Patent Application
20080311313
The present invention relates a technology for forming a fluorine-added carbon film (fluorocarbon film) by utilizing plasma.
As one approach for achieving highly integrated semiconductor devices, a multilayered wiring structure has been employed. In order to take a form of such a multilayered wiring structure, each pair of adjacent wiring layers are connected via an electrically conductive layer while a thin film which is called “interlayer isolation film” is formed in areas other than the conductive layer. As a typical example of the interlayer isolation film, a silicon oxide film is usually known. However, there is a need for reducing the dielectric constant of the interlayer isolation film in order to make the operating speed of the device significantly higher.
In such a situation, a fluorine-added carbon film which can reduce the dielectric constant to a greater extent as compared with the silicon oxide film has attracted significant attention. The fluorine-added carbon film is formed from film-forming species to be obtained by changing a row-material gas consisting of carbon (C) and fluorine (F) into plasma. As the row-material gas, C4F8 gases or C5F8 gases are known. It has been found that the use of the C5F8 gas makes it easier that the decomposed products create a three-dimensional structure and renders the C—F bond significantly strong. As a result, an interlayer insulation film, which has a lower dielectric constant, generates a lower leak current, and is excellent in the heat stability, can be obtained.
In JP11-162960A, a technology for forming a fluorine-added carbon film by using a cyclicly structured C5F8 gas as a row-material gas is described. Specifically, a plasma generating gas, such as an Ar gas, is changed into plasma by electron cyclotron resonance (ECR), and a C5F8 gas is then activated by the so-produced plasma, so as to form a fluorine-added carbon film onto a semiconductor wafer (hereinafter, referred to as a wafer).
However, even in the case of using the C5F8 gas as the raw-material gas, it has been recognized that the film properties including the leak current, heat stability and the like are often changeable among the films formed. The inventors consider that the film properties of the fluorine-added carbon film are highly related to the film forming conditions. Specifically, we recognize that film-forming species to be formed from the C5F8 gas can vary with the film forming conditions, and the film properties may change depending on the difference in such film species. Accordingly, we consider that by rendering the film forming conditions more appropriate, a fluorine-added carbon film having superior film properties can be obtained.
The present invention was made in such a situation, and it is therefore an object of this invention to provide a plasma film forming method or plasma film forming apparatus, which can form a fluorine-added carbon film having superior properties, such as the leak properties and heat stability, by producing desired film species by rendering the film forming conditions more appropriate. It is also an object of the present invention to provide a storage medium which stores a program for controlling the plasma film forming apparatus such that it can perform the intended film forming process.
To achieve the object described above, the present invention provides a plasma film forming method for forming a fluorine-added carbon film, from film-forming species containing C4F6 or C4F5 obtained by activating a raw-material gas of a compound consisting of carbon and fluorine and having one triple bond, one or more double bonds or conjugated double bond, based on energy of a microwave,
wherein the raw-material gas is activated to make a concentration of the raw-material gas after activation in the range of from 0.05 times to 0.5 times a concentration of the raw-material gas before activation.
For example, the compound having one triplet bond is Octafluoropentyne. For example, the compound having one or more double bonds is selected from the group consisting of Octafluorocyclopentene, Decafluorocyclohexene, Octafluorocyclohexadiene. For example, the compound having conjugated double bond is Octafluoropentadiene.
The present invention also provides a plasma film forming apparatus for forming a fluorine-added carbon film on a surface of a substrate, from film-forming species containing C4F6 or C4F5 obtained by activating a raw-material gas of a compound consisting of carbon and fluorine and having one triple bond, one or more double bonds or conjugated double bond, based on energy of a microwave, the apparatus comprising:
an airtight processing vessel in which a table for placing the substrate thereon is provided;
an exhaust system configured to discharge an atmosphere in the processing vessel;
a raw-material gas supply system configured to supply the raw-material gas into the processing vessel at a controlled flow rate;
a raw-material gas supply member having a face opposed to the table, the opposed face being formed with raw-material gas supply holes, the raw-material gas supply member being configured to discharge the raw-material gas supplied from the raw-material gas supply system into the processing vessel via the supply holes;
a radial line slot antenna provided opposing to the table;
a microwave supply system configured to supply a microwave to the antenna at a controlled power; and
a controller configured, upon forming the film, to control the exhaust system, the raw-material gas supply system and the microwave supply system to activate the raw-material gas to make a concentration of the raw-material gas after activation in the range of from 0.05 times to 0.5 times a concentration of the raw-material gas before activation.
