Patent Application
20170265300
The disclosure generally relates to printed circuit boards, and particularly to double-sided printed circuit board and methods for manufacturing such double-sided printed circuit board.
Miniaturization is a constant goal, thereby leading to the application of double-sided printed circuit boards to achieve higher density and performance.
A typical method for manufacturing the double-sided printed circuit board includes the following steps. Firstly, a ceramic substrate with through holes in preset positions is provided. Secondly, a metal layer is plated on an inner surface of each of the through holes to make the through holes be conductive. Thirdly, two circuit layers are disposed on two opposite surfaces of the ceramic substrate with liquid metal. However, liquid metal is difficult to deposit on the inner surfaces of the through holes because of the through holes are mostly perpendicular to the surfaces of the ceramic substrate.
A double-sided printed circuit board can also be manufactured by setting bonding pads on two opposite sides of each of the through holes and filling the through holes with conductive materials. However, the conductive materials are molten, thus oxidation of the components on the ceramic substrate is likely.
Different methods of manufacturing double-sided printed circuit board would be beneficial.
The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the present disclosure. Moreover, in the drawings, like reference numerals designate corresponding parts throughout several views.
It will be appreciated that for simplicity and clarity of illustration, where appropriate, reference numerals have been repeated among the different figures to indicate corresponding or analogous elements. In addition, numerous specific details are set forth in order to provide a thorough understanding of the embodiments described herein. However, it will be understood by those of ordinary skill in the art that the embodiments described herein can be practiced without these specific details. In other instances, methods, procedures, and components have not been described in detail so as not to obscure the related relevant feature being described. Also, the description is not to be considered as limiting the scope of the embodiments described herein. The drawings are not necessarily to scale and the proportions of certain parts have been exaggerated to better illustrate details and features of the present disclosure.
The term “comprising,” when utilized, means “including, but not necessarily limited to”; it specifically indicates open-ended inclusion or membership in the so-described combination, group, series and the like.
In the embodiment of the disclosure, each of the two opposite surfaces has a circuit layer 1a plated thereon, the circuit layer 1a is used with fixing devices to solder or otherwise fix external electronic components thereto. In general practice, circuits are formed on ceramic substrate by means of electroplating. However, the ceramic substrate 1 is an insulator, thus in an embodiment, the circuit layer 1a comprises a first metallic layer 4 sputtered on each of the two opposite surfaces and a second metallic layer 6 electroplated on the first metallic layer 4. In the process of electroplating, the first metallic layer 4 can be sputtered on each of the two opposite surfaces at first, the first metallic layer 4 can be used as a seed layer, and then the second metallic layer 6 can be electroplated on the first metallic layer 4. The circuit layer 1a is formed by the first metallic layer 4 and the second metallic layer 6 together.
Conductive thick-film paste 3 is infilled in the through hole 2 and fired to form a conductive column, one end of the conductive column connects to one circuit layer to achieve electrical connection between the two circuit layers 1a. The conductive paste 3 may optimally be conductive ink. By thermo-curing, the conductive ink can be formed into compact conductive column tightly joined with the inner surface of the through hole 2, providing high reliability.
In an illustrated embodiment, the double-sided printed circuit board further comprises a protective film 7 formed on the circuit layers 1a. The protective film 7 may be made of Ni, or Au, or an alloy of Ni and Au.
The double-sided printed circuit board of the disclosure has improvements in at least the following aspects:
1) Processing sequence can be adjusted to reduce the process requirements. The conductive paste being infilled and thermo-cured in the through hole 2 before the electroplating of the circuit layer 1a, the liquid metal for electroplating is thus prevented from entering the through hole 2 by the presence of the conductive column.
2) Ceramic substrate 1 has reliable insulation performance and good capability of heat dissipation.
3) The conductive ink can be formed into a compact conductive column and tightly joined with the inner surface of the through hole 2, contributing to high reliability during use.
As shown in
In step S1, referring to
In step S2, referring to
In an exemplary embodiment of the disclosure, the step S2 may specifically comprise steps S201 and S202 as follows.
In step S201, the conductive paste 3 is infilled in the through hole 2 with a stencil.
In step S202, the conductive paste 3 is thermo-cured to form a joint along and within the inner surface of the through hole.
In step S3, a circuit layer 1a is formed on each of the two opposite surfaces of the ceramic substrate 1, each circuit layer 1a is electrically connected to the fired conductive thick-film paste 3.
In another exemplary embodiment of the disclosure, the step S3 may specifically comprise steps S301 to S305 as follows.
In step S301, referring to
In step S302, referring to
In step S303, referring to
In step S304, referring to
An exemplary embodiment of the disclosure further comprises step S305 after step S304, as follows.
In step S305, referring to
The through hole 2 is fully infilled with the conductive paste 3, preventing the liquid metal for electroplating from entering the through hole 2, thereby avoiding pollution to the procedure afterwards or malfunction of the circuit layer 1a. Furthermore, the procedure of infilling the conductive paste 3 can be directly observed and controlled, ensure reliable creation of the electrical connection between the two circuit layers 1a.
Although the features and elements of the present disclosure are described as embodiments in particular combinations, each feature or element can be used alone or in other various combinations within the principles of the present disclosure to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.
| Number | Date | Country | Kind |
|---|---|---|---|
| 201610129795.5 | Mar 2016 | CN | national |
