysilicon buffer layer in the third switching device prevents excess defect density near the first electrode, and the programming current is much lower, in the uA range, as shown in plot 600. Additionally, the polysilicon buffer layer can be modified easily, by changing its thickness or conductivity to control the programming current and further enhance device performance. One skilled in the art would recognize other variations, modifications, and alternatives.

In a specific embodiment, a method of forming a resistive switching device is provided. The method includes providing a semiconductor substrate having a surface region. The semiconductor substrate can have one or more CMOS devices formed thereon. The semiconductor substrate can be single crystal silicon material, silicon germanium, silicon on insulator, and the likes. A first dielectric material is formed overlying the surface region. The first dielectric material can be silicon oxide, silicon nitride, silicon oxynitride, and others. The first dielectric material can be deposited using techniques such as chemical vapor deposition including plasma enhanced chemical vapor deposition, physical vapor deposition, spin on coating, and any combinations of these, and others.

In a specific embodiment, the method includes forming a first electrode overlying the first dielectric material. The first electrode is formed from a conductor material commonly used in semiconductor processing. The conductor material can include tungsten, copper, or aluminum depending on the application. The first electrode can include one or more adhesion layer or diffusion barrier. The adhesion layer may be titanium, titanium nitride, tantalum nitride, or tungsten nitride to prevent diffusion of the conductor material into the first dielectric material in a specific embodiment. Depending on the application, the conductor material can be deposited using a physical vapor deposition process, a chemical vapor deposition process, electrochemical including electroplating and electroless plating, and combination thereof. The conductor material including the adhesion layer is subjected to a pattern and etch process to form a first electrode. In a specific embodiment, the first structure is configured to extend in a first direction. Of course one skilled in the art would recognize other variations, modifications, and alternatives.

The method includes depositing a buffer layer overlying the first electrode in a specific embodiment. The buffer layer should have properties to allow desirable switching characteristic for the switching device. The buffer layer should also form a reliable interface with selected switching material used in the switching device. A high density material may be used to prevent metal particles to inject into the buffer layer. The buffer layer can be a conductive material or an insulating material depending on the embodiment. A conductive buffer layer can include a p-doped silicon material such as p+ polysilicon material in a specific embodiment. An insulating buffer layer should have a thickness less than about 5 nm so that electrons can tunnel through at operating voltages (between 1-3 volts).

For an amorphous silicon material as switching material, a polysilicon material can be used for the buffer layer. The polysilicon material is preferably having a p+ type impurity characteristic, which may be provided using a boron species in a specific embodiment. The p+ polysilicon material may be deposited using a chemical vapor deposition technique using at least silane, disilane, or a suitable chlorosilane as precursor.

The method forms a switching material overlying the buffer material. As merely an example, the switching material is an amorphous silicon material deposited using techniques such as chemical vapor deposition using silane, disilane, or chlorosilane as silicon source. Deposition temperatures is usually at about 250 Degree Celsius to about 600 Degree Celsius depending on the embodiment. Process parameters and process conditions greatly influence defect density in the amorphous silicon material and switching behavior of the switching device. Therefore, the use of amorphous silicon switching material provides flexibility in device design in a specific embodiment.

In a specific embodiment, the method includes depositing a second electrode material overlying the switching material. The second electrode material has a first portion that includes a metal material in direct contact with the switching material. The metal material is preferably having a suitable diffusion characteristic in the amorphous silicon material in a preferred embodiment. The metal material can be silver in a specific embodiment. Other suitable metal materials may also be used. These other materials can include platinum, palladium, gold, copper, nickel, and others. The second electrode material further includes a second portion for electrical connection with other devices. The second portion can be selected from tungsten, copper, or aluminum, commonly used in semiconductor processing. The method forms a second electrode structure by a suitable pattern and etch process. In a specific embodiment, the second electrode structure is configured to extend in a second direction at an angle to the first direction. In a preferred embodiment the second electrode structure and the first electrode structure are arranged orthogonal to each other having a switching element sandwiched at an intersecting region formed from the second electrode and the first electrode. One skilled in the art would recognized other variations, modifications, and alternatives.

The method then performs other backend processes such as global interconnects and passivation among others to form a resistive switching memory device.

Though the present invention has been described using various examples and embodiments, it is also understood that the examples and embodiments described herein are for illustrative purposes only and that various modifications or alternatives in light thereof will be suggested to persons skilled in the art and are to be included within the spirit and purview of this application and scope of the appended claims

Claims

1. A semiconductor device, comprising: a semiconductor substrate;at least one CMOS device formed upon the semiconductor substrate;an insulating layer disposed upon the CMOS device;a first wiring structure disposed upon the insulating layer and coupled to the at least one CMOS device, wherein the first wiring structure comprises a first metal material;a buffer material coupled to the first wiring structure;a non-stoichiometric switching material disposed adjacent to and touching the buffer material, wherein the non-stoichiometric switching material comprises a material having a plurality of non-stoichiometric defect sites; anda second wiring structure disposed adjacent to and touching the non-stoichiometric switching material comprising a first portion and a second portion, wherein the first portion is disposed adjacent to and touching the non-stoichiometric switching material, wherein the first portion comprises a second metal material having a plurality of metal particles, wherein at least some metal particles from the plurality of metal particles are movably disposable within non-stoichiometric defect sites from the plurality of non-stoichiometric defect sties;wherein the buffer material separates and prevents the first wiring structure from touching the non-stoichiometric switching material, and wherein the buffer material is substantially free from metal particles from the first portion of the second wiring structure.