The present invention also provides a plasma film forming apparatus for forming a fluorine-added carbon film on the surface of a substrate, from film-forming species containing C4F6 or C4F5 obtained by activating a raw-material gas of a compound consisting of carbon and fluorine and having one triple bond, one or more double bonds or conjugated double bond, based on energy of a microwave, the apparatus comprising:
an airtight processing vessel in which a table for placing the substrate thereon is provided;
an exhaust system configured to discharge an atmosphere in the processing vessel;
a raw-material gas supply system configured to supply the raw-material gas into the processing vessel at a controlled flow rate;
a raw-material gas supply member having a face opposed to the table, the opposed face being formed with raw-material gas supply holes, the raw-material gas supply member being configured to discharge the raw-material gas supplied from the raw-material gas supply system into the processing vessel via the supply holes;
a discharge gas supply system configured to supply a discharge gas into the processing vessel at a controlled flow rate;
a discharge gas supply member having a face opposed to the table, the opposed face being formed with discharge gas supply holes, the discharge gas supply member being configured to discharge the discharge gas supplied from the discharge gas supply system into the processing vessel via the supply holes;
a radial line slot antenna provided opposing to the table; and
a microwave supply system configured to supply a microwave to the antenna at a controlled power,
wherein the distance between the surface of the substrate on the table and the opposed face of the raw-material gas supply member is in the range of from 70 mm to 105 mm,
wherein the distance between the surface of the substrate on the table and the opposed face of the discharge gas supply member is in the range of from 100 mm to 140 mm, and
wherein the apparatus further comprises a controller configured, upon forming the film, to control the exhaust system, the raw-material gas supply system and the discharge gas supply system to make a pressure in the processing vessel in the range of from 7.32 Pa to 8.65 Pa as well as to control the microwave supply system to make the power of the microwave supplied to the antenna member in the range of from 2000W to 2300W.
It should be appreciated that unlike the raw-material gas, the “discharge gas” is a gas of a material which does not generate a deposit by itself even when changed into plasma, and, for example, the argon gas or krypton gas can be mentioned as the discharge gas.
In the present invention, the expression of “activating a raw-material gas based on energy of a microwave” is contemplated to include both of the case in which the raw-material gas itself is activated by directly changing it into plasma by using energy of a microwave and the case in which the discharge gas is first changed into plasma by using energy of a microwave and the raw-material gas is then activated by the discharged gas having been changed into plasma.
The present invention also provides a storage medium for use in forming a fluorine-added carbon film on the surface of a substrate, from film-forming species containing C4F6 or C4F5 obtained by activating a raw-material gas of a compound consisting of carbon and fluorine and having one triple bond, one or more double bonds or conjugated double bond, based on energy of a microwave, by using a plasma film forming apparatus comprising:
an airtight processing vessel in which a table for placing the substrate thereon is provided;
an exhaust system configured to discharge an atmosphere in the processing vessel;
a raw-material gas supply system configured to supply the raw-material gas into the processing vessel at a controlled flow rate;
a raw-material gas supply member having a face opposed to the table, the opposed face being formed with raw-material gas supply holes, the raw-material gas supply member being configured to discharge the raw-material gas supplied from the raw-material gas supply system into the processing vessel via the supply holes;
a radial line slot antenna provided opposing to the table; and
a microwave supply system configured to supply a microwave to the antenna at a controlled power,
wherein the storage medium stores therein a program configured to control the exhaust system, the raw-material gas supply system and the microwave supply system to activate the raw-material gas to make a concentration of the raw-material gas after activation in the range of from 0.05 times to 0.5 times a concentration of the raw-material gas before activation.
