Claims
- 1. A grid array package comprising:
- a die attached to one surface of a substrate;
- connection ports arranged in a first array and attached to a surface of said substrate opposite to said one surface;
- a mold compound fully encapsulating said substrate, die and portions of said first array of connection ports, said mold compound covering said one surface of said substrate, and at least a portion of said substrate surface opposite to said one surface; and
- a second array of connection ports attached to exposed portions of said first array of connection ports.
- 2. The grid array package of claim 1, wherein said second array of connection ports is an array of solder balls.
- 3. The grid array package of claim 1, wherein said array of solder balls is 60/40 Pb/Sn solder.
- 4. The grid array package of claim 1, wherein said first array of connection ports comprises:
- an array of attach pads attached to said opposite surface of said substrate; and
- an initial array of connection ports attached to said array of attach pads.
- 5. A grid array package comprising:
- a die attached to one surface of a substrate;
- connection ports arranged in a first array and attached to a surface of said substrate opposite to said one surface;
- a mold compound fully encapsulating said substrate, die and portions of said first array of connection ports, said first array of connection ports comprising:
- an array of attach pads attached to said opposite surface of said substrate; and
- an initial array of connection ports attached to said array of attach pads, wherein said array of attach pads is an array of solder attach pads and said initial array of connection ports is an array of solder attach pads; and
- a second array of connection ports attached to exposed portions of said first array of connection ports.
- 6. The grid array package of claim 4, wherein said initial array of connection ports is an array of metal bumps.
- 7. The grid array package of claim 4, wherein said initial array of connection ports is an array of gold bumps.
- 8. The grid array package of claim 4, wherein said initial array of connection ports is an array of copper-gold alloy bumps.
- 9. The grid array package of claim 1, wherein said mold compound has a flat lower surface.
- 10. The grid array package of claim 1, wherein said mold compound is epoxy novolak based.
- 11. The grid array package of claim 1, wherein said substrate is Bismaleimide Triazine resin based.
- 12. The grid array package of claim 1, wherein said substrate is FR-4 material.
- 13. A grid array package comprising:
- a die attached to one surface of a substrate;
- an array of attach pads formed on a surface of said substrate opposite to said one surface;
- an array of connection ports attached to said array of attach pads; and
- a mold compound matrix fully encapsulating said substrate, die, array of attach pads and portions of said array of connection ports, said mold compound covering said one surface of said substrate, and at least a portion of said substrate surface opposite to said one surface.
- 14. The grid array package of claim 1, wherein said mold compound fully covers said one surface and each side surface adjacent to said one surface.
- 15. The grid array package of claim 13, wherein said mold compound matrix fully covers said one surface and covers each side surface adjacent to said one surface.
- 16. The grid array package of claim 5, wherein said mold compound covers said one surface of said substrate, and at least a portion of said substrate surface opposite to said one surface.
Priority Claims (1)
Number |
Date |
Country |
Kind |
9501669-7 |
Oct 1995 |
SGX |
|
Parent Case Info
This application is a division of application Ser. No. 08/582,745, filed Jan. 4, 1996, (pending).
US Referenced Citations (3)
Number |
Name |
Date |
Kind |
5355283 |
Marrs et al. |
Oct 1994 |
|
5506756 |
Haley |
Apr 1996 |
|
5612576 |
Wilson et al. |
Mar 1997 |
|
Divisions (1)
|
Number |
Date |
Country |
Parent |
582745 |
Jan 1996 |
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