Claims
- 1. A chemical mechanical planarization apparatus comprising:a platen assembly for holding an object to be planarized; a polishing pad having a surface size at least as large as a surface size of the object, the polishing pad being movable relative to the object; and a table having a surface supporting the polishing pad, the surface including a plurality of grooves forming a patterned surface, wherein the grooves form a repeated pattern on the surface of the table, and wherein the pattern includes a plurality of platelets having the same shape and size.
- 2. A chemical mechanical planarization apparatus comprising:a platen assembly for holding an object to be planarized; a polishing pad having a surface size at least as large as a surface size of the object, the polishing pad being movable relative to the object; a table having a surface supporting the polishing pad, the surface including a plurality of grooves forming a patterned surface; and a compliant support layer between the surface of the table and the polishing pad.
- 3. The apparatus of claim 2 wherein the grooves form a repeated pattern on the surface of the table.
- 4. The apparatus of claim 3 wherein the pattern includes a plurality of platelets having the same shape and size.
- 5. The apparatus of claim 4 wherein the platelets are hexagonal.
- 6. The apparatus of claim 2 wherein the platelets are vertically compliant.
- 7. The apparatus of claim 2 wherein the surface of the table is harder than the polishing pad.
- 8. The apparatus of claim 2 wherein the compliant support layer comprises a compliant solid material.
- 9. The apparatus of claim 2 wherein the compliant support layer comprises a fluid.
- 10. The apparatus of claim 2 wherein the platen assembly comprises a compliant backing to support the object to be planarized.
- 11. The apparatus of claim 2 wherein the platen assembly is configured to rotate the object around an axis perpendicular to a surface of the object to be planarized.
- 12. The apparatus of claim 11 wherein the platen assembly is configured to rotate the object at about 18-19 rpm.
- 13. The apparatus of claim 2 wherein the grooves are about 1.5-2 inches in dimension.
- 14. The apparatus of claim 2 wherein the table comprises granite.
- 15. The apparatus of claim 2 wherein the table comprises a porous ceramic.
- 16. The apparatus of claim 2 wherein the table is rotatable around a table axis perpendicular to the surface of the table.
- 17. The apparatus of claim 16 wherein the table is rotatable at about 18-19 rpm.
- 18. The apparatus of claim 1 wherein the platelets are hexagonal.
- 19. The apparatus of claim 1 wherein the platelets are vertically compliant.
- 20. The apparatus of claim 1 wherein the surface of the table is harder than the polishing pad.
- 21. The apparatus of claim 1 wherein the platen assembly comprises a compliant backing to support the object to be planarized.
- 22. The apparatus of claim 1 wherein the platen assembly is configured to rotate the object around an axis perpendicular to a surface of the object to be planarized.
- 23. The apparatus of claim 22 wherein the platen assembly is configured to rotate the object at about 18-19 rpm.
- 24. The apparatus of claim 1 wherein the grooves are about 1.5-2 inches in dimension.
- 25. The apparatus of claim 1 wherein the table comprises granite.
- 26. The apparatus of claim 1 wherein the table comprises a porous ceramic.
- 27. The apparatus of claim 1 wherein the table is rotatable around a table axis perpendicular to the surface of the table.
- 28. The apparatus of claim 27 wherein the table is rotatable at about 18-19 rpm.
Parent Case Info
The present application is based on and claims the benefit of U.S. Provisional Patent Application Nos. 60/161,705, 60/161,830, 60/161,778, and 60/161,898 filed Oct. 27, 1999, the entire disclosures of which are incorporated herein by reference.
US Referenced Citations (12)
Provisional Applications (4)
|
Number |
Date |
Country |
|
60/161705 |
Oct 1999 |
US |
|
60/161830 |
Oct 1999 |
US |
|
60/161778 |
Oct 1999 |
US |
|
60/161898 |
Oct 1999 |
US |