The present invention also provides a storage medium for use in forming a fluorine-added carbon film on the surface of a substrate, from film-forming species containing C4F6 or C4F5 obtained by activating a raw-material gas of a compound consisting of carbon and fluorine and having one triple bond, one or more double bonds or conjugated double bond, based on energy of a microwave, by using a plasma film forming apparatus comprising:
an airtight processing vessel in which a table for placing the substrate thereon is provided;
an exhaust system configured to discharge an atmosphere in the processing vessel;
a raw-material gas supply system configured to supply the raw-material gas into the processing vessel at a controlled flow rate;
a raw-material gas supply member having a face opposed to the table, the opposed face being formed with raw-material gas supply holes, the raw-material gas supply member being configured to discharge the raw-material gas supplied from the raw-material gas supply system into the processing vessel via the supply holes;
a discharge gas supply system configured to supply a discharge gas into the processing vessel at a controlled flow rate;
a discharge gas supply member having a face opposed to the table, the opposed face being formed with discharge gas supply holes, the discharge gas supply member being configured to discharge the discharge gas supplied from the discharge gas supply system into the processing vessel via the supply holes;
a radial line slot antenna provided opposing to the table; and
a microwave supply system configured to supply a microwave to the antenna at a controlled power,
wherein the distance between the surface of the substrate on the table and the opposed face of the raw-material gas supply member is in the range of from 70 mm to 105 mm,
wherein the distance between the surface of the substrate on the table and the opposed face of the discharge gas supply member is in the range of from 100 mm to 140 mm, and
wherein the storage medium stores therein a program configured to control the exhaust system, the raw-material gas supply system and the discharge gas supply system to make a pressure in the processing vessel in the range of from 7.32 Pa to 8.65 Pa as well as to control the microwave supply system to make the power of the microwave supplied to the antenna member in the range of from 2000W to 2300W.
According to the present invention, film-forming species containing the C4F6 and/or C4F5 at a higher content can be obtained selectively from decomposition of the raw-material gas by rendering the activated state of the raw-material gas due to plasma more appropriate. By forming a film using such film-forming species, a fluorine-added carbon film which has excellent properties including the leak properties and heat stability can be obtained.
Hereinafter, one embodiment of a plasma film forming apparatus according to the present invention will be described. This plasma film forming apparatus is a chemical vapor deposition (CVD) apparatus configured to generate plasma by using a radial line slot antenna (RLSA). The plasma film forming apparatus shown in
In the processing vessel 1, a table 11 for placing a wafer (substrate) W thereon is provided at approximately the center of the bottom face via an insulating material 11a. The table 11 consists of aluminum nitride (AlN) or oxidized aluminum (Al2O3), for example. In the interior of the table 11, a cooling jacket 11b configured to circulate a cooling medium therein as well as a heater (not shown) constituting a temperature control system together with the cooling jacket 11b are provided. The top face of the table 11b is configured as an electrostatic chuck. In the table 11, an electrode (not shown), to which a high frequency power source 12 for 13.56 Hz bias, for example, is connected, is incorporated, so as to draw ions existing in plasma therein with a higher vertical directivity, by bringing the surface of the table 11 into a negative potential due to the biasing high frequency.
The ceiling of the processing vessel 1 is covered airtightly with a discharge gas supply member 2 formed from aluminum oxide, for example, and having a generally disk-like shape. In the bottom face of the discharge gas supply member 2, which is opposed to the table 11, a plurality of discharge gas supply holes 21 are formed. The gas supply holes 21 are respectively in fluid communication with a discharge gas supply passage 23, via a gas flowing passage 22 formed in the supply member 2. The discharge gas supply passage 23 is connected with an argon (Ar) gas supply source 24, the argon gas being used as a discharge gas, as well as connected with a hydrogen (H2) gas supply source 25. The respective gasses supplied from the supply sources 24, 25 travel through the discharge gas supply passage 23 and gas flowing passage 22, and are discharged uniformly from the gas supply holes 21 toward the space below the supply member 2. The distance L2 between the bottom face (opposed face) of the discharge gas supply member 2 and the surface of a wafer W placed on the table 11 is set within the range of 100 mm to 140 mm.
