Edge Coating a Microelectronic Device

Abstract

A microelectronic device includes a die having an active surface and a non-active surface. To assemble the microelectronic device, the active surface of the die is placed on a substrate. A first material is dispensed between the active surface of the die and the substrate. A second material is dispensed on at least a portion of the non-active surface of the die. The second material is different than the first material and the first material and the second material are simultaneously cured.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 illustrates perspective view of a disc drive.

FIG. 2 illustrates a plan view of the flexible circuit assembly illustrated in FIG. 1.

FIG. 3 illustrates a top plan view of a microelectronic device in accordance with the prior art.

FIG. 4 illustrates a partial sectional view of the microelectronic device of FIG. 3.

FIG. 5 illustrates a top plan view of a microelectronic device in accordance with the present invention.

FIG. 6 illustrates a partial sectional view of the microelectronic device of FIG. 5.

FIG. 7 is a flowchart illustrates the process of assembling the microelectronic device illustrated in FIGS. 5 and 6.

Claims

1. A method of assembling a microelectronic device comprising. providing a die having an active surface and a non-active surface;placing the active surface of the die on a substrate;dispensing a first material between the active surface of the die and the substrate;dispensing a second material on at least a portion of the non-active surface of the die, wherein the second material is different than the first material; andsimultaneously curing the first material and the second material.

2. The method of claim 1, wherein providing the die comprises providing a plurality of side walls about a perimeter of the die and between the active and non-active surfaces, wherein the side walls form non-active edges with the non-active surface.

3. The method of claim 2, wherein dispensing the second material on at least a portion of the non-active surface of the semiconductor die comprises dispensing the second material on the non-active side edges of the die.

4. The method of claim 1, wherein placing the active surface of the die on the substrate comprises placing the active surface of the die on a flexible circuit assembly located in an enclosure of an electronic device.

5. The method of claim 4, wherein the electronic device comprises a data storage system.

6. The method of claim 1, wherein providing a die comprises providing a semiconductor die made of silicon.

7. The method of claim 6, wherein providing the semiconductor die comprises providing a preamplifier integrated circuit.

8. The method of claim 1, further comprising depositing a plurality of conductive bumps on the active surface of the die prior to placing the active surface of the die on the substrate.

9. The method of claim 8, further comprising heating the conductive bumps after placing the active surface of the die on the substrate such that the bumps make an electrical connection with a corresponding plurality of electrical leads on the substrate.

10. A microelectronic device comprising: a die having an active surface and a non-active surface, the active surface of the die configured to be placed on a substrate;a first material deposited between the active surface of the die and the substrate;a second material deposited on at least a portion of the non-active surface of the die, wherein the first material is different than the second material and wherein the first material and second material are simultaneously cured.

11. The microelectronic device of claim 10, wherein the die comprises a plurality of sidewalls positioned about a perimeter of the die and between the active and the non-active surfaces, wherein the sidewalls form non-active side edges with the non-active surface.

12. The microelectronic device of claim 11, wherein the second material is deposited on the non-active side edges of the die.

13. The microelectronic device of claim 10, wherein the substrate comprises a flexible circuit assembly.

14. The microelectronic device of claim 10, wherein the substrate is included in an enclosure of an electronic device.

15. The microelectronic device of claim 14, wherein the electronic device comprises a data storage system.

16. The microelectronic device of claim 10, wherein the die comprises a preamplifier integrated circuit.

17. A microelectronic device comprising: a die including: an active surface;a non-active surface configured to be placed on a substrate;a plurality of sidewalls positioned about a perimeter of the die and between the active and non-active surfaces, the plurality of sidewalls form non-active side edges with the non-active surface;means for bonding the active surface of the semiconductor die to the substrate and for coating the non-active side edges of the semiconductor die with a single cure.

18. The microelectronic device of claim 17, wherein the substrate comprises a flexible circuit assembly.

19. The microelectronic device of claim 18, wherein the flexible circuit assembly is located in an enclosure of an electronic device.

20. The microelectronic device of claim 19, wherein the electronic device comprises a data storage system.