2. The device of claim 1, wherein the buffer material, the non-stoichiometric switching material and the second wiring structure form a resistive switching device; andwherein the at least one CMOS device comprises a portion of a control circuit for the resistive switching device.

3. The device of claim 1, wherein a defect density of the plurality of non-stoichiometric defect sites within the non-stoichiometric switching material exceeds a defect density of buffer material defect sites within the buffer material.

4. The device of claim 3, wherein the plurality of non-stoichiometric defect sites within the non-stoichiometric switching material are selected from the group consisting of: dangling bonds, atomic dislocations, crystal plane dislocation, molecular dislocation, and grain boundaries.

5. The device of claim 1, wherein the second metal material is selected from the group consisting of: silver, aluminum, a metal alloy, platinum, palladium, and nickel.

6. The device of claim 1, wherein the metal particles from the plurality of metal particles are selected from the group consisting of: aluminum, platinum, palladium and nickel.

7. The device of claim 1, wherein the second portion of the second wiring structure comprises tungsten.

8. The device of claim 1, wherein the buffer material comprises a conductive material; andwherein the buffer material remains substantially free from metal particles from the plurality of metal particles.

9. A method for forming a semiconductor device comprising: receiving a semiconductor substrate having at least one CMOS device formed thereon and having an insulating layer disposed upon the at least one CMOS device;forming a first electrode upon the insulating layer and coupled to the at least one CMOS device, wherein the first wiring structure comprising a first metal material;forming a buffer material coupled to the first electrode;forming a non-stoichiometric switching material adjacent to and touching the buffer material, wherein the non-stoichiometric switching material comprises a material having a plurality of non-stoichiometric defect sites;forming a second electrode coupled to the non-stoichiometric switching material, wherein the second electrode comprises a first portion and a second portion, wherein the first portion is disposed above and touching the non-stoichiometric switching material, wherein the first portion comprises a second metal material characterized by a high diffusivity in the non-stoichiometric switching material, wherein the second portion is coupled to the first portion and comprises a conductive material;wherein the plurality of non-stoichiometric defect sites is configured to releasably trap metal particles derived from the second metal material from the first portion of the second wiring structure; andwherein the buffer material separates the first wiring structure and the non-stoichiometric switching material.

10. The method of claim 9, wherein the buffer material, the non-stoichiometric switching material and the second electrode form a resistive switching device; andwherein the at least one CMOS device comprises a control circuit for the resistive switching device.

11. The method of claim 9, wherein a defect density of the plurality of non-stoichiometric defect sites of the non-stoichiometric switching material exceeds a defect density of buffer defect sites of the buffer material.

12. The method of claim 9, wherein the metal particles derived from the second metal material are selected from the group consisting of: silver, aluminum, platinum, palladium and nickel.

13. The method of claim 9, wherein the second metal material is selected from the group consisting of: aluminum, a metal alloy, platinum, palladium and nickel.

14. The method of claim 9, wherein the conductive material of the second portion of the second electrode comprises tungsten.

15. The method of claim 9, wherein the buffer material has a thickness of less than 5 nm or greater than 20 nm.

16. The method of claim 9, wherein forming the non-stoichiometric switching material comprises performing a deposition process.

17. A method for a semiconductor device having a resistive switching device comprising a first electrode adjacent to and touching a resistive switching material that is adjacent to and touching a buffer material, which comprises: applying a first voltage to the first electrode comprising a first metal material to allow a plurality of metal particles from the first metal material to diffuse into the resistive switching material and to form a conductive region therein;removing the first voltage from the first electrode wherein the plurality of metal particles become trapped within defect sites of the resistive switching material; andapplying a second voltage to the first electrode to form a metal filament structure from the plurality of metal particles extending from the first electrode towards the second electrode, wherein the buffer material inhibits the metal filament from contacting a second electrode of the resistive switching device;wherein the resistive switching material comprises a non-stoichiometric switching material; andwherein metal particles from the plurality of metal particles are selected from the group consisting of: aluminum, platinum, palladium and nickel.

18. The method of claim 17, wherein the second voltage is selected from the second group consisting of: a write voltage and a read voltage.

19. The method of claim 17, wherein the second voltage is a read voltage; andwherein the method comprises determining a current flow through the resistive switching device in response to the read voltage.

20. The method of claim 17, further comprising performing an erase cycle to thereby retract the metal filament structure away from the second electrode and towards the first electrode.