Between the table 11 and the discharge gas supply member 2, a raw-material gas supply member 3 is provided, which has a generally disk-like shape and is formed from a conductor, such as an aluminum alloy containing magnesium (Mg), aluminum-added stainless steel and the like. The raw-material gas supply member 3 divides the interior space of the processing vessel 1 into an upper plasma generation space S1 and a lower processing space S2. In the bottom face of the supply member 3, which is opposed to the table 11, a plurality of raw-material gas supply holes 31 are formed. As is also shown in
As is also shown in
In
On the discharge gas supply member 2, a cover plate 13 is airtightly attached, which is formed of a dielectric, such as aluminum oxide. Further, on the cover plate 13, an RLSA 4 is provided. The RLSA 4, as is also shown in
The RLSA 4 constructed as described above is mounted to the processing vessel 1 via a sealing member (not shown) such that the plane antenna member 42 is closely contacted with the cover plate 13. The RLSA 4 is connected with a microwave generator 45 which is power-controllable via a coaxial wave guide 44. With the wave guide 44 and microwave generator 45, a microwave supply system 9 is configured to supply a 2.45 GHz or 8.3 GHz microwave, for example, to the RLSA 4 at a controlled power. A wave guide 44A disposed outside the coaxial wave guide 44 is connected with the antenna body 41, and an inner central conductor 44B extends through the lagging plate 43 and is connected with the plane antenna member 42.
The plane antenna member 42 is formed of a copper plate with a thickness of approximately 1 mm, for example, in which many slot portions 46 are formed as shown in
Specifically, the slot length of each slot 46a, 46b is sized to be less than half of the wave length of the microwave on the side of the coaxial wave guide 44 in the plane antenna member 42, but larger than half of the wave length of the microwave on the side of the plasma generation space S1 in the plane antenna member 42. Consequently, while the microwave can enter the plasma generation space S1 through each slot portion 46, the microwave once entered the plasma generation space S1 can not return therefrom to the space on the side of the coaxial wave guide 44. At the bottom face of the plane antenna member 42, a plurality of slit portions 46 are arranged concentrically, with the interval in the radial direction between the slit portions 46 being set at half of the wave length of the microwave on the side of the coaxial wave guide 44, for example.
To the bottom of the processing vessel 1, an exhaust pipe 14 is connected, the exhaust pipe 14 being connected in turn with a vacuum pump 50 via an exhaust gas pressure controller 51. With the exhaust pipe 14, vacuum pump 50 and exhaust gas pressure controller 51, an exhaust system 5 is configured to discharge the atmosphere in the processing vessel 1 at a controlled exhaust pressure.
This plasma film forming apparatus further comprises a controller 6 for controlling the exhaust system 5 (exhaust gas pressure controller 51), raw-material gas supply system 8 (MFC 103), discharge gas supply system 7 (MFC 101, 102) and microwave supply system 9 (microwave generator 45). In addition, the controller 6 also controls the high frequency power source 12, valves V1 to V3 and the like. The controller 6 performs a control program produced to carry out formation of a fluorine-added carbon film under predetermined film forming conditions. Such a program may be stored in a storage medium, such as a flexible disk, compact disk, flash memory, MO (Magneto-Optical Disk) or the like.
Next, the plasma film forming method of the present invention, which is carried out by using the aforementioned apparatus, will be described.
First, a wafer W having aluminum wires formed on its surface, for example, is carried in the processing vessel 1 and placed on the table 11. Subsequently, while discharging the atmosphere in the processing vessel 1 by using the exhaust system 5, the Ar gas is supplied at a flow rate of 300 sccm, for example, through the discharge gas supply member 2 from the discharge gas supply system 7, and the C5F8 gas is supplied at a flow rate of 150 sccm, for example, through the raw-material gas supply member 3 from the raw-material gas supply system 8, into the processing vessel 1, respectively. Thereafter, the internal space of the processing vessel 1 is maintained at a predetermined processing pressure, for example, within the range of from 7.32 Pa (55 mTorr) to 8.65 Pa (65 mTorr), for example, 7.7 Pa. The surface temperature of the table 11 is elevated, in advance, up to 380° C.
On the other hand, a microwave of 2.45 GHz and 2000W to 2300W is supplied to the RLSA 4 via the microwave supply system 9. Specifically, the microwave generated by the microwave generator 45 is propagated through the coaxial wave guide 44, in the TM mode, TE mode and/or TEM mode, and reaches the plane antenna member 42 of the RLSA 4. The microwave that has reached the plane antenna member 42 is emitted downward into the plasma generation space S1 through each slot portion 46, cover plate 13 and then discharge gas supply member 2 while it is propagated radially from the central portion toward the peripheral regions of the plane antenna member 42.
Since the cover plate 13 and the discharge gas supply member 2 are formed of aluminum oxide which is transparent to the microwave, the microwave can be transmitted well therethrough. With the slit configuration of the plane antenna member 42 as describe above, a circular polarization can be emitted uniformly over the plane of the plane antenna member 42, resulting in a uniform electric field density in the lower plasma generation space S1. Due to the energy of the microwave, uniform plasma generated from the discharge gas is excited at a high density throughout the plasma generation space S1.
The plasma generated from the discharge gas then flows into the lower processing space S2 through the holes 34 of the raw-material supply member 3, thereby activating the C5F8 gas to be supplied into the processing space S2 from the supply member 3.
Once the C5F8 gas is activated in such a manner, it is decomposed, and C4F6 ions or C4F6 radicals are generated as active species as described below, resulting in formation of film-forming species containing the C4F6 ions or C4F6 radicals at a higher content. Consequently, the film-forming species that has reached the surface of the wafer W is formed into a fluorinated carbon (CF) film. At this time, due to the bias voltage used for drawing plasma, the Ar ions contained in the discharge gas plasma are drawn toward the surface of wafer W, as such CF film portions formed at corners of a pattern on the surface of wafer W are collapsed and removed by the so-called spatter etching effect. Thus, while the distance between the respective pattern grooves is increased, the CF film is formed initially from the bottom potion of the pattern grooves, and also embedded in the pattern grooves. The wafer on which the CF film is formed in such a way is then carried out from the processing vessel 1.
As described above, if forming a fluorine-added carbon film by using the aforementioned plasma film forming apparatus which uses a C5F8 gas as a raw-material gas and utilizes the RLSA, wherein the raw material gas is changed into plasma under the conditions:
the pressure in the processing vessel is in the range of from 7.32 Pa (55 mTorr) to 8.65 Pa (65 mTorr) inclusive;
the microwave power is in the range of from 2000W to 2300W inclusive (or from 1.88W/cm2 to 2.16 W/cm2 inclusive, because the diameter of the antenna member 42 is 368 mm);
the distance L1 between the surface of wafer W and the opposed face of the raw-material gas supply member 3 is in the range of from 70 mm to 105 mm inclusive; and
the distance L2 between the surface of wafer W and the opposed face of the discharge gas supply member 2 is in the range of from 100 mm to 140 mm inclusive, a fluorine-added carbon film, which exhibits a significantly low leak current not more than 9×10−8 A/cm and has excellent heat stability, can be obtained.
This is because it can be considered that making the film forming conditions more appropriate as previously described enables to selectively generate the film-forming species containing C4F6, typically desired film-forming species, at a higher content, from the C5F8 gas used as the raw-material gas.
The raw-material gas is not limited to the C5F8 gas, but any other suitable gases of compounds, each consisting of carbon and fluorine and having a single triple bond, one or more double bonds or conjugated double bond(s), can also be used. As these gases, as shown in
Now, details of finding out the usefulness of C4F6 ions or radicals as the film-forming species for the fluorine-added carbon film will be described. First, the inventors noted that the fluorine-added carbon film obtained by using the C5F8 gas as a raw-material gas exhibits unique film qualities, such as the leak properties and heat stability, which can be controlled by the film forming conditions. In fact, measurements of the film qualities of fluorine-added carbon films obtained under various film forming conditions showed that the parameters, such as the pressure in the processing vessel, microwave power, distance L1 between the wafer W and the opposed face of the raw-material gas supply member 3 and distance L2 between the wafer W and the discharge gas supply member 2, have significantly greater impact on the film qualities of the fluorine-added carbon films.
As a result, we found that the conditions, for the CVD plasma film forming apparatus utilizing the RLSA, including: the pressure in the processing vessel is in the range of from 7.32 Pa (55 mTorr) to 8.65 Pa (65 mTorr); the microwave power is in the range of from 2000W to 2300W; the distance L1 between the surface of wafer W and the opposed face of the raw-material gas supply member 3 is in the range of from 70 mm to 105 mm; and the distance L2 between the surface of wafer W and the discharge gas supply member 2 is in the range of from 100 mm to 140 mm, are more appropriate as the film forming conditions that can ensure the preferred leak properties and heat stability for the fluorine-added carbon film to be obtained. These film forming conditions will be referred to as “the found more appropriate film forming conditions” below.
In addition, simulation, by using a computer to expect that what couplings tend to be disconnected due to exertion of energy on the C5F8 gas, was carried out, based on the coupling energy between respective atoms constituting the C5F8 gas molecule. Also, simulation was performed in the same manner, concerning further tendency of disconnection of each coupling in the resultant decomposed products. Consequently, computed results that the concentration of the C5F8 gas is relatively high when no plasma is generated, while the C4F6 ions and/or C4F6 radicals start to be generated due to decomposition of the C5F8 gas when energy is exerted on the C5F8 gas were obtained. Moreover, with gradual increase of the energy to be exerted or over time, the amount of the C4F6 ions and/or C4F6 radicals is increased gradually. Finally, we obtained computed results that further exertion of energy or further passage of time causes decomposition of the C4F6 ions and/or C4F6 radicals into C3F3 ions and/or C3F3 radicals.
Furthermore, a mass spectrometry was conducted for each of the cases of not exerting energy on the C5F8 gas and of exerting energy thereon. As a result, when the energy was not exerted on the C5F8 gas, the peak showing the C5F8 gas became greater while the peak showing existence of C4F6 and/or C3F3 was not detected. Contrary, when the energy was exerted, the peak showing the C5F8 gas became smaller while the peak showing existence of C4F6 and/or C3F3 was positively detected. Thus, it was found that the exertion of energy on the C5F8 gas causes it to be decomposed, as such decreasing its amount, while generating the C4F6 and/or C3F3 which are decomposed products of the C5F8 gas. Accordingly, the results of the simulations described above and the results of the mass spectrometry for identifying generation of the C4F6 and/or C3F3 prove together the expectation for the decomposition expressed in the graph of
Considering the above results together, the range in
If the concentration of the C5F8 is excessively high, the film forming rate becomes lower and hence the film forming time should be lengthened. Thus, the C—C couplings are increased, leading to increase of the leak current. In addition, the heat stability is deteriorated because of decomposition of the C5F8 in the film or the like. Contrary, in the case of almost no presence or complete absence of the C5F8, the concentration of the C3F3 becomes higher, thus increasing the C—C couplings and raising the leak current. In addition, the heat stability is also degraded because of tendency to be decoupled in the form of CF or the like. In fact, both of the leak properties and the heat stability are degraded under the conditions being out of “the found more appropriate film forming conditions.”
According to further optimization conducted by the inventors through various experiments within the range of “the found more appropriate film forming conditions,” it was found that the leak current can be minimized under the conditions of: the pressure in the processing vessel of 7.71 Pa (58 mTorr), the microwave power of 2300W, the distance L1 of 85 mm and the distance L2 of 100 mm. From this point, it can be considered that the film forming conditions that make the concentration of the C4F6 highest correspond to the optimum conditions P (
As described above, in the present invention, since the energy to be exerted on the C5F8 gas is made more proper by rendering the film forming conditions more appropriate, film-forming species containing the C4F6 at a higher concentration can be selectively obtained, thereby forming a fluorine-added carbon film having excellent leak properties and heat stability. By “excellent leak properties,” it is meant that the leak current is 9×10−8 A/cm or lower.
We conducted film forming processes for forming fluorine-added carbon films, under the found more appropriate film forming conditions described above, by using gases of the compounds shown in
Other than the C4F6 ions and C4F6 radicals, C4F5 ions and C4F5 radicals are also useful as the film-forming species. Thus, we conducted film forming processes for forming fluorine-added carbon films, under the found more appropriate film forming conditions described above, by using gases of the compounds shown in
As described above, irrespectively of types of the plasma film forming apparatus, by conducting a film-forming process for a fluorine-added carbon film by exerting predetermined energy on the C5F8 gas, the film-forming process utilizing film-forming species containing the C4F6 in a much more proportion than the C5F8 and C3F3 can be achieved, thereby obtaining a fluorine-added carbon film having excellent film qualities, such as the leak properties and heat stability.
As shown in
Specifically, according to the graph representing expectation of decomposition shown in
Namely, since the amount of decomposed C5F8 and the amount of generated C4F6 are equal, the crossing point between the curve representing decomposition of the C5F8 and the curve representing generation of the C4F6 corresponds to the point of time the C5F8 gas concentration is decreased to 50% of the concentration before activation.
The mass spectrometry for the fluorine-added carbon film formed under the optimum conditions P which maximizes the concentration of the C4F6 showed that the peak of the C5F8 when energy was exerted thereon was 1/10 times the peak of the C5F8 when the energy was not exerted thereon. Accordingly, the optimum conditions P correspond to the point of time the undecomposed C5F8 gas exists in the 10% proportion (or the point of time the C5F8 gas is decomposed in the 90% proportion), i.e., the point of time the C5F8 gas concentration is decreased to 10% of the concentration before activation.
It can be considered that there is almost no C5F8 gas in the range where the C4F6 is less than the C3F3, and the concentration of the C5F8 at this point of time may be 1% of less of the concentration before activation. However, since it is difficult to measure accurately such a concentration, in the present invention, the lowest limit of the C5F8 is set at 5% or higher of the concentration before activation. This condition ensures that the lowest limit is on the left side relative to the crossing point between the concentration curves of C4F6 and C3F3 in
As described above, the leak properties depend on the film forming conditions such that it is deteriorated when the processing conditions are out of “the found more appropriate film forming conditions.” Namely, the leak properties have a relation with the ratio between the C4F6 and C3F3 in the film-forming species, in which the leak current becomes greater as the concentration of the C3F3 is increased. This is because the proportion of C may be higher than F in the film-forming species, causing the insulation properties to be degraded.
Accordingly, under the optimum conditions P which maximize the amount of the C4F6, the obtained fluorine-added carbon film exhibits the minimum leak current as apparently seen from an experiment described below. Contrary, in
In this way, since the range of “the found more appropriate film forming conditions” correspond well to the leak properties, the maximum leak current can be grasped within the range of “the found more appropriate film forming conditions” by obtaining fluorine-added carbon films with changes of parameters within the range of “the found more appropriate film forming conditions” and by measuring the leak current for each obtained fluorine-added carbon film. According to the experiment described below, the maximum value of the leak current of the fluorine-added carbon film formed under conditions within the range of “the found more appropriate film forming conditions” was 9×10−8 A/cm, and the optimum value of the leak current measured under the optimum conditions P (the minimum leak current) was 8.5×10−9 A/cm. From these obtained values, we found that the leak current of the fluorine-added carbon film formed within the range of “the found more appropriate film forming conditions” is within a range of 10 times the minimum current.
As described above, what is important of this invention is to generate selectively film-forming species containing the C4F6 at a higher concentration by exerting energy, which is controlled more appropriate, on the C5F8 gas. Therefore, in an apparatus in which the energy to be exerted on the C5F8 gas is too great as in the plasma film forming apparatus utilizing the ECR, for example, the time the resultant ions or radicals exists in the form of C4F6 is too short. Eventually, the amount of the C4F6 is insufficient, rendering the formation of a fluorine-added carbon film excellent in the leak properties and heat stability quite difficult. However, in the plasma film forming apparatus utilizing the ICP (Inductive Coupling Plasma), it can be considered that the present invention is applicable.
Now, examples of experiment made for assessing the effect of the present invention will be described.
The leak current was measured in accordance with the method described above, after forming the fluorine-added carbon film with a thickness of 0.1 μm, on an 8 inch-sized wafer W, using the aforementioned plasma film forming apparatus, under the optimum conditions P which minimize the leak current, at the C5F8 gas flow rate of 200 sccm, and at the Ar gas flow rate of 300 sccm. Similarly, the leak current was measured, after forming the fluorine-added carbon film under the same conditions, except for changing the pressure in the processing vessel, so as to check the pressure properties of the leak current. The results are shown in
From the results obtained, the leak current is within the range of from 9×10−8 (A/cm) to 8.5×10−9 (A/cm) under the pressure of from 7.32 Pa (55 mTorr) to 8.65 Pa (65 mTorr), showing a significantly small value. Accordingly, it is understood that the leak current depends on the pressure in the processing vessel, and that the pressure is preferably within the range of from 7.32 Pa to 8.65 Pa. When the pressure is 6.92 Pa (52 mTorr) or less, however, it is found that the leak current becomes higher than 1×10−7 (A/cm). Such conditions can correspond to the range in which the undecomposed C5F8 gas exists in the proportion of approximately 65% as described above, and the amount of the C4F6 generated is not sufficient.
The leak current was measured in accordance with the method described above, after forming the fluorine-added carbon film, using the aforementioned plasma film forming apparatus, under the optimum conditions P, in the same manner as in the Experiment 1. In this case, the leak current was measured, after forming the fluorine-added carbon film, under the same conditions, except for changing the microwave power, so as to investigate the microwave power properties of the leak current. The results are shown in
From the results obtained, within the microwave power range of 2000W to 2300W, the leak current measured is within the range of from 8.1×10−8 (A/cm) to 8.5×10−9 (A/cm), showing a significantly small value. Accordingly, it is understood that the leak current depends on the microwave power, and that the microwave power is preferably within the range of from 2000W to 2300 W. When the microwave power is 2400W or greater, however, it is found that the leak current becomes greater than 6.5×10−7 (A/cm). Such conditions can correspond to the range in which all of the C5F8 are decomposed, thus no C5F8 exist, and in which decomposition of the C4F6 is excessively progressed to excessively elevate the concentration of C3F3, and hence the amount of the C4F6 is not sufficient.
The leak current was measured in accordance with the method previously described, after forming the fluorine-added carbon film, using the aforementioned plasma film forming apparatus, under the optimum conditions P, in the same manner as in the Experiment 1. In this case, the leak current was measured, after forming the fluorine-added carbon film, under the same conditions, except for changing the distance L1 between the surface of wafer W and the opposed face of the raw-material gas supply member 3, so as to investigate the relationship between the leak current and the distance L1. The results are shown in
From the results obtained, within the range from 70 mm to 105 mm of the distance L1, the leak current is in the range of from 9×10−9 (A/cm) to 7.3×10−8 (A/cm), exhibiting a significantly small value. Accordingly, it is understood that the leak current depends on the distance L1, and that the distance L1 is preferably within the range of from 70 mm to 105 mm.
The leak current was measured in accordance with the method described above, after forming the fluorine-added carbon film, using the aforementioned plasma film forming apparatus, under the optimum conditions P, in the same manner as in the Experiment 1. In this experiment, the leak current was measured, after forming the fluorine-added carbon film, under the same conditions, except for changing the distance L2 between the surface of wafer W and the discharge gas supply member 2, so as to investigate the relationship between the leak current and the distance L2.
From the results obtained, within the range from 100 mm to 140 mm of the distance L2, it was found that the leak current was less than 1×10−8 (A/cm), exhibiting a significantly small value. We consider that the distance L2 may have less influence on the leak current than the distance L1 described above does. However, if the distance L2 is excessively greater, there may be a risk to deteriorate the film forming speed. However, if it is set at approximately 140 mm, such deterioration of the film forming speed needs not to be considered.
The mass spectrum was measured, after forming the fluorine-added carbon film, using the aforementioned plasma film forming apparatus, under the optimum conditions P, in the same manner as in the Experiment 1, except for not generating plasma. Also, the mass spectrum was measured, under the same conditions, in the same manner, with the plasma generation. The results obtained in the case of not generating plasma are shown in
Since the factors of at least (energy)×(time) are included in the horizontal axis of
From the results, when plasma is not generated, while the peak of C5F8 is detected at the mass 219, the peak corresponding to the C4F6 or C3F3 is not seen. On the other hand, when plasma is generated, the peak of C5F8 at the mass 219 and the peak of C4F6 at the mass 169 are detected, and the peak C3F3 at the mass 100 is also detected. Furthermore, it was found that the peak of the mass 219 is approximately 1/10 times the case where the plasma was not generated.
From the above, it is understood that when the fluorine-added carbon film is formed under the optimum conditions, the C5F8 gas is decomposed while the C4F6 and/or C3F3 is generated, and that the concentration of the C5F8 gas of this case is approximately 1/10 times the case where the plasma energy is not exerted, and at this point of time, 90% of the C5F8 gas has been decomposed.
In the above mass spectroscopy, the mass spectrum was measured with L1 ions adhered to an object to be measured. Since the probability of adherence of the L1 ions varies with materials, the comparison of the abundance between different materials, such as C5F8 and C4F6, can not be applicable. However, with respect to the same material, the comparison of the abundance can be useful based on the magnitudes of respective peaks.
| Number | Date | Country | Kind |
|---|---|---|---|
| 2004-292744 | Oct 2004 | JP | national |
| 2005-276202 | Sep 2005 | JP | national |
| Filing Document | Filing Date | Country | Kind | 371c Date |
|---|---|---|---|---|
| PCT/JP05/18364 | 10/4/2005 | WO | 00 | 7/9/2008